Patents Examined by Stephen E. Jones
  • Patent number: 10389329
    Abstract: A multilayer electronic component includes a multilayer body including insulator layers that are stacked, linear conductor traces each provided between adjacent ones of the insulator layers, and via conductors. A helical or substantially helical inductor is provided in the multilayer body. When viewed in the stacking direction of the multilayer body, all of the linear conductor traces, except a portion of one linear conductor trace, are superimposed within an annular or substantially annular linear conductor trace region. The portion of the one linear conductor trace is displaced inwardly from the annular or substantially annular linear conductor trace region.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: August 20, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Shiokawa
  • Patent number: 10381707
    Abstract: Embodiments of the present disclosure use customizable waveguides that can be positioned next to each other in a structure that contains one single flange to provide a physical connection for the waveguides. In this fashion, many waveguides can be positioned within a small area to accommodate a tightly packed patch antenna array so that the waveguides can be positioned very close to the socket. As such, embodiments of the present disclosure allow more waveguides to be packed into a small area by providing a single structure that houses many waveguides and share only a single flange connection element that can be sized appropriately.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: August 13, 2019
    Assignee: ADVANTEST CORPORATION
    Inventors: Don Lee, Daniel Lam, Roger Mcaleenan, Kosuke Miyao
  • Patent number: 10381702
    Abstract: A coaxial radio frequency (RF) isolator is disclosed. The isolator includes a first connector that conducts an RF signal received from a first device connected to the isolator. The isolator also includes a conductive body including a second connector and a conductive outer shield that form a first internal cavity. The isolator further includes a dielectric sleeve between the outer shield and the conductive body. In addition, the isolator includes a conductive coupling/filtering member inside the outer shield and the dielectric sleeve. The conductive coupling/filtering member has a cylindrical shape forming a second internal cavity. Moreover, the isolator includes a thru-RF signal transmission path through the first internal cavity and the second internal cavity. The thru-RF signal transmission path receives the RF signal from the first device, conditions the RF signal, and outputs the RF signal to a second device.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: August 13, 2019
    Assignee: PPC BROADBAND, INC.
    Inventor: Erdogan Alkan
  • Patent number: 10374281
    Abstract: Aspects of the subject disclosure may include, a system having an absorber and a coupling device. The absorber includes absorbent material that absorbs radiation. The coupling device is positioned in and surrounded by the absorber. The coupling device facilitates transmitting or receiving of an electromagnetic wave along a transmission medium, where the electromagnetic wave propagates along the transmission medium without requiring an electrical return path. Other embodiments are disclosed.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: August 6, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III
  • Patent number: 10374578
    Abstract: An ā€˜Lā€™ shaped dynamically configurable impedance matching circuit is presented herein. The circuit can include a series element and a shunt element. The shunt element in the L-shaped impedance matching circuit can be moved or modified based on the impedance of the circuit elements in electrical communication with each side of the impedance matching circuit. Thus, in some cases, the impedance matching circuit may be a flexible circuit that can be dynamically modified based on the environment or configuration of the wireless device that includes the impedance matching circuit.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 6, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: William J. Domino, Stephane Richard Marie Wloczysiak
  • Patent number: 10365430
    Abstract: A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 30, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho, Feng-Yuan Hu
  • Patent number: 10348266
    Abstract: An impedance conversion circuit includes an auto-transformer circuit including a first inductor connected between a first port connected on a power supply portion side and a second port connected on an antenna side and a second inductor connected between a third port that is grounded and the second port; a first phase shifter with a first end connected to the first port; an inductor connected in series between a second end of the first phase shifter and the power supply portion; and a capacitor connected in series to the inductor and connected in series between the second end of the first phase shifter and the power supply portion.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: July 9, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuichiro Teshima, Kenichi Ishizuka
  • Patent number: 10348267
    Abstract: An impedance matching device comprising a variable reactor having a main winding and control winding, wherein a generated magnet field in the core is an AC magnetic field with a magnitude exceeding a value to settle a deviation between a control target value for impedance matching and a feedback value, by changing the magnitude of the generated magnetic field by changing a control current passing through the control winding, thereby controlling inductance of the variable rector to be a predetermined value to perform impedance matching, the response delay in the impedance matching is reduced by reducing a response delay in the inductance variation of the variable reactor.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: July 9, 2019
    Assignee: KYOSAN ELECTRIC MFG. CO., LTD.
