Patents Examined by Robert J. Lilling
  • Microencapsulated platinum-group metals and compounds thereof
    Patent number: 4874667
    Abstract: Platinum-group metals and compounds thereof are microencapsulated within one or two layers of thermoplastic organic polymers. The layer or layers are deposited using known prior art microencapsulation techniques. The microcapsules can be incorporated into storage-stable one-part polyorganosiloxane compositions that cure by a platinum-catalyzed hydrosilation reaction.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: October 17, 1989
    Assignee: Dow Corning Corporation
    Inventors: Chi-Long Lee, Robin L. Willis, Jr.