Abstract: A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.

Abstract: A method of processing a SiC ingot includes a resistance value measuring step of measuring an electric resistance value of an end face of the SiC ingot, a laser beam output adjusting step of adjusting the output of a laser beam according to the electric resistance value measured in the resistance value measuring step, and a peeling belt forming step in which, while a laser beam of such a wavelength as to be transmitted through the SiC ingot is being applied to the SiC ingot with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be formed, the SiC ingot and the focal point are put into relative processing feeding in an X-axis direction to form a belt-shaped peeling belt in the inside of the SiC ingot.

Abstract: The disclosure relates to a method for welding sheets provided with an aluminum silicon anti-corrosion coating, wherein chronologically before the welding, the aluminum silicon layer on the sheets in the region of the weld joint and the underlying intermetallic interlayer between the base material and the anti-corrosion coating is passed over with a laser and as a result, on the one hand, material of the aluminum silicon layer and the underlying intermetallic interlayer is vaporized and aspirated and on the other hand, a reaction with the base material extending into the base material is produced so that a metallic reaction ablation layer or alloying ablation layer is produced, which has iron and possibly alloying elements from the base material and aluminum silicon from the aluminum silicon layer and the intermetallic interlayer, the reaction layer reaching a thickness of 5 ?m to 100 ?m.

Abstract: A method of forming a vaporizer of an electronic vaping device includes applying a porous material to at least one surface of a heating element to form a coating thereon. The heating element is formed of a conductive material.

Abstract: In various embodiments, laser beams of two different wavelengths are utilized, sequentially and/or simultaneously, to process workpieces in various processing stages such as melting, piercing, cutting, and welding.

Abstract: Disclosed is a method for cutting dielectric or semiconducting material with a laser. The method includes the following steps: emission of a laser beam including at least one burst of N femtoseconds laser pulses; spatial separation of the laser beam into a first split beam having a first energy, and respectively, a second split beam having a second energy; spatial concentration of energy of the first split beam in a first zone of the material, respectively, of the second split beam in a second zone of the material, the first zone and the second zone being separate and staggered by a distance dx; and adjustment of the distance between the first zone and the second zone in such a way as to initiate a straight micro-fracture oriented between the first zone and the second zone.

Abstract: An apparatus for drying and/or roasting beans, such as cocoa beans, or parts of beans, such as nibs, includes a frame, a drum for receiving the (parts of) beans, rotatably mounted in the frame and provided with an inlet for a fluid, in particular a gas, such as heated air, a fan for feeding the fluid via the inlet to the drum, and a drive for rotating the drum. The fluid inlet and the drive are located on the same end of the drum.

Abstract: Embodiments of the invention include a method for manufacturing sensors and circuit structures. The method can include providing a substrate including a layer of polymer capable of producing graphite in response to the application of energy, a first electrode adjacent to a first via location on the layer of polymer, and an insulating layer over at least a portion of the first electrode and the layer of polymer at the first via location; and applying sufficient energy to the layer of polymer at the first via location through the insulating layer to ablate the insulating layer and to form a first via as mass of graphite that extends into electrical contact with the first electrode and is surrounded by the insulating layer in a plane of the insulating layer.

Abstract: Disclosed herein are a drip coffee machine and a liquid discharge device used therefor including: a liquid providing module having a discharge pipe discharging liquid to coffee beans; a rotation module having an actuator generating rotational force, a driven gear rotated by receiving the rotational force, and a base plate rotated by being connected to the driven gear, the base plate being configured to move the discharge pipe along a rotation trajectory when rotated; and a translation module including a translation drive unit having an elastic pull member elastically deflecting the discharge pipe along a translation trajectory, an adjustment cam installed to be rotatable with respect to the base plate to adjust the position of the discharge pipe elastically deflected within the translation trajectory by the elastic pull member in the one direction or the other direction opposite to the one direction and having its outer circumferential surface in contact with the discharge pipe, and an intermediate unit trans

Abstract: The invention relates to a laser processing machine (11) with a laser processing head (12), with a support grate (16) that defines a support plane (A) for supporting a workpiece (8) to be processed, with a fluid supply device (21) and with a fluid removal device (31). The fluid supply device (21) and fluid removal device (31) are designed to generate a fluid flow (27) under the support plane (A) of the support grate (16). The fluid supply device (21) can be moved with the laser processing head (12).

