Abstract: A band-pass filter for a wireless communications signal is provided. The band-pass filter includes a first element and a second element that mates with the first element to form a waveguide. The formed waveguide comprises a first linear segment and a second linear segment coupled by a first angular bend. The band-pass filter further includes an insert plate disposed between the first element and the second element along a direction of propagation of the waveguide. The direction of propagation follows the angular bend in the waveguide. In some embodiments, the band-pass filter is an E-plane filter. In some embodiments, the band-pass septum filter has a shorter length along an x-direction than a straight septum filter with the same performance.
Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section.
Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
Abstract: Apparatus, and corresponding method, relates generally to a microelectronic device. In such an apparatus, a first conductive layer is for providing a lower interior surface of a circuit structure. A plurality of wire bond wires are interconnected to the lower interior surface and spaced apart from one another for providing at least one side of the circuit structure. A second conductive layer is for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires. The plurality of wire bond wires, the first conductive layer and the second conductive layer in combination define at least one opening in the at least one side for a signal port of the circuit structure. Such circuit structure may be a signal guide circuit structure, such as for a signal waveguide or signal cavity for example.
Abstract: A matching device includes: a directional coupler that detects a traveling wave and a reflected wave; a matching circuit that has a first variable capacitance capacitor, a second variable capacitance capacitor and an inductance; and a control unit that calculates a reflection coefficient based on the traveling wave and the reflected wave and controls a capacitance value VC1 of the first variable capacitance capacitor and a capacitance value VC2 of the second variable capacitance capacitor. The control unit changes VC2 such that VC2 moves toward a circle drawn by the trajectory of the reflection coefficient passing through a matching point on a Smith chart, fine-tunes VC1 on the basis of a predicted intersection point with the circle, and when the distance between the calculated reflection coefficient and the circle becomes a predetermined value or less, changes VC1 such that the calculated reflection coefficient approaches zero, and fine-tunes VC2.
Abstract: A high power low frequency tuner uses motor controlled rotary capacitors submerged in low loss high epsilon dielectric fluid and lengths of semi-rigid RF cable interconnecting the floating static blocks of the capacitors, the rotating blocks being grounded. And tuner calibration and tuning methods, allowing accurate tuning and perfect Smith chart impedance coverage. The full calibration lasts several hours and is reduced by the “de-embedded” calibration algorithm to minutes. A maximum power embodiment comprises full immersion of capacitors and interconnecting cables in circulated dielectric liquid (mineral oil) for breakdown voltage increase and heat removal.
Abstract: A filtering switch based on dielectric resonator is disclosed which comprising a rectangular dielectric resonator, a metal cavity in which the dielectric resonator is located, a switch circuitry and a T-shape feeding line structure. The ON- and OFF-states of the filtering switch based on dielectric resonator are realized by controlling a coupling between the dielectric resonator and the feeding line structure. EM fields of the rectangular dielectric resonator and T-shape feeding line structure have been theoretically analyzed and utilized to guide the coupling control. The results have shown low ON-state loss, high power capability and high OFF-state isolation. Transmission zeros are generated at both sides of the passband by cross coupling between dielectric resonators or between feeding line structures and coupling line structures, resulting in high skirt selectivity.
Abstract: A phase shifter includes a transformer including a first coil, a second coil that is magnetically coupled to the first coil, and a parasitic inductance component, and an impedance adjustment circuit including a reactance element connected to the transformer. The impedance adjustment circuit includes an input/output capacitor connected between a first port and a second port of the transformer, and the input/output capacitor is defined by an inter-coil capacitance generated between the first coil and the second coil and an input/output additional capacitor connected between the first port and the second port.
Abstract: Reflectionless transmission line filters, as well as a method for designing such filters is disclosed. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The insertion of additional transmission line sections that change the phase response of the circuit without altering the amplitude response preferably allows follow-up transmission line identities to be applied in order to arrive at a more easily manufacturable filter topology. This facilitates their application over a higher frequency range the solely lumped-element circuits.
Abstract: An electromagnetic wave transmission board comprises a substrate. The substrate comprises a first dielectric layer and a second dielectric layer, and the first dielectric layer is stacked on the second dielectric layer. The first dielectric layer and the second dielectric layer together form a wave guiding space. The wave guiding space is configured for transmitting electromagnetic wave.
March 24, 2017
Date of Patent:
April 30, 2019
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Yu-Wei Huang, Shih-Hsien Wu, Wei-Chung Lo
Abstract: Circuits and methods for eliminating or mitigating the amount of temperature-dependent variation in the relative attenuation of a multi-valued digital step attenuator (DSA) by using resistive components having temperature-dependent resistance values that compensate for or offset changes in the temperature-dependent ON resistance (RON) of the switches within the DSA. In some embodiments, DSA attenuator cell switches are fabricated to have positive first-order resistance temperature (FORT) coefficients, while temperature-compensating series attenuation resistances are fabricated as a positive FORT coefficient resistor and temperature-compensating shunt resistances are fabricated as either a negative FORT coefficient resistor or a combination of a negative FORT coefficient resistor in parallel with a positive FORT coefficient resistor.
