Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.

Abstract: A lead-free free-cutting corrosion-resistant silicon-bismuth brass alloy, including the following: between 60.0 and 65.0 wt % of Cu, between 0.6 and 1.8 wt % of Si, between 0.2 and 1.5 wt % of Bi, between 0.02 and 0.5 wt % of Al, less than 1.5 wt % of Ni+Mn+Sn, between 0.01 and 0.5 wt % of La—Ce alloy, between 0.002 and 0.02 wt % of B, with the remainder being Zn and inevitable impurities, wherein the total amount of impurities are no more than 0.5 wt %.

Abstract: A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.

Abstract: The present invention provides a steel material able to secure a superior corrosion resistance in a sulfuric acid dew point corrosive environment of exhaust gas obtained by burning high S-containing fuel, containing, by mass %, C: ?0.010%, Si: ?0.10%, Cu: 0.05 to 1.00%, P: ?0.030%, S: ?0.050%, and Al: ?0.10% and comprising a balance of Fe and unavoidable impurities. Further, this steel contains one type or two types or more of Sb, Sn, Cr, Mn, Mo, Ni, Nb, V, Ti, and B.

Abstract: A dezincification-resistant copper alloy and a method for producing a product containing the same are proposed by the present invention. The dezincification-resistant alloy of the present invention contains 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces.

Abstract: The present invention provides a spring steel that has superior hardenability, undergoes less pitting in a corrosive environment, and can achieve higher stress and toughness. More specifically, the present invention provides a high-strength and high-toughness spring steel with improved hardenability and pitting resistance, containing, in mass percent, 0.40 to 0.70% carbon, 0.05 to 0.50% silicon, 0.60 to 1.00% manganese, 1.00 to 2.00% chromium, 0.010 to 0.050% niobium, 0.005 to 0.050% aluminum, 0.0045 to 0.0100% nitrogen, 0.005 to 0.050% titanium, 0.0005 to 0.0060% boron, no more than 0.015% phosphorus and no more than 0.010% sulfur, the remainder being composed of iron and unavoidable impurities, the steel having a tensile strength of at least 1700 MPa in 400° C. tempering after quenching and a Charpy impact value of at least 40 J/cm2 for a 2 mm U-notched test piece of JIS Z 2202 and the parameter Fce being at least 1.70.

Abstract: The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5?Ni/Co?about 2.

Abstract: An austenitic heat resistant alloy, which contains, by mass percent, C?0.15%, Si?2%, Mn?3%, Ni: 40 to 80%, Cr: 15 to 40%, W and Mo: 1 to 15% in total content, Ti?3%, Al?3%, N?0.03%, O?0.03%, with the balance being Fe and impurities, and among the impurities P?0.04%, S?0.03%, Sn?0.1%, As?0.01%, Zn?0.01%, Pb?0.01% and Sb?0.01%, and satisfies the conditions [P1=S+{(P+Sn)/2}+{(As+Zn+Pb+Sb)/5}?0.050], [0.2?P2=Ti+2Al?7.5?10×P1], [P2?9.0?100×O] and [N?0.002×P2+0.019] can prevent both the liquation crack in the HAZ and the brittle crack in the HAZ and also can prevent defects due to welding fabricability, which occur during welding fabrication, and moreover has excellent creep strength at high temperatures. Therefore, the alloy can be used suitably as a material for constructing high temperature machines and equipment, such as power generating boilers, plants for the chemical industry and so on.

Abstract: Magnesium-based alloy wire excelling in strength and toughness, its method of manufacture, and springs in which the magnesium-based alloy wire is utilized are made available. The magnesium-based alloy wire contains, in mass %, 0.1 to 12.0% Al, and 0.1 to 1.0% Mn, and is provided with the following constitution. Diameter d that is 0.1 mm or more and 10.0 mm or less; length L that is 1000 d or more; tensile strength that is 250 MPa or more; necking-down rate that is 15% or more; and elongation that is 6% or more. Such wire is produced by draw-forming it at a working temperature of 50° C. or more, and by heating it to a temperature of 100° C. or more and 300° C. or less after the drawing process has been performed.

Abstract: A conventional low-temperature solder containing Pb or Cd had problems with respect to environmental pollution. A conventional low-temperature lead-free solder had a liquidus temperature which was too high for low heat resistance parts having a heat resistance temperature of 130° C., or it was brittle or had low mechanical strength. A lead-free low-temperature solder according to the present invention comprises 48-52.5 mass % of In and a balance of Bi, and most of the structure is constituted by a BiIn2 intermetallic compound which is not brittle. Zn or La can be added in order to further improve solderability, and a small amount of P can be added to prevent corrosion at high temperatures and high humidities.

Abstract: A lead-free brass material exhibiting excellent forgeability and dezincification resistance is provided. The brass material includes 61.0 to 63.0 wt % of Cu, 0.5 to 2.5 wt % of Bi, 1.5 to 3.0 wt % of Sn, 0.02 to 0.10 wt % of Sb, and 0.04 to 0.15 wt % of P, with the balance being substantially Zn. The brass material is a lead-free, free-cutting alloy which can be suitably applied to forging and which exhibits excellent mechanical properties and dezincification resistance without substantially subjecting the brass material to a heat treatment after forging.

