Patents Examined by Robert E. L. Sellers
  • Patent number: 6494990
    Abstract: A paper or board is coated with a composition comprising from 30-95 parts by weight of a synthetic, carboxylated surface size containing at least about 40 mole percent of hydrophobic groups and at least about 25 mole percent of carboxylated groups such as styrene/acrylic acid copolymer, and from 5-70 parts by weight of a substantially hydrophilic polyacrylamide such as a cationic or anionic polyacrylamide.
    Type: Grant
    Filed: April 29, 1999
    Date of Patent: December 17, 2002
    Assignee: Bayer Corporation
    Inventors: Rajiv Bazaj, Gerald Guerro, David Dauplaise
  • Patent number: 6491845
    Abstract: Hardeners for epoxy resins are disclosed which have the capability of curing at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. These novel hardeners include a range of reactivity which results in a range of pot lives from minutes to months. These materials co-cure readily with polyamines and have little or no amine odor. Mixture viscosity can be controlled over a wide range independent of filler concentration which allows a broad range of applications from coating and casting to adhesives. Class I hardeners contain a mixture of polyols, polyamines and tertiary amines and cure at temperatures between 20-50° C., while class II hardeners have the same polyols mixed with one or more tertiary amines and cure between 65-100° C. Class III hardeners contain the same polyols combined with either imadazole or dicyandiamide, and optionally, a tertiary amine and cure at 120° C.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: December 10, 2002
    Inventor: Richard D. Schile
  • Patent number: 6492462
    Abstract: The rheological properties of a crosslinkable resin system are modified by the presence of a side chain crystalline (SCC) polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs) in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: December 10, 2002
    Assignee: Landec Corporation
    Inventors: Steven P. Bitler, David D. Taft, Ray F. Stewart
  • Patent number: 6489380
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: December 3, 2002
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 6489429
    Abstract: There is disclosed a resin composition for electrodeposition paint comprising (A) a resin containing hydroxyl group, and (B) a polyisocyanate compound blocked with an amidoalcohol having at least one amide bond and at least one alcoholic hydroxyl group in the molecule, excellent in storage stability and capable of forming a coating film excellent in low temperature curability.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: December 3, 2002
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Shigeo Nishiguchi, Sinzi Hirato, Reijiro Nishida
  • Patent number: 6486235
    Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: November 26, 2002
    Assignee: Fujitsu Limited
    Inventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
  • Patent number: 6486256
    Abstract: A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: November 26, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Kent S. Tarbutton, Janis Robins
  • Patent number: 6485787
    Abstract: A polymeric composition exhibiting a fast cure rate composition comprises a polyfunctional urethane acrylate component; an epoxy component; and a polyfunctional amine component. The polyfunctional acrylate component and the polyfunctional amine component have sufficient functionalities such that the polyfunctional urethane acrylate component reacts with the polyfunctional component to form a secondary amine component. The secondary amine then reacts with the epoxy component such that a crosslinked polymeric material is formed.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: November 26, 2002
    Assignee: Reichhold, Inc.
    Inventors: Ling Tan, Bryan A. Naderhoff, Jeffrey H. Danneman
  • Patent number: 6482874
    Abstract: The present invention provides a method of accelerating hardening of thermosetting resin and a device therefor such that hardening time is rendered far shorter than in the case of the prior art. By way of a pertinent means, when unhardened thermosetting resin is to be disposed in an atmosphere having a specified temperature for the purpose of hardening, a ceramic plasma spraying plane is formed in at least one portion, or preferably in as large an area as possible, in the above-mentioned atmosphere whose temperature is maintained at a specified level and in which the above-mentioned resin is disposed, thereby causing convective heat existing in the hot air to be thermally converted into far infrared radiant heat radiation from the ceramic plasma spraying plane mentioned above.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: November 19, 2002
    Inventors: Shin Kiyokawa, Taro Kiyokawa
  • Patent number: 6482530
    Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: November 19, 2002
    Assignee: Showa Denko K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Patent number: 6479623
    Abstract: This invention is directed to mono- and bis-substituted oxetane monomers having fluorinated alkoxymethylene side chains, hydroxy-terminated prepolymers derived from these mono- and bis-substituted oxetane monomers and tetrahydrofuran (THF), and polymers produced from these prepolymers, as well as the synthesis processes associated with each, and the use of the monomers, prepolymers and ultimate polymers, both directly and as components of numerous compositions.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: November 12, 2002
    Assignees: Omnova Solutions, Inc,, Aerojet-General Corporation
    Inventors: Aslam A. Malik, Thomas G. Archibald, Roland P. Carlson, Kenneth J. Wynne, Edward N. Kresge
  • Patent number: 6479585
    Abstract: A powder coating composition for heat-sensitive substrates curable at a temperature of about 300° F. or below for about 30 minutes or less comprises a) from about 10-90% by weight, relative to a) plus b), of carboxylic acid functional acrylic resin(s); b) from about 10-90% by weight, relative to a) plus b), of polyepoxy resin(s); c) a first catalyst functioning as an epoxy homopolymerization catalyst; and d) a second catalyst functioning as an epoxy/carboxylic acid reaction catalyst.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: November 12, 2002
    Assignee: H. B. Fuller Licensing & Financing Inc.
    Inventors: Stephen C. Hart, Jeffrey G. Schmierer, Brian W. Carlson, Stephen C. Larson
  • Patent number: 6476160
    Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.