Abstract: A continuously adjustable programmable harmonic microwave attenuator and linear phase controller (HAPC) uses mobile signal couplers (wave-probes) in a slabline structure which is terminated with 50 Ohms. The coupled ports of the wave-probes are connected with the output port of the unit via a power combiner using flexible RF cables. The wave-probes are attached to the vertical axes of mobile carriages, which are placed at variable distances from the input port, corresponding to the expected transmission phases, whereas the depth, at which the wave-probes are inserted into the slabline, determines the coupling factors and thus the value of the attenuation. The unit can be calibrated at a number of harmonic frequencies typically equal to the number of the wave-probes used.
Abstract: Communications connectors are provided that include a printed circuit board having a plurality of input terminals, a plurality of output terminals, and a plurality of conductive paths that connect each input terminal to a respective output terminal. The conductive paths are arranged as a plurality of differential transmission lines, and a solenoid inductor is implemented along at least one of the conductive paths.
Abstract: A dielectric waveguide includes a dielectric of a rectangular parallelepiped in shape, an input/output electrode formed on a first face of the dielectric, and a conductor film formed on an outer face of the dielectric. The input/output electrode extends from a first end which is a vertex or a neighborhood of the vertex of a first face (bottom face) of the dielectric inward on the bottom face; and environs along both sides and the first end of the input/output electrode include a conductor-unformed section in which there is no conductor film.
Abstract: The present disclosure relates to a PCB and a method in the PCB for reducing common-mode current. The PCB comprises two differential lines and each of the differential lines is on one or more planes of the PCB. The two differential lines carry a differential mode current and the common mode current. The differential mode current and the common mode current may be at least one of a forward current and a backward current. Further, a predefined configuration is formed using each of the two differential lines to generate impedance at the predefined configuration. Here, the predefined configuration is placed close to each other to generate a dielectric capacitance. The flow of the forward current and the backward current in adjacent tracks of each of the two differential lines in the predefined configuration are in opposite direction.
Abstract: An impedance matching device and an impedance matching method. A variable reactance impedance matching network is disposed between a variable frequency RF power source varying a driving frequency and a load. An impedance matching method of the variable reactance impedance matching network includes controlling variation amount of capacitance or reactance of a variable reactive component of the impedance matching network as a function of a difference between a target driving frequency ft and the driving frequency.
Abstract: The present disclosure may include, for example, a tunable capacitor having a decoder for generating a plurality of control signals, and an array of tunable switched capacitors comprising a plurality of fixed capacitors coupled to a plurality of switches. The plurality of switches can be controlled by the plurality of control signals to manage a tunable range of reactance of the array of tunable switched capacitors. Additionally, the array of tunable switched capacitors is adapted to have non-uniform quality (Q) factors. Additional embodiments are disclosed.
Abstract: A microwave device, such as a waveguide, transmission line, waveguide circuit, transmission line circuit or radio frequency part of an antenna system, is disclosed. The microwave device comprises two conducting layers arranged with a gap there between, and a set of periodically or quasi-periodically arranged protruding elements fixedly connected to at least one of said conducting layers, thereby forming a texture to stop wave propagation in a frequency band of operation in other directions than along intended waveguiding paths, thus forming a so-called gap waveguide. All protruding elements are connected electrically to each other at their bases at least via the conductive layer on which they are fixedly connected, and some or all of the protruding elements are in conductive or non-conductive contact also with the other conducting layer. A corresponding manufacturing method is also disclosed.
April 10, 2015
Date of Patent:
April 16, 2019
Per-Simon Kildal, Abbas Vosoogh, Farid Hadavy, Stefan Carlsson, Lars-Inge Sjöqvist
Abstract: A Bulk Acoustic Wave (BAW) filter includes a series branch coupled between an input node and an output node. The series branch has multiple BAW resonators that are coupled in series, wherein a first series resonator is coupled between a first node and a second node in the series branch. A first shunt resonator is coupled between the first node and a fixed voltage node, such as ground, and a second shunt resonator is coupled between the second node and the fixed voltage node. Further, a first inductor is coupled between the first node and the fixed voltage node, and a second inductor is coupled between the second node and the fixed voltage node. The first inductor and the second inductor are magnetically coupled to one another to generate a virtual inductance between the first node and the second node and in parallel with the first series resonator.
October 19, 2016
Date of Patent:
April 16, 2019
Qorvo US, Inc.
Jeff D. Galipeau, Lawrence A. Carastro, Scott M. Knapp
Abstract: Each of a first high frequency power supply and a second high frequency power supply of a plasma processing apparatus is configured to selectively output a continuous wave, a modulated wave and a double-modulated wave. A first average value which determines an impedance at a load side of the first high frequency power supply and a second average value which determines an impedance at a load side of the second high frequency power supply are obtained by using any one of two averaging methods depending on a first high frequency power output from the first high frequency power supply and a second high frequency power output from the second high frequency power supply. An impedance matching of each of a first matching device and a second matching device is performed based on the first average value and the second average value.