Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

Abstract: A plasma processing apparatus includes a processing chamber in which plasma processing is performed on a wafer, a DP that reduces a pressure in the processing chamber via an evacuating pipe connected to the processing chamber, a TMP that performs evacuation such that a degree of vacuum of the processing chamber becomes a high degree of vacuum, and a stage on which the wafer is placed. Further, the plasma processing apparatus includes a He evacuating pipe that is a flow channel of a heat-transfer gas that transfers heat of the stage subjected to temperature adjustment to the wafer, a first gas supplying mechanism that supplies a gas to a portion of the evacuating pipe which is exposed to atmosphere, during venting a processing chamber to atmosphere, and a control device that controls the first gas supplying mechanism. The control device is provided to communicate with the evacuating pipe.

Abstract: An embodiment of the present disclosure provides a cleaning robot and a control method thereof. The cleaning robot includes: a chassis; a fluid applicator, carried on the chassis and configured to distribute a cleaning fluid on at least part of a cleaning width; a fluid storage apparatus, detachably connected to the chassis, wherein the fluid storage apparatus is in communication with the fluid applicator and configured to apply the cleaning fluid distributed by the fluid applicator to a floor; and a control unit, carried on the chassis and configured to control the fluid applicator to stop distributing the cleaning fluid in a case that a to-be-cleaned area of the floor reaches a preset value.

Abstract: Provided are a deposition mask cleaning apparatus and a deposition mask cleaning method. The deposition mask cleaning apparatus includes a treated water bath containing treated water in which a deposition mask is immersed; a treated water generation part supplying the treated water to the treated water bath; a treated water supply pipe connecting the treated water bath and the treated water generation part; and a bubble generation part disposed in the treated water supply pipe and generating bubbles in the treated water. The treated water includes at least one of ozone water, hydrogen water, ammonia hydrogen water, and carbonated water. The bubbles include at least one of microbubbles having a bubble diameter of about 50 ?m or less and nanobubbles having a bubble diameter of about 1 ?m or less.

Abstract: Provided is a cleaning device including a suction port; at least one sensor configured to sense at least one object; a driver configured to open or close the suction port; a memory storing at least one instruction; and a processor configured to execute the at least one instruction stored in the memory. The processor executes the at least one instruction to sense at least one object within an area to be cleaned by the cleaning device by controlling the at least one sensor, identify a relative location of the sensed at least one object with respect to the cleaning device, determine at least a partial area within an entire area of the suction port as an open/close target area, based on the identified relative location of the at least one object, and open or close the open/close target area by controlling the driver.

Abstract: First and second concentration measurement parts (415, 425) are provided in first and second supply liquid lines (412, 422) in which first and second supply liquids flow, respectively. A dissolved concentration of gas in the second supply liquid is lower than that in the first supply liquid. In the first and second supply liquid lines, respective one ends of first and second branch lines (51, 52) are connected to respective positions on the upstream side of the concentration measurement parts. The other ends of the first and second branch lines are connected to a mixing part (57), and by mixing the first and second supply liquids, a processing liquid is generated. Respective flow rate adjustment parts (58) of the first and second branch lines are controlled on the basis of respective measured values of the first and second concentration measurement parts so that the dissolved concentration of the gas in the processing liquid can become a set value.

Abstract: A cleaning system and method can include a cleaning device including a soaking tank configured to accommodate cleaner; and a filtering device configured to filter a first substance being a mixture of the cleaner and mask residue in the soaking tank. The filtering device includes a sucking apparatus including an sucking port for sucking the first substance; a spraying apparatus, including a spraying port oriented a region that the sucking port is capable of sucking in a bottom of the soaking tank, the spraying port being configured to spray liquid or gas to flush the bottom of the soaking tank; and a filtering apparatus connected to the sucking apparatus to receive and filter the first substance sucked by the sucking port.

Abstract: A curable composition on a substrate is cured in a state where a member is in contact with the curable composition. Thereafter, the member having adhered to the curable composition is separated from the substrate, whereby the curable composition and a particle are removed from the substrate.

Abstract: A beverage maker and a method for operating a beverage maker are provided, wherein the. beverage maker includes a discharge channel having a sensor configured to detect a cleaning agent in water and a control unit configured to receive measured values from the sensor and to take the received measured values as a basis for regulating a water intake from the water source. The method includes regulating water intake from the water source based upon the measured values from the sensor in the dis-charge channel to ensure that only an amount of water necessary for re-moving remaining cleaning agent from the beverage maker is utilized for flushing.

Abstract: A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.

Abstract: To treat parts printed by means of 3D printing from the powder bed, they are inserted into a trough belt conveyor which transports and circulates the parts and in which the parts are acted on by a fluid jet during the transport.