    Type: Grant
    Filed: July 16, 1999
    Date of Patent: November 5, 2002
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi
  • Patent number: 6472464
    Abstract: A styrene-butadiene copolymer having excellent low hysteresis loss characteristic, wet skid resistance, fracture characteristics, and abrasion resistance and a rubber composition comprising the copolymer are disclosed. The styrene-butadiene copolymer has a total styrene content in the range of 33 to 42% by weight of the styrene-butadiene copolymer; a content of styrene sequences having 4 to 20 styrene units in the range of 40 to 65% by weight of the total styrene content, as obtained by measurements by NMR and GPC; a content of styrene sequences having more than 20 styrene units in the range of 5% by weight or less of the total styrene content, as obtained by measurement by GPC; a content of vinyl unit in the range of 30% by mol or less of a butadiene part of the styrene-butadiene copolymer; a sum of the total styrene value and ½ of the content of vinyl units in the range of 46 to 52%; and an inner or end structure having, for example tin-carbon bond.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: October 29, 2002
    Assignee: Bridgestone Corporation
    Inventors: Koichi Morita, Hajime Kondo, Yoichi Ozawa
  • Patent number: 6472085
    Abstract: A multi-component composite coating composition comprising a base coat deposited from a pigmented film-forming composition and a transparent top coat applied over the base coat in which the base coat is a thermosetting composition comprising a co-reactable solid, particulate mixture of (i) an epoxy functional polymer containing at least one of the polymer chain structures -[(M)p-(G)q]x- or -[(G)q-(M)p]x- wherein M is an oxirane-free residue of at least one ethylenically unsaturated monomer, G is a glycidyl-functional ethylenically unsaturated monomer, p and q each independently has a value of 0 to typically less than 100, and x has a value of at least 1 to typically less than 100, the total value of p, q and x selected such that said epoxy functional polymer has a number average molecular weight of at least 250, and (ii) a co-reactant having functional groups reactive with the epoxy groups of (i).
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: October 29, 2002
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Karen A. Barkac, Simion Coca, James R. Franks, Kurt A. Humbert, Paul H. Lamers, Roxalana L. Martin, James B. O'Dwyer, Kurt G. Olson, Daniela White
  • Patent number: 6469074
    Abstract: Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2) a dihydrazide compound and (F) a silicone resin gel, wherein at least one of components A and B is liquid at room temperature, component E1 is liquid at room temperature, and the weight ratio of component C to the total weight of the composition, the weight ratio of component A to component B, and the weight ratio of component E1, E2 or F to the total weight of the composition except component C each ranges a specific ratio.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: October 22, 2002
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hirohisa Hino, Taro Fukui, Kenji Kitamura, Shinji Hashimoto, Naoki Kanagawa
  • Patent number: 6469107
    Abstract: An ion-conductive polymer electrolyte composition comprising a polymeric polyol such as polyglycidol or a derivative thereof, an ion-conductive salt and a crosslinkable functional group-bearing compound is used to prepare an ion-conductive solid polymer electrolyte having a high ionic conductivity and a semi-interpenetrating polymer network structure.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: October 22, 2002
    Assignee: Nissihinbo Industries, Inc.
    Inventor: Takaya Sato
  • Patent number: 6469108
    Abstract: A naphthalene derivative, binaphthalene derivative and biphenyl derivative, all having an oxetane group, capable of being cationically polymerized and a cationically curable compound containing a naphthalene derivative having an oxetanyl group and an aromatic compound having an epoxy group or an oxetanyl group.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: October 22, 2002
    Assignee: Toagosei Co., Ltd.
    Inventors: Akira Kuriyama, Naokazu Ito, Tetsuya Suzuta, Takashi Tsuda
  • Patent number: 6465601
    Abstract: Compounds active as accelerators for curable epoxy and polyurethane systems, those compounds having been prepared by means of a transamination reaction by reacting (a) a substituted phenolic compound (Mannich base) having at least one substituent of formula R1(R2)N—CH(R3)—  (A), wherein R1 and R2 are each independently of the other linear or branched C1-4alkyl and R3 is hydrogen, methyl, ethyl or phenyl, with (b) a compound of formula R4(R5)N—CnH2n—(NH—CnH2n)q—NH2  (B), wherein R4 and R5 are each independently of the other C1-C6alkyl or together form a radical of formula —(CH2)5— or —(CH2)2—O—(CH2)2—, n is an integer from 2 to 5 and q is zero, 1, 2 or 3, and the compound obtained or the compounds present in the mixture obtained has/have on average, per molecule, at least one substituent of formula (R4)(R5)N—CnH2n—(NH—CnH2n)q—NH—CH(R3)—, and the use of those compounds as acceler
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: October 15, 2002
    Assignee: Vantico Inc.
    Inventors: Rolf Wiesendanger, Walter Fischer, Bryan Dobinson
  • Patent number: 6465606
    Abstract: A polyether monoamine containing from about 36 to about 44 ethylene oxide units and from about 1 to about 6 propylene oxide units is useful as a reactant with functionalized polypropylene such as maleated polypropylene to form a reaction product blended with polypropylene.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: October 15, 2002
    Assignee: Huntsman Petrochemical Corporation
    Inventors: Randall Keith Evans, Richard J. G. Dominguez, Richard J. Clark