    Inventors: Itsuo Yuzurihara, Satoshi Aikawa, Sadao Mori, Tadaharu Ohno
  • Patent number: 10348273
    Abstract: A hybrid digital electronic tuner (HDET) uses a modified forward signal power injection technique, a variance of a prior art Gamma Boosting Unit (GBU) technique, cascaded with a digital, PIN diode based, electronic tuner, all integrated in the same low loss parallel plate airline (slabline) to create a compact hybrid tuner unit able of generating thousands of high reflection factors (|Gamma|?1) at millisecond tuning speed.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: July 9, 2019
    Inventor: Christos Tsironis
  • Patent number: 10345422
    Abstract: A compact harmonic tuner system uses a two-carriage harmonic slide-screw impedance tuner employs, single and dual frequency band metallic disc probes travelling along and rotating diametrically inside the same slabline, which therefore is only one half, instead of full, the wavelength long at the minimum frequency of operation. Using disc probes allows probe control operation without high precision vertical axes, as well as high resolution in the area where the gap between center conductor and probe is small (high GAMMA), a smooth increase of proximity between probe and center conductor and the possibility to compensate for the negative phase slope at higher GAMMA, native to traditional slide screw tuners using vertically moving square probes (slugs).
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: July 9, 2019
    Inventor: Christos Tsironis
  • Patent number: 10340876
    Abstract: A high performance integrated tunable impedance matching network with coupled merged inductors. Embodiments include a combination of merged multiport constructively coupled spiral inductors and tunable capacitors configured to reduce insertion losses, circuit size, and optimization time while maintaining a high Q factor for the coupled spiral inductors. Some embodiments integrate one or more filter circuits with a tunable impedance matching network, useful in conjunction with such applications as radio frequency power amplifiers.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: July 2, 2019
    Assignee: pSemi Corporation
    Inventors: Chih-Chieh Cheng, Tero Tapio Ranta, Richard Bryon Whatley, Vikram Sekar
  • Patent number: 10340889
    Abstract: A method of and an apparatus for reducing noise in a non-Foster circuit having at least a pair of cross coupled transistor devices, each transistor device of the pair of cross coupled transistor devices having a pair of current carrying electrodes. The method and apparatus involves coupling inductors with each pair of the current carrying electrodes of each of the cross-coupled transistor devices in the non-Foster circuit, the inductors also being coupled with voltage and/or current sources associated with or coupled to the non-Foster circuit. The nominal values of the inductors are selected to provide a load asymmetry, so that the load inductor in the input side of the non-Foster circuit has a larger inductance than the load inductor at the output side of non-Foster circuit.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: July 2, 2019
    Assignee: HRL Laboratories, LLC
    Inventors: Zhiwei A. Xu, Carson R. White, Jonathan J. Lynch
  • Patent number: 10340879
    Abstract: In one embodiment, an impedance matching network is disclosed that includes a first circuit comprising a first variable component providing a first variable capacitance or inductance, and a second circuit comprising a second variable component providing a second variable capacitance or inductance. Each of the first circuit and the second circuit includes plurality of switching circuits configured to provide the first variable capacitance or inductance and the second variable capacitance or inductance. Each of the plurality of switching circuits includes a diode and a driver circuit configured to switch the diode. The driver circuit includes a first switch, a second switch coupled in series with the first switch, and a filter circuit that is coupled at a first end between the first switch and the second switch, and is operably coupled at a second end to the diode.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 2, 2019
    Inventors: Anton Mavretic, Ian M. Costanzo, Ronald Anthony Decker
  • Patent number: 10340856
    Abstract: Aspects of the present disclosure generally relate to a RF high power amplifier designed for resonance mitigation. A method for resonance mitigation in RF high power amplifier enclosure and an enclosure for RF high power amplifier designed to mitigate resonance is provided. In an aspect, the enclosure can be configured with a metallic post or a grounded metallic post positioned at a suitable location with RF high power amplifier circuit to dampen and shift out resonance. In an aspect, the metallic post can be placed between printed circuit board (PCB) substrate and enclosure lid. Proposed metallic post solution eliminates the need of RF absorber in the design.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 2, 2019
    Assignee: CENTRE FOR DEVELOPMENT OF TELEMATICS
