Abstract: An improved VLSI device package and an improved method for contacting VLSI devices, in which the occurrences of wire bond shorts and lead voltage drops are substantially reduced, are obtained by providing multiple lead levels in the package, with the N.sub.2 leads on the upper lead level grouped into N.sub.3 bunches separated by N.sub.4 spaces, where each of the N.sub.4 spaces aligns with a bonding target on a corresponding one of the N.sub.1 leads on the lower level leads of the package, and where N.sub.1 <N.sub.2, preferably N.sub.1 .ltoreq.20 to 30% of N.sub.1 +N.sub.2. Wire bonds from the device to the N.sub.1 lower level leads align with the bonding targets, so that wire bonds from the device to the N.sub.2 upper level leads lie in clear corridors between the bonds to the N.sub.1 lower level leads. In this way wire bond crossovers and shorts are avoided. The N.sub.1 lower level leads can be made wide and short and are used for the high current connections.

Abstract: An electromechanical assembly is comprised of: a printed circuit board, a backplane, first and second passages that extend completely through the backplane, ground and power conductors on the backplane that respectively border the passages, ground and power pins on the board that extend in a cantilevered fashion past the board by relatively long and relatively short distances for sliding through the passages in a sequential fashion while engaging the bordering ground and power conductors.

Abstract: Copper alloys are disclosed which may be bonded to aluminum containing members with reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper. The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds. The copper alloys of the instant invention have particular utility in integrated circuit assemblies as lead frames, lead wires and beam lead tapes.