Abstract: An apparatus for cleaning a semi-rigid, three-dimensional vehicle mat can include a first set of compliant rollers spaced from one another and a second set of compliant rollers spaced from one another that cooperatively grab and advance the mat toward one or more brushes that scrub debris from above and/or below the mat. One or more of the compliant rollers can deform a distance radially toward an axis of rotation when contacting the mat to accommodate the contours of the mat and still grab the mat for advancing. The apparatus can include a holding pan that supports the mat so it is accessible through a second opening below the brushes and a first opening of a frame that supports the rollers and brushes. A deflector can be included to reroute the mat downstream of the brushes along a pathway toward the pan. A related method of use also is provided.

Abstract: This disclosure is generally directed to systems and methods related to washing a vehicle in a car wash. In an example method, a car wash controller in a car wash detects a vehicle inside a bay of the car wash and selects a piece of equipment for washing a certain portion of the vehicle. Selecting the equipment may be based on an amount of dirt present on the portion of the vehicle, which can be, for example, a front portion, a rear portion, a side portion, a roof, or an underbody of the vehicle. The car wash controller may query a driver of the vehicle to determine a detergent preference. A car wash system computer in the vehicle may specify an amount of water to be used for washing the vehicle. The car wash controller washes the portion of the car using the detergent and the specified amount of water.

Abstract: A method for cleaning a substrate with pattern structures comprises the following steps: using gas-liquid atomization to clean a substrate surface (601); using TEBO megasonic to clean the substrate surface (602); and drying the substrate (603). The TEBO megasonic cleaning is used to remove small size particles on the substrate and the gas-liquid atomization cleaning is used to remove large size particles on the substrate. The method enables achieving an effect of cleaning the substrate without or with less device damage. A substrate cleaning apparatus is also provided.

Abstract: The present invention is in the field of chemical cleaning and surface treatments for a stainless steel substrate. In particular, the present invention provides a method, kit and use of specific solutions for removing and preferably preventing the formation of rouging (e.g. class I, II and/or III) on a stainless steel substrate, which may be used as processing station or production unit.

Abstract: A cleaning device includes a tank configured to contain a cleaning liquid and one or more substrates in the cleaning liquid. A megasonic transducer array is coupled to the tank and configured to direct megasonic frequency waves to surfaces of the substrates. Multiple pairs of ultrasonic transducers are also coupled to the tank and configured to direct ultrasonic frequency waves to surfaces of the substrates. The megasonic transducer array includes a support plate with a plurality of megasonic transducers and a central plane that extends perpendicular to the support plate. The multiple pairs of ultrasonic transducers are arranged in a mirror symmetric manner on opposite sides of the central plane.

Abstract: Among other things, a method is disclosed which includes the following: acquiring at least one set of acceleration data indicative of a progression of measured acceleration values; determining status data indicative of a process step within a cleaning program performed by a dishwasher; outputting or causing the output of the determined status data. Further revealed is a device for executing and/or controlling this method, a system with one or more devices for executing and/or controlling this method and a computer program for executing and/or controlling this method by employing a processor.

Abstract: A cleaning method is provided. In the cleaning method, residues of elements of a group for a common semiconductor material in a chamber are removed with plasma of a halogen-containing gas. Residues of metal elements of groups 12 and 13 and groups 14 and 15 in the chamber are removed with plasma of a hydrocarbon-containing gas. A C-containing material in the chamber is removed with plasma of an O-containing gas. Further, the removing with the plasma of the halogen-containing gas, the removing with the plasma of the hydrocarbon-containing gas, and the removing with the plasma of the O-containing gas are performed in that order or the removing with the plasma of the hydrocarbon-containing gas, the removing with the plasma of the O-containing gas, and the removing with the plasma of the halogen-containing gas are performed in that order X times where X?1.

Abstract: An on-line automatic cleaning apparatus of slit extrusion type coating die for lithium battery and a method associated therewith are provided. The cleaning apparatus includes: a die lip, a coating steel roller, and a cleaning mechanism disposed therebetween. The cleaning mechanism includes a cleaning chamber which includes elongated sealing strips and a flow-guiding arc groove. Front and rear ends of the cleaning chamber are connected to an inlet sealing plate and an outlet sealing plate respectively. The flow-guiding arc groove is in contact with and presses upper and lower sloped surfaces of the die lip through the elongated sealing strips to seal and thereby define a closed cleaning tunnel. The inlet and outlet sealing plates are in contact with and press two ends of the closed cleaning tunnel respectively for circumferential sealing. An inlet and an outlet are connected to pipes having solenoid valves installed thereon.

Abstract: The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanism 100 includes a first support part 110 which is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support part 120 which supports the other surface of the substrate W, and a first support part moving part 140 which swings the first support part 110.