Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.

Abstract: The present application provides a display device comprising: a display panel including a display region and a non-display region, wherein the non-display region includes first and second fan-out regions and a bending region; an optical functional film layer formed in the display region and the first fan-out region; an adhesive layer formed on the optical functional film layer; and a protective layer located in the bending region and with a gap with the optical functional film layer, and an end of the adhesive layer extends beyond the optical functional film layer and is connected to the protective layer, and the adhesive layer covers the optical functional film layer, the gap, and part of the protective layer.

Abstract: A hybrid double-sided power switch module comprises a double PCB assembly with switch dies and conductive spacers disposed at both sides of the double PCB assembly in different topologies. The gate connections of the switch dies are enhanced by spring pins soldered in the THVs formed through the PCBs in alignment with the gate terminals. MFCs are positioned at both sides of the double PCBs assembly in contact with the tops of the switch dies and conductive spacers with fuzz buttons serving as contacts between the MFCs and the switch dies and spacers. MFCs serve different functions including AC bus-bars, DC bus-bars, heat-sinks, and their combination. The module can withstand external stress and is fabricated by a simplified and inexpensive process requiring only two solder pastes.

Abstract: A method for installing an offshore installation is provided, the method including: a) providing a pipe for connecting the offshore installation with another offshore installation or an onshore installation; b) arranging an electrical cable inside the pipe; c) determining a level at or above the seabed, wherein the pipe includes a first portion arranged below the determined level and a second portion arranged above the determined level, and wherein the electrical cable is arranged inside the pipe so as to form a gap with an inner wall of the pipe along the first and second portion; d) determining an amount of cooling liquid such that, when the cooling liquid has a first temperature, the cooling liquid fills the gap along the first portion of the pipe, wherein the second portion of the pipe is free of the cooling liquid, and when the cooling liquid cools the electrical cable.

Abstract: A wire harness that includes an electric wire including a core wire and an insulation coating that covers an outer circumference of the core wire; an electromagnetic shield that surrounds an outer circumference of the insulation coating; a connection terminal that is electrically connected to an end of the core wire; a connector housing that holds the connection terminal and is made of a synthetic resin; a shielding pipe that extends from an inside to an outside of the connector housing in a protruding manner; and a fixing member that fixes an end of the electromagnetic shield to an outer circumferential surface of a portion of the shielding pipe that is disposed outside the connector housing in an electrically connected state.

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Abstract: This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.

Abstract: Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.

Abstract: A stretchable circuit board according to an embodiment comprises: a substrate including one surface and the other surface opposite to the one surface; an electronic component disposed on the one surface of the substrate; and a wiring electrode disposed on the one surface of the substrate and connecting the electronic component, wherein the substrate includes an effective area, in which the electronic component is formed, and an ineffective area other than the effective area and includes a pattern part which is formed in the ineffective area and extends through the substrate from one surface to the other surface thereof.

Abstract: A communications cable is provided that includes a pair of twisted pair of wires, each coated with a fluoropolymer insulator. The twisted pair of wires is configured to carry a differential signal, such as a differential data signal and/or a differential power signal. The fluoropolymers are highly effective insulators and significantly reduce both the effects of internal and external electromagnetic interference while maintaining low cable attenuation, even when operating within a temperature range of ?40° C. to 150° C.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: Provided are a busbar unit and a method of manufacturing thereof configured to prevent an increase in resistance at a connection portion therebetween, to provide a good connection condition, and to easily achieve even a complicated wiring structure, in the case of connecting between a busbar and a pre-welded member (a terminal, another busbar, or the like) made of a metal material different from that of the busbar. A busbar unit includes a busbar made of a first metal material, and a welded member made of a second metal material to be connected to an end portion of the busbar. A welded portion between the end portion of the busbar and the welded member is configured by pressure welding between end surfaces butted against each other.

Abstract: A backlight module and a display device is disclosed. The backlight module includes a backplate, a light board framework, and assembled light board arranged in sequence. The assembled light board include multiple light boards with a seam formed between adjacent light boards. The light board framework is arranged on the backplate and includes a main body defining multiple mounting grooves provided in a number equal to the number of the light boards in the assembled light board. Each of the light boards is installed in one of the mounting grooves. A supplementary light-emitting diode (LED) is disposed between adjacent mounting grooves to supplement light for the seam between every two adjacent ones of the light boards.

Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits. Some embodiments of the multi-cell converter comprise integrated secondary-side switching devices comprising control circuitry that monitors circuit conditions to determine when the switching device is to be ON and OFF, thereby eliminating the need for secondary-side switch control signals and signal buses, primary-to-secondary interface circuitry and centralized drive circuitry.

Abstract: A chip on film, a display panel, and a method of manufacturing the display panel are provided. The chip on film includes a flexible film and a driver chip. The flexible film includes at least a first group of lines and a second group of lines. M lines of the first group of lines are electrically connected to pins of the driver chip to form driver lines; and N lines of the second group of lines are not electrically connected to any pin of the driver chip, serving as nominal lines. By arranging the nominal lines, a conventional bonding machine may be applied to bond the chip on film to the display substrate. Costs for modifying the bonding machine may be reduced, and application scenarios of the chip on film may be increased.

Abstract: A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

Abstract: A support for mounting an accessory equipment assembly with one or more accessory equipment units, such as current transformer units, to a base of a bushing includes a conductor surrounded by an insulator part such that each of the accessory equipment units is positioned in a defined way regarding the conductor, wherein said support includes aligning means for aligning each individual accessory equipment unit separately with respect to the conductor. A corresponding accessory equipment module includes an accessory equipment assembly with one or more accessory equipment units, such as current transformer units, and a support for mounting the accessory equipment assembly as well as a bushing unit including a bushing and said kind of accessory equipment module.

Abstract: Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.

Abstract: [Object] The present invention provides a joined conductor and a method for manufacturing a joined conductor that can improve electrical conductivity between conductors.

Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.