Patents Examined by Shawki S. Ismail
  • Patent number: 11637503
    Abstract: A frequency converter adapted to be connected to another frequency converter via a direct current bus is provided. The frequency converter comprises: a positive bus interface adapted to be interconnected with a positive bus interface of the other frequency converter; an external bleeder resistor interface adapted to be interconnected with an external bleeder resistor interface of the other frequency converter; and a first control logic which controls a parallel connection, between the frequency converter and the other frequency converter and realized by a direct current bus, to be turned on or off. A corresponding frequency converter assembly, a control method, and a computer readable storage medium are also provided.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: April 25, 2023
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Ya Jun Zhou
  • Patent number: 11637232
    Abstract: An acoustic wave device includes a piezoelectric substrate made of LiNbO3 or LiTaO3 and including first and second main surfaces that face each other, a functional electrode provided on the first main surface of the piezoelectric substrate to excite acoustic waves, and a Li2CO3 layer provided on the second main surface of the piezoelectric substrate.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 25, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Osawa, Masaki Tsutsumi, Masahiro Fukushima
  • Patent number: 11636972
    Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: April 25, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Naoki Gouchi, Hirotaka Fujii, Kazutaka Muraoka
  • Patent number: 11631800
    Abstract: In a non-limiting embodiment, a device may include a substrate, and a hybrid active structure disposed over the substrate. The hybrid active structure may include an anchor region and a free region. The hybrid active structure may be connected to the substrate at least at the anchor region. The anchor region may include at least a segment of a piezoelectric stack portion. The piezoelectric stack portion may include a first electrode layer, a piezoelectric layer over the first electrode layer, and a second electrode layer over the piezoelectric layer. The free region may include at least a segment of a mechanical portion. The piezoelectric stack portion may overlap the mechanical portion at edges of the piezoelectric stack portion.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: April 18, 2023
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Jia Jie Xia, Ranganathan Nagarajan, Bevita Kallupalathinkal Chandran, Miles Jacob Gehm
  • Patent number: 11631520
    Abstract: An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: April 18, 2023
    Assignee: Eaton Intelligent Power Limited
    Inventors: Yipeng Yan, Dengyan Zhou, Jinliang Xu, Jin Lu
  • Patent number: 11626226
    Abstract: A magnetic assembly structure has a main body and an inserting component. A first receiving slot of the main body receives a first magnetic component, and a second receiving slot of the main body penetrates a main body surface to form a main body opening on the main body surface. An engagement slot of the main body is disposed between the first receiving slot and the second receiving slot, communicated with the second receiving slot, and has a contacting surface being away from the main body surface with a distance. The receiving slot of the inserting component receives a second magnetic component. The inserting component is inserted into the second receiving slot via the main body opening, and the second magnetic component moves into the engagement slot. The magnetic assembly is assembled with a less force, has higher safety, and is hard to be disassembled without allowance or explanations.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: April 11, 2023
    Assignee: TAIWAN OASIS TECHNOLOGY CO., LTD.
    Inventor: Wei-Long Lee
  • Patent number: 11623246
    Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: April 11, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Emad Mehdizadeh, Bongsang Kim, Chienliu Chang, Leonardo Baldasarre, Nikhil Apte, Xiaoyue Jiang, Mei-Lin Chan
  • Patent number: 11621136
    Abstract: A relay includes a movable contact piece having a first movable contact and a second movable contact, a first fixed terminal having a first fixed contact, a second fixed terminal having a second fixed contact, a drive device configured to move the movable contact piece, and the wall portion disposed inside the first fixed contact and the second fixed contact in a longitudinal direction. At least a part of the wall portion is disposed at a position beyond the first fixed contact and the second fixed contact toward the movable contact piece in a moving direction of the movable contact piece. The movable contact piece has a shape so as to avoid the wall portion in a contact state where the first movable contact is in contact with the first fixed contact and the second movable contact is in contact with the second fixed contact.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: April 4, 2023
    Assignee: OMRON CORPORATION
    Inventors: Shingo Mori, Ryota Minowa, Yasuo Hayashida, Naoki Kawaguchi, Kohei Otsuka, Hiroyuki Iwasaka
  • Patent number: 11621654
    Abstract: A vibration-wave motor includes a vibrator having two protruding parts, a holding member configured to hold the vibrator, a movable member configured to translationally move together with the holding member, a rotating unit configured to allow the holding member to rotate around each of three axes relative to the movable member and to restrict the holding member from translating in each of the three axes relative to the movable member, a urging member configured to urge the holding member and the movable member so that the holding member and the movable member translationally move together, and a restricting unit configured to restrict the holding member from rotating around the rotating unit as a center by the urging member.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 4, 2023
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Kazuhiro Noguchi
  • Patent number: 11612912
    Abstract: An ultrasound transducer in which a plurality of pMUT cells are arranged. The pMUT cells have a plurality of resonance frequencies. Each of the pMUT cells includes a piezoelectric film that is polarized in a first direction that is a thickness direction or a second direction that is opposite to the first direction.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: March 28, 2023
    Assignee: KONICA MINOLTA, INC.
    Inventors: Kenji Suzuki, Yuta Nakayama
  • Patent number: 11615932
    Abstract: The present disclosure provides a pluggable connecting device for a contactor and a contactor, the contactor including a housing, a coil framework located inside the housing, the coil framework provided with a first and a second connecting sheet, and an electromagnetic coil wound on the coil framework, two ends of the electromagnetic coil electrically connected to the first and second connecting sheets. The pluggable connecting device includes an insulated connecting member, and a first and second conductive elements which are fixedly connected with the insulated connecting member. The first conductive element is provided with an insertion end and a wiring end which are arranged oppositely, the second conductive element is provided with an insertion end and a wiring end which are arranged oppositely, and the insertion ends of the first and second conductive elements are configured for connection with the first and second connecting sheets respectively in a pluggable manner.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: March 28, 2023
    Assignee: Eaton Electrical Ltd.