Abstract: A liquid dispensing system, a liquid flow control assembly or member and a liquid dispenser. Preferably, the liquid dispensing system includes a single hot water tank. A liquid flow control assembly operably connected to the hot water tank is configured to direct only water from an upper portion of the hot water tank to a flavored beverage brewer (e.g., coffee or tea brewer) so that the flavored beverage is at an optimal elevated temperature when dispensed. The liquid flow control assembly or member is further configured to mix water from an upper portion of the hot water tank with water from a lower portion of the hot water tank and provide the water mixture to a hot water dispensing nozzle or outlet of the liquid dispenser to reduce the temperature of the water directed to the hot water dispensing nozzle or outlet.

Abstract: There is provided a laser processing method for performing laser processing on a wafer having a functional layer on a substrate. The laser processing method includes a blackening step of emitting a pulsed laser beam of a wavelength transparent to the functional layer from a laser oscillator and blackening the functional layer by irradiating the functional layer with the pulsed laser beam of energy equal to or higher than a processing threshold value at which the functional layer is processed such that an overlap ratio of the pulsed laser beam successively applied to the functional layer is equal to or more than 90% and less than 100%, and a groove processing step of forming a laser-processed groove by irradiating the blackened functional layer with the pulsed laser beam and making the blackened functional layer absorb the pulsed laser beam, after performing the blackening step.

Abstract: An annealing apparatus includes: a main body configured to receive a substrate; a microwave generating unit configured to generate microwaves to be transmitted to the main body; an incidence unit configured to transmit the microwaves from the microwave generating unit to the main body; and a diffraction unit disposed between the incident unit and the main body. The diffraction unit is configured to pass the microwaves therethrough before they are transmitted to the main body.

Abstract: A cooking assembly can include a cooking vessel, a mixer, and a motor. The cooking vessel can include a bottom contact portion including a first bore therethrough, a heating portion spaced above the bottom contact portion and including a second bore therethrough, and a sidewall connected to the heating portion and together with the heating portion configured to retain food in the cooking vessel. The mixer can be located within the cooking vessel, where the mixer configured to rotate relative to the heating portion. The motor can be connected to the mixer via the first bore and the second bore to drive the mixer to rotate.

Abstract: A method for cutting off at least one portion, in particular a wafer, from a solid body is contemplated. The method includes: modifying the crystal lattice of the solid body by means of a modifier, wherein a number of modifications are produced to form a nonplanar, in particular convex, detachment region in the interior of the solid body, wherein the modifications are produced in accordance with predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the portion and a defined further treatment of the portion, detaching the portion from the solid body.

Abstract: A grain-oriented electrical steel sheet according to an embodiment of the present invention includes: a groove on a line formed on one surface of an electrical steel sheet in a direction crossing a rolling direction; and a thermal shock portion on a line formed on one surface of the electrical steel sheet in the direction crossing the rolling direction, wherein a distance between the groove and the thermal shock portion is 1 mm or less.

Abstract: An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.

Abstract: A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.

Abstract: A wireless induction heating cooker is configured to operate on an induction heating apparatus. The wireless induction heating cooker includes a main body, an internal pot configured to be disposed in the main body, a plurality of receiving coils disposed at a bottom surface of the main body and arranged along a circumferential direction of the internal pot, and a plurality of lateral surface heating coils spaced apart from the bottom surface of the main body and arranged along a lateral surface of the internal pot. Each of the plurality of lateral surface heating coils is connected to one of the plurality of receiving coils that is disposed at an opposite side with respect to a reference line passing through the bottom surface of the main body.

Abstract: An egg peeler that is configured to separate an egg shell of a hard-boiled egg from the white of the egg. The egg peeler includes a receptacle having a cavity and a lid. The receptacle has a side wall including at least one continuous annular shoulder configured to help crush and separate an egg shell of an egg from the egg white when vigorously shaken. The egg peeler is effective, easy to use, inexpensive, and comprises only two parts and thus very easy to manufacture and package.