Abstract: The present disclosure is directed to a method for in-situ cleaning one or more components of a gas turbine engine using an abrasive gel detergent. More specifically, the gel detergent includes a plurality of abrasive particles suspended in a gel composition. Further, the abrasive particles include organic material. Moreover, the gel composition is formed of a mixture of detergent particles dissolved in a gel reactant. Thus, the method includes injecting the gel detergent into at least a portion of the gas turbine engine at a predetermined pressure. In addition, the method includes allowing the gel detergent to flow across or within one or more of the components of the gas turbine engine so as to clean one or more of the components.

Abstract: The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

Abstract: A surfacing apparatus supported adjacent a substantially vertical surface of a structure for applying an even and uniform texture to the surface of the structure using a selectively adjustable force exerted on a texturing means to engage the surface of the structure. The surfacing apparatus is suited for horizontal and vertical movement in controlled prescribed paths under controlled and prescribed pressure from the adjustable tensioning means.

Abstract: According to one embodiment of the present disclosure, provided is a method of calibrating a relationship among a pressure command value, a pressure in an air-bag, and a pressure read value of the air-bag in a substrate polishing apparatus, the substrate polishing apparatus including: a polishing table; the air-bag configured to press a substrate against the polishing table, the pressure for pressing the substrate being variable; and a pressure control unit configured to control the pressure in the air-bag in accordance with the pressure command value inputted to the pressure control unit, and read the pressure in the air-bag.

Abstract: A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.

Abstract: A skate sharpening system comprises an adjustor assembly and a skate holder assembly. A runner is releasably coupled to a template runner, and then clamped into the skate holder assembly. The template runner defines a pre-defined profile for the blank runner. An operator moves the skate holder assembly such that the template runner moves along a guide bearing of the adjustor assembly. The guide bearing is disposed proximate a grinding wheel. While the template runner remains in contact with the adjustable guide bearing, the runner remains in contact with, and moves along, the grinding wheel such that the grinding wheel simultaneously sharpens and contours the runner.

Abstract: An apparatus for abrading a surface is provided. The apparatus includes: a framework with a motor housed therein; a chassis housing a drivetrain, the drivetrain including a drive pulley operative connected to the motor, a plurality of tool assembly pulleys, a belt operatively connecting the drive pulley and the plurality of tool assembly pulleys; a plurality of tool assemblies operatively connected to the drive pulley and the plurality of tool assembly pulleys, each tool assembly including: a tool holder, a tool plate comprising a tool segment with an abrading surface, wherein the tool holder and tool plate are detachably connected by a plurality of equidistantly spaced pins, wherein the number of pins is a multiple of three.

Abstract: An airfoil masking tool constructed to protect the leading edge, trailing edge and tip of an airfoil during polishing of the airfoil. A method of polishing an airfoil using the masking tool.

Abstract: A system for screening deburring media during deburring operations of a hardware part comprises a deburring machine comprising a media slurry basin, a deburring media slurry disposed in the media slurry basin, and a media screening device freely movable within the deburring media slurry to define a dynamic zone of capture to capture noncompliant media. The media screening device can comprise a housing defining an inner chamber, and can comprise a plurality of openings each sized to restrict compliant deburring media from passing through the opening, and each opening sized to permit passage of noncompliant deburring media into the inner chamber. Each opening can comprise a counterbore. The media screening device can comprises at least one removable housing body removably coupled to the housing to facilitate removal of captured noncompliant deburring media. A method is disclosed for screening deburring media during deburring of a hardware part.

Abstract: A sharpening apparatus that may be used by a relatively unskilled person to simultaneously sharpen the two opposed cutting edges of a knife blade by hand and to maintain a sharpened cutting edge along the blade with minimal effort and training is provided by the invention. The apparatus comprises a panel member with a slot partially extending from its top edge, and a pair of sharpening steels that are pivotably mounted to the panel member to swing downwards in a crossed relation across the slot. A pair of counterweights or leaf springs biases the sharpening steels into their standby position. When the knife blade is moved down through the slot, it comes into contact with crossed sharpening steels to bow them outwards under tension applied by the leaf springs.

Abstract: The wire saw device includes at least one wire, which is provided tightly to be capable of travelling in a direction crossing a workpiece to be cut, a workpiece holder, which is configured to hold the workpiece and to move the workpiece relative to the wire, slurry suppliers, which are configured to supply slurry to cut the workpiece from an upstream side in a travelling direction of the wire, and slurry collectors, which are configured to collect the slurry scattered due to contact with the workpiece. The slurry collector is configured to be movable in conjunction with the workpiece in the state where the slurry collector is disposed adjacent to the workpiece and also configured to be retractable with respect to the workpiece to be prevented from contacting the wire.