Abstract: The present invention provides a ferritic stainless steel casting and a sheet thereof excellent in deep drawability, punch stretchability and ridging resistance and a method for producing the casting and the sheet. In the present invention, a chemical composition is controlled so that the amounts of C, N, Si, Mn, P and Ti may be reduced to the utmost for securing high workability and, on the basis of the chemical composition, the roping and ridging of a steel sheet product is reduced by adding Mg, thus dispersing Mg containing oxides that accelerate the formation of nuclei for solidification and, resultantly, suppressing the development of coarse columnar crystals in a casting. The present invention is characterized in that the average composition of the Mg containing oxides dispersing in a casting satisfies the following expressions <2> and <3>, 17.4(Al2O3)+3.9(MgO)+0.3(MgAl2O4)+18.7(CaO)?500??<2>, (Al2O3)+(MgO)+(MgAl2O4)+(CaO)?95??<3>.

Abstract: The present disclosure relates to a glass forming alloy. The glass forming alloy may include 43.0 atomic percent to 68.0 atomic percent iron, 10.0 atomic percent to 19.0 atomic percent boron, 13.0 atomic percent to 17.0 atomic percent nickel, 2.5 atomic percent to 21.0 atomic percent cobalt, optionally 0.1 atomic percent to 6.0 atomic percent carbon, and optionally 0.3 atomic percent to 3.5 atomic percent silicon. Furthermore, the glass forming alloy includes between 5% to 95% by volume one or more spinodal glass matrix microconstituents which include one or more semi-crystalline or crystalline phases at a length scale less than 50 nm in a glass matrix. In addition, the glass forming alloy is capable of blunting shear bands through localized deformation induced changes under tension.

Abstract: The present invention provides a lead-free brass alloy, including 0.3 to 0.8 wt % of aluminum, 0.01 to 0.4 wt % of bismuth, 0.05 to 1.5 wt % of iron and more than 96 wt % of copper and zinc, wherein the copper is present in an amount ranging from 58 to 75 wt %. The brass alloy of the present invention meets the standard of the environmental regulation, wherein the lead content is less than 0.25 wt % based on the weight of the alloy. Further, the brass alloy of the present invention has 0.05 to 1.5 wt % of iron and less than 0.4% of bismuth, so as to lower production cost, eliminate cracks and increase production yield.

Abstract: A magnesium alloy, comprising: Y: 0.5-10? Zn: 0.5-6?? Ca: 0.05-1?? Mn: ??0-0.5 Ag: 0-1 Ce: 0-1 Zr: 0-1 or Si: 0-0.4, wherein the amounts are based on weight-percent of the alloy and Mg, and manufacturing-related impurities constitute the remainder of the alloy to a total of 100 weight-percent. Also disclosed is a method for manufacturing such an alloy and a biodegradable implant formed therefrom.

Abstract: A rolled copper foil consisted of at least either of silicon (Si) and iron (Fe), boron (B), silver (Ag), oxygen (O) of 0.002 mass % or less, and a balance consisted of copper (Cu) and inevitable impurities.

Abstract: A method of manufacturing a sheet of a copper-based alloy containing controlled amounts of Ni, Sn, P, optionally Zn and Fe, Co, Mg, Ti, Cr, Zr, and Al with the remainder being Cu and unavoidable impurities, comprising the steps of cold rolling followed by annealing at least one time of an ingot of the copper-based alloy, thereafter performing intermediate cold rolling, which is a cold rolling process before final cold rolling process, performing annealing with controlled temperature and time to obtain sheet with a grain size of 20 ?m or less, performing final cold rolling at a percent reduction Z to meet the following Formula 0.8×(100?10X?Y)<Z<100?10X?Y, where Z is percent cold reduction, X is Sn content, and Y is the total content (wt.%) of all elements other than Sn and Cu, and performing low-temperature annealing at a temperature below the recrystallization temperature.

Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.

Abstract: A pearlescent pigment (100) includes: a flaky substrate (10); a titanium dioxide layer (20) that is formed on the flaky substrate (10); and an oxazoline compound layer (40) that is formed on the titanium dioxide layer (20) with the titanium dioxide layer (20) being interposed between the flaky substrate (10) and the oxazoline compound layer (40), and serves as a top surface of the pearlescent pigment (100).

Abstract: The present invention relates to a lead-free, bismuth-free free-cutting phosphorous brass alloy and its method of manufacture. The alloy comprises: Cu; Zn; 0.59 to 1.6 wt % P; and other elements in the amount of 0.005 to 0.6 wt %, which comprise at least two elements selected from the group consisting of Al, Si, Sb, Sn, Rare earth element (RE), Ti and B, and the balance being unavoidable impurities. The phosphorous brass alloy contains a combined wt % of Cu and Zn of between 97.0 wt % and 99.5 wt %, within which the content of Zn is above 40 wt %. Considering the solid solubility of P in the matrix of copper will be decreased rapidly with the temperature decrease and form the brittle intermetallic compounds Cu3P with Cu, the present invention relies upon P to ensure excellent cuttability of the invented alloy. The invented alloy is reasonably priced, and has excellent cuttability, castability, hot and cold workability, dezincification corrosion resistance, mechanical properties and weldability.