    Inventors: Luming Zhang, Guoyong Ping, Zhenzhen Yin, Zhengning Hu
  • Patent number: 11610713
    Abstract: A coil device comprising, the core body having a coil core part and a core bottom face, and a coil part forming spiral conductive pathway around the coil core part. A metal electrode is formed at the core bottom face, and the wire ends which are the conductive pathway of the coil part are formed at the metal electrode, and a part of the surface of the metal electrode is covered by the conductive resin electrode.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: March 21, 2023
    Assignee: TDK CORPORATION
    Inventors: Katsumi Kobayashi, Kouyu Ohi
  • Patent number: 11610727
    Abstract: A coil component 100 includes a first coil element 111 and a second coil element 112 each formed in an angular-tubular shape and disposed in parallel by winding and laminating a single flat wire 101 in one direction with edgewise-winding between one end portion 101A and another end portion 101B and bending the wound and laminated coil into two, and includes an interconnection part 113 for connecting the both elements. The interconnection part 113 includes a coil element winding end portion side raised part 123A, a coil element winding start portion side raised part 123B, and an intermediate part 123C extended between the two raised parts 123A and 123B.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: March 21, 2023
    Assignee: SUMIDA CORPORATION
    Inventor: Hiroshi Kawashima
  • Patent number: 11611283
    Abstract: A switching power supply unit includes: a transformer; an inverter circuit including first to fourth switching devices, first to third capacitors, first and second rectifying devices, a resonant inductor, and a resonant capacitor; and a driver. The first to fourth switching devices are coupled in series. The first and second capacitors are coupled in series. The first rectifying device is disposed between a first connection point between the first and second capacitors and a second connection point between the first and second switching devices. The second rectifying device is disposed between the first connection point and a third connection point between the third and fourth switching devices. The third capacitor is disposed between the second and third connection points. The resonant capacitor, the resonant inductor, and a primary winding are coupled in series between a fourth connection point between the second and third switching devices and the first connection point.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: March 21, 2023
    Assignee: TDK CORPORATION
    Inventors: Masahiko Hirokawa, Xiaofeng Wu, Naoyuki Ishibashi
  • Patent number: 11610718
    Abstract: An inductor that is configured to store energy in a magnetic field includes a wire and a core. The wire is configured to deliver electrical current to the inductor to generate the magnetic field. The core is disposed radially about the wire. The core comprises magnetic particles that are suspended in a non-magnetic matrix. The magnetic particles are arranged such that a magnetic permeability of the core increases in a direction that extends radially outward from the wire along a cross-sectional area of the magnetic core from a first region that is adjacent to the wire to a second region that is adjacent to an outer periphery of the magnetic core.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: March 21, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Wanfeng Li, Chuanbing Rong, Michael W. Degner
  • Patent number: 11606023
    Abstract: A discharge device is provided. The discharge device discharges an internal power of an electronic device. The discharge device includes a voltage regulation circuit, a charge storage circuit, a control signal generator and a discharge path. The voltage regulation circuit regulates the internal power to a regulated power. The charge storage circuit stores the regulated power. The control signal generator is configured to receive the regulated power and an external power, enabled according to the regulated power, and generating a control signal in response to a voltage level of the external power. The discharge path is configured to receive the internal power, and turned on according to the control signal to discharge the internal power.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: March 14, 2023
    Assignee: Winbond Electronics Corp.
    Inventor: Ying-Ting Ma
  • Patent number: 11600438
    Abstract: An inductor includes an element containing a magnetic metal powder and a resin, a coil that includes a winding portion and paired extended portions extended from both ends of the winding portion and that is embedded in the element, a pair of an external terminal electrically connected to one of the extended portions and an external terminal electrically connected to the other of the extended portions, and a conductive layer disposed on a surface of the element that crosses the winding axis of the coil. The conductive layer includes a first metal layer formed by fusing together the magnetic metal powder near the surface of the element and a second metal layer formed by plating on the first metal layer. The electrical resistivity of the second metal layer is lower than the electrical resistivity of the first metal layer.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: March 7, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Jianxin Sheng
  • Patent number: 11600419
    Abstract: A magnetic assembly structure has a main body and an inserting component. A first engagement slot of the main body receives a first magnetic component, and a first receiving slot of the main body penetrates a main body surface to form a main body opening on the main body surface. The first engagement slot and the first receiving slot are communicated with each other. The inserting component is inserted into the first receiving slot via the main body opening, and the first magnetic component moves into the first magnetic component receiving slot of the inserting component. The magnetic assembly is assembled with a less force, has higher safety, and is hard to be disassembled without allowance or explanations.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: March 7, 2023
    Assignee: TAIWAN OASIS TECHNOLOGY CO., LTD.
    Inventors: Wei-Long Lee, Shih-Meng Liao
  • Patent number: 11590536
    Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: February 28, 2023
    Assignees: PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.
    Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
  • Patent number: 11587723
    Abstract: A reactor includes: an outer peripheral iron core; three leg iron cores; and three coils, each of the coils having an input side coil end and an output side coil end projecting from a same end surface on an end side in the axial direction of the three leg iron cores, where the three coils include two first coils in which a projecting position of the input side coil end and a projecting position of the output side coil end has a first relative positional relationship and include one second coil having a second relative positional relationship opposite to the first relative positional relationship and where winding directions from the input side coil end to the output side coil end of the first and the second coils are reversed to each other.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: February 21, 2023
    Assignee: FANUC CORPORATION
    Inventors: Tomokazu Yoshida, Masatomo Shirouzu, Kenichi Tsukada