Abstract: An object is to provide a single-wafer processing single-side polishing method and a single-wafer processing single-side polishing apparatus, which increase the flatness of a semiconductor wafer and reduce variations in flatness. The single-wafer processing single-side polishing method includes a polishing step of polishing a semiconductor wafer; and a shifting step of transferring the semiconductor wafer from a polishing plate to a tray outside the polishing plate, moving the relative position of the semiconductor wafer and the polishing head in the rotation direction of the polishing head, and then holding the semiconductor wafer with the polishing head. The polishing step is performed a plurality of times, and the shifting step is performed at least once between the plurality of polishing steps.

Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing three dimensional semiconductor or memory substrates comprising a polishing layer of a polyurethane reaction product of a thermosetting reaction mixture of a curative of 4,4?-methylenebis(3-chloro-2,6-diethylaniline) (MCDEA) or mixtures of MCDEA and 4,4?-methylene-bis-o-(2-chloroaniline) (MbOCA), and a polyisocyanate prepolymer formed from one or two aromatic diisocyanates, such as toluene diisocyanate (TDI), or a mixture of an aromatic diisocyanate and an alicyclic diisocyanate, and a polyol of polytetramethylene ether glycol (PTMEG), polypropylene glycol (PPG), or a polyol blend of PTMEG and PPG and having an unreacted isocyanate (NCO) concentration of from 8.6 to 11 wt. %. The polyurethane in the polishing layer has a Shore D hardness according to ASTM D2240-15 (2015) of from 60 to 90, a shear storage modulus (G?) at 65° C.

Abstract: A rare earth magnet block is cutoff machined into pieces by rotating a plurality of cutoff abrasive blades. Improvements are made by starting the machining operation from the upper surface of the magnet block downward, interrupting the machining operation, turning the magnet block upside down, placing the magnet block such that the cutoff grooves formed before and after the upside-down turning may be aligned with each other, and restarting the machining operation from the upper surface of the upside-down magnet block downward until the cutoff grooves formed before and after the upside-down turning merge with each other.

Abstract: A polishing object is prevented from slipping out without depending on the process type or the polishing condition.

Abstract: The present disclosure relates to an ingot slicing apparatus, including an ingot moving apparatus provided to be movable vertically and supply an ingot, a wire rotating apparatus provided to be movable horizontally to slice the ingot, a slurry supply unit provided to supply slurry to the slicing apparatus, and an air supply unit provided to supply air to the slicing apparatus and to adjust a supplying amount of the slurry supplied to the slicing apparatus.

Abstract: A cutting disk for a machine tool for the cutting and/or grinding of workpieces, in particular consisting of materials such as cellulose or wood, includes a disk-shaped main body that has a radially inside receiving region and a radially outside work zone. The radially outside work zone includes at least one first active region and at least one second active region. The first active region and the second active region each have at least one cutting element that is configured as a cutting grain or as a cutting tooth. The second active region rises radially or protrudes radially in relation to the first active region.

Abstract: Vibratory treatment apparatus including a first receptacle arranged to receive media for vibratory treatment of the article, the first receptacle defining a first aperture; and a first valve positioned at the first aperture of the first receptacle, the first valve being arranged to allow passage of the article there through and to prevent the flow of media through the first aperture.

Abstract: An apparatus and method for refinishing a tapered surface of a machine tool component. The apparatus includes a head defining at least three tapered segments which are configured to conform precisely to the taper of the machine tool component being refinished. Each segment includes a surface for receiving an abrasive strip, the surfaces configured to conform and confront a conical surface of a taper to be refinished. The head is adapted to engage the tapered surface of the machine tool component so that upon rotation of the head, the abrasive strips abrade the conical surface of the component. A head for refinishing a spindle bore includes three outwardly extending segments whereas the head for refinishing a tool holder shank surface includes three segments extending between annular portions, each segment having an inner tapered surface for receiving the abrasive strips.

Abstract: The invention provides a brush bristle and a brush roll that exhibit a suitable abrasive force and that can reduce or eliminate the abrasion of a mill roll as much as possible. The brush bristle is for use in a brush roll B configured to scour a mill roll for rolling a metal sheet S, and includes one or more monofilaments 2 made of a thermoplastic resin containing abrasive particles. The abrasive particles have a hardness lower than the hardness of the mill roll, and higher than the hardness of the metal sheet S.