    Inventors: Theepak Shoundrabalan, Vijaya Suresh Namburi, Selvapriya Radhakrishnan, Devadas Bhaskaran, Soundarakumar Masilamani, Vipin Tyagi
  • Patent number: 10340233
    Abstract: An apparatus for connecting a millimeter wave signal to an integrated circuit includes a connector to receive the millimeter wave signal. The connector includes a signal pin. A pin landing pad is conductively coupled to the signal pin. The pin landing pad includes a transition portion. A transmission line is configured to couple the pin landing pad to an input/output (I/O) pad of an integrated circuit. The apparatus further includes an interposer including the pin landing pad, the transmission line, and the I/O pad of the integrated circuit.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: July 2, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: Nicholas D. Saiz, Xipeng Sui, Anthony C. Kowalczyk
  • Patent number: 10340570
    Abstract: An exemplary electronic assembly includes a planar semiconductor substrate having a front side with semiconductor components and a back side that includes one recess extending inwardly. One of an isolator and circulator is formed as part of the planar semiconductor substrate and includes one magnetic ferrite disk mounted within the one recess within the thickness of the planar semiconductor substrate. The one of an isolator and circulator has at least input and output ports. The input port is disposed to receive a radio frequency signal to be coupled with low insertion loss to the output port while providing high insertion loss to other radio frequency signals attempting to propagate from the output port to the input port.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: July 2, 2019
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Dino Ferizovic, Alexis Zamora, Benjamin Poust
  • Patent number: 10333194
    Abstract: An electronic device includes a high-frequency transmission line member and a housing. The high-frequency transmission line member includes a flexible substrate, a signal conductor, and a ground conductor along the signal conductor. The housing is defined by a member separate from the high-frequency transmission line member and located at one principal surface side of the high-frequency transmission line member. The high-frequency transmission line member includes a first portion along the housing to face the housing, and a second portion spaced apart from the housing more than the first portion. The ground conductor is not provided at one principal surface side of the signal conductor in the first portion and is provided at least in the second portion.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: June 25, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsumi Taniguchi, Kuniaki Yosui
  • Patent number: 10333192
    Abstract: A microstrip circulator includes a carrier and a ferrite slab having a first side and a second side. The circulator further includes a first microwave epoxy positioned between the carrier and the first side of the ferrite slab. The circulator further includes a conductor having a center portion with three legs extending therefrom. The circulator further includes a second microwave epoxy positioned between the second side of the ferrite slab and the conductor. The circulator further includes an insulator and a third microwave epoxy positioned between the conductor and the insulator. The circulator further includes a magnet and a fourth epoxy positioned between the insulator and the magnet.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 25, 2019
    Assignee: SMITHS INTERCONNECT, INC.
    Inventors: James P. Kingston, Jose Gil, David E. Barry
  • Patent number: 10320045
    Abstract: Disclosed are various embodiments for superposition of guided surface wave launched along the surface of a lossy medium. In one example, Zenneck surface waves are launched along a surface of a lossy conducting medium using an array of guided surface waveguide probes and a predefined field pattern of the Zenneck surface waves is maintained. The individual ones of the guided surface waveguide probes include a feed network electrically coupled to a charge terminal. The feed network provides a phase delay that matches a wave tilt angle associated with a complex Brewster angle of incidence associated with the lossy conducting medium.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: June 11, 2019
    Assignee: CPG TECHNOLOGIES, LLC
    Inventors: James F. Corum, Kenneth L. Corum
  • Patent number: 10320050
    Abstract: A multi-mode resonator includes: a housing having a cavity therein; and a plurality of resonance ribs which are arranged radially around a center of the cavity with a predetermined interval therebetween. Each of the plurality of resonance ribs includes a body having a lower end and an upper end. The lower end of each of the plurality of resonance ribs is fixed to a bottom surface of the housing, and the body of the each of the plurality of resonance ribs is bent so that the upper end of each of the plurality of resonance ribs points to the center of the cavity.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: June 11, 2019
    Assignee: KMW INC.
    Inventor: Nam-Shin Park