Abstract: A cable holding structure includes: an elastic member (23) having through holes (23h) through which cables (18) are passed; and a fixing portion (21, 22) having openings (21h, 22h) through which the cables are inserted, and disposed on a vehicle body-side member (19) to fasten the elastic member. The cables inserted through the through holes are restrained by the elastic member subjected to a fastening force.

Abstract: In a printed circuit board (1) comprising a plurality of insulating layers and conductive layers, and comprising at least one cavity (7) at least one electromagnetic coil (8) is arranged on an outer layer (4) of the printed circuit board (1) and cooperates with a permanent magnet (6) arranged inside the at least one cavity (7).

Abstract: A channel to be coupled to an input of a receiver, the channel including: a first transmission line including: a first trace; and a first reference plane including a plurality of first pattern voids overlapping the first trace.

Abstract: A laminated electronic component includes: a rectangular parallelepiped-shaped stacked body including dielectric layers and internal electrode layers which are alternately laminated; and a pair of first conductors and a pair of second conductors which are disposed on an outer surface of the stacked body. The first conductors are disposed in portions which include centers of long sides of a first principal surface which is positioned in a direction of lamination of the dielectric layers and the internal electrode layers of the stacked body, and do not include a vertex of the stacked body so as to extend from first side surfaces to the first principal surface. The second conductors are disposed on second side surfaces, and the first conductors and the second conductors are spaced apart from each other on an outer surface and electrically connected to each other via the internal electrode layers.

Abstract: A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern.

Abstract: A printed wiring board includes an insulating sheet, a conductive layer formed on one main surface of the insulating sheet, and an insulating film laminated with an adhesive layer on the main surface of the insulating sheet formed with the conductive layer. The position of an end part of the insulating film is located outside the position of an end part of the adhesive layer.

Abstract: A cover for an electrical connector comprises a cylindrical disc including a first cover surface, an opposite second cover surface, and a barrel surface extending between the first cover surface and the second cover surface. The first cover surface has a convex form. In a state in which the cover is mounted on the electrical connector, the first cover surface forms a portion of an outer surface of the electrical connector and the second cover surface faces an inner side of the electrical connector.

Abstract: A wire harness, comprising a tube-shaped exterior member and one or multiple conductive paths to be inserted into and protected by the exterior member. The exterior member includes a flexible tube part having a flexible bellows tube shape and a straight tube part not having the flexible bellows tube shape. The one or multiple conductive paths are straightly wired into the straight tube part and the straight tube part is continuous with the flexible tube part. A continuous portion of the flexible tube part and the straight tube part includes multiple reinforcement shape portions which are capable of withstanding stress concentration in the continuous portion and are arranged in a tube outer peripheral direction of the exterior member.

Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

Abstract: An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

Abstract: A cable connection structure includes a cable assembly that fixes a plurality of cables, and a mounting member connected to the cable assembly. The plurality of cables includes: core wires having core wire exposed portions where the core wires are exposed at distal ends of the plurality of cables; and jackets, each of which is formed of an insulator and covers each of the core wires. The mounting member includes a plurality of external connection electrodes to which the core wires are to be connected. The cable assembly includes a first cable fixing portion that is formed of an insoluble resin insoluble in organic solvents or alkali and that fixes the core wire exposed portions. The core wires are exposed on an end face of the first cable fixing portion and are connected to the plurality of external connection electrodes using a conductive material.

Abstract: A multilayer capacitor and a board having the same includes external electrodes and internal electrodes. The external electrodes include connection portions formed on a mounting surface of a capacitor body and band portions formed on side surfaces of the capacitor body, and the internal electrodes include body portions overlapping each other and lead portions extended from the body portions to the mounting surface of the capacitor body, to thereby be connected to the connection portions of the external electrodes. The body portions are formed to be spaced apart from virtual lines connecting distal ends of the connection portions and distal ends of the band portions to each other.

Abstract: An electric power sensor includes a sensor pad and an electric terminal. The sensor pad includes a flexible substrate that defines a first surface and a second surface that opposes the first surface. Additionally, the sensor pad includes an electrically-conductive layer applied to the first surface of the flexible substrate. The sensor pad further includes an adhesive layer applied to the second surface of the flexible substrate. The electric terminal is coupled to the electrically-conductive layer of the sensor pad.

Abstract: A printed wiring board includes a conductor layer including a conductor circuit, a resin insulating layer formed on the conductor layer and having a via opening reaching to the conductor circuit of the conductor layer, and a via conductor formed in the via opening of the resin insulating layer such that the via conductor is connecting to the conductor circuit of the conductor layer. The conductor circuit of the conductor layer has a first conductor portion and a second conductor portion integrally formed such that the first conductor portion is connected to the via opening of the resin insulating layer, that the second conductor portion is surrounding the first conductor portion and that the first conductor portion has a thickness which is greater than a thickness of the second conductor portion.

Abstract: A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.

Abstract: A cable routing structure includes a plurality of cables that are superposed on one another and that are movable relatively to one another in length directions thereof, and a line length difference housing case that contains parts of the plurality of cables and is movable in a reciprocating direction. The line length difference housing case absorbs differences in line length among the plurality of cables generated in accordance with a moving position of the line length difference housing case.

Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.

Abstract: In one embodiment, provided is a connector comprising: a body; a first protrusion formed on a first surface of the body; a first groove formed on the first surface of the body to be adjacent to the first protrusion, and of which the shape includes the inverse of the first protrusion; a first terminal of which at least a portion is arranged to correspond to the first protrusion; and a second terminal of which at least a portion is arranged to correspond to the first groove.

Abstract: An electronic device and an electronic circuit board thereof is disclosed. In the electronic circuit board an insulation substrate is provided with conductive pads, first conductive vias, second conductive vias, third conductive vias, first conductive traces, second conductive traces, and third conductive traces. The conductive pads are arranged in two rows. Each row includes biasing pads and signal pads. The second conductive vias and the third conductive vias are respectively arranged inside and outside the first conductive vias. Each of the signal pads arranged in a row nearest the second conductive vias electrically connects with one second conductive via through a first conductive trace. Each of the signal pads arranged in a row nearest the third conductive vias electrically connects with one third conductive via through a second conductive trace. The third conductive traces embedded in the insulation substrate are extended to positions vertically under the signal pads.