Patents Examined by Stephen E. Jones
  • Patent number: 11431069
    Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than ?3.5 dB at a frequency that is greater than about 15 GHz.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: August 30, 2022
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
  • Patent number: 11424523
    Abstract: A resonator for a filter includes a resonator housing, in which a resonator space is formed. The resonator further includes a dielectric arrangement arranged in the resonator space including a first dielectric element and a second dielectric element, the first dielectric element and the second dielectric element being separated from one another in such a way that a gap is formed between them. Both a first thermal expansion coefficient of the first dielectric element and a second thermal expansion coefficient of the second dielectric element are less than a thermal expansion coefficient of the resonator housing. A temperature-related variation of the resonant frequency of the resonator can therefore be compensated for.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: August 23, 2022
    Inventors: Dennis Epple, Michael Franz, Jean Parlebas, Ruben Bühler
  • Patent number: 11424525
    Abstract: A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: August 23, 2022
    Assignee: WI-LAN RESEARCH INC.
    Inventors: Muhammad Rashad Ramzan, Muhammad Omar, Kenneth Stanwood
  • Patent number: 11424522
    Abstract: Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: August 23, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Jay M. Gambetta, Jerry M. Chow
  • Patent number: 11424524
    Abstract: A Docsis-MoCA coupled line directional coupler includes an input port, an output port, a coupled port, and a termination port. A first track connects the input port to the output port and a second track, which may be substantially parallel to the first track, connects the termination port to the coupled port. The first track and the second track are configured to form a variable coupling length so as to control, for instance, an isolation level between the output port and the coupled port to be less than a predetermined isolation level in a MoCA frequency band.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: August 23, 2022
    Assignee: PPC BROADBAND, INC.
    Inventor: Paul Bailey
  • Patent number: 11418223
    Abstract: The present disclosure provides a dual-band transformer structure, which is suitable for at least two frequencies. The dual-band transformer structure includes a metal layer, a first transmission line, a second transmission line, and a third transmission line. The first transmission line and the second transmission line are disposed on the metal layer. A first end of the second transmission line is coupled to a second end of the first transmission line. A second end of the second transmission line is aligned with an edge of the metal layer, and a first end of the third transmission line is coupled to the second end of the second transmission line. The third transmission line extends away from the edge.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: August 16, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Tzu-Hao Hsieh, Chih-Chieh Wang
  • Patent number: 11411307
    Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: August 9, 2022
    Assignee: Anokiwave, Inc.
    Inventors: Jason Leo Durbin, Trang Thai, Peter Moosbrugger
  • Patent number: 11405017
    Abstract: There are disclosed acoustic filters and radios incorporating the acoustic filters. A filter includes a first filter port, a second filter port, and n sub-filters, where n is an integer greater than one. Each sub-filter has a first sub-filter port connected to the first filter port and a second sub-filter port connected to the second filter port. A first acoustic resonator is connected from the first filter port to ground, and a second acoustic resonator is connected from the second filter port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the filter.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: August 2, 2022
    Assignee: Resonant Inc.
    Inventors: Andrew Guyette, Neal Fenzi
  • Patent number: 11405019
    Abstract: Radio frequency filters. A radio frequency filter includes a substrate attached to a piezoelectric plate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate includes a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. The conductor pattern connects the plurality of resonators in a matrix filter circuit including a first sub-filter and a second sub-filter, each sub-filter comprising two or more resonators from the plurality of resonators.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: August 2, 2022
    Assignee: Resonant Inc.
    Inventors: Pintu Adhikari, Neal Fenzi, Andrew Guyette
  • Patent number: 11405012
    Abstract: A balun and a method for manufacturing the same are disclosed. According to an embodiment, the balun comprises a substrate, and a first and a second coplanar waveguide (CPW) couplers which are disposed on the substrate and cascaded with each other. Each CPW coupler comprises two first ground planes disposed on a first side of the substrate, a first microstrip line and at least two second microstrip lines which are disposed on the first side of the substrate between the two first ground planes, and at least one third microstrip line that is disposed on an opposite side of the substrate. The first microstrip line and the at least two second microstrip lines can be coupled with each other by electromagnetic coupling. The at least one third microstrip line electrically connects the at least two second microstrip lines with each other by via-holes.
    Type: Grant
    Filed: July 8, 2018
    Date of Patent: August 2, 2022
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Zhancang Wang, Chen He
  • Patent number: 11398807
    Abstract: A signal transmission device, including a RF processing circuit and a cable connecting circuit including a first choke inductor, a first and second bypass capacitors, and a first coupling capacitor, is provided. One end of the first choke inductor is coupled to a transceiver end of a RF transceiver and the other end is coupled to a first control end of a RF antenna controller. The transceiver end is coupled to a first conductor. The first bypass capacitor is coupled between the other end and a digital ground terminal. The first coupling capacitor is coupled between the digital ground terminal and a RF ground terminal. The second conductor is coupled to the RF ground terminal and a second control terminal of the RF antenna controller at a second connecting end of a RF cable. The second bypass capacitor is coupled between the second control terminal and the digital ground terminal.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: July 26, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shih-Ping Liu, Chia-Yuan Lin, Kuang-Ta Sun, Bo-Ru Zeng, Tzu-Tu Hsu, Kai-Lun Huang
  • Patent number: 11399152
    Abstract: A MoCA splitter device may include an input port, a first output port and a second output port, a first transmission line configured to connect the input port to the first output port, a second transmission line configured to connect the input port to the first output port, a first isolation element configured to connect the first transmission line to the second transmission line, a second isolation element configured to connecting the first transmission line to the second transmission line. The first isolation element and the second isolation element are configured to provide an isolation level between the first output port and the second output port that is less than a predetermined isolation level of about less than 16 dB in a MoCA frequency band.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: July 26, 2022
    Assignee: PPC BROADBAND, INC.
    Inventors: Paul Bailey, Erdogan Alkan, Thomas Hart
  • Patent number: 11398370
    Abstract: In one embodiment, a method, a method of manufacturing a semiconductor is disclosed. A monitored semiconductor manufacturing system (monitored system) is operated over a period of time, the monitored system comprising an impedance matching network coupled between a radio frequency (RF) source and a plasma chamber. First values for a parameter of the monitored system are received, the first values comprising different values for the parameter over the time period of operation of the monitored system, and a learning model is trained using the first values for the parameter. A substrate is then placed in a plasma chamber of a controlled semiconductor manufacturing system (controlled system). A characteristic of the controlled system is determined using a current value of the parameter and the trained learning model. An action is then taken upon the controlled system to address the determined characteristic.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: July 26, 2022
    Inventor: Imran Ahmed Bhutta
  • Patent number: 11394101
    Abstract: A hybrid coupler operating in a power divider mode includes two inputs, two outputs, a capacitive module coupled between the inputs and the outputs or on each input and each output. The capacitive module has an adjustable capacitive value making it possible to adjust the central frequency. A calibration method includes: delivering a first reference signal having a first reference frequency on the first input of the hybrid coupler, measuring the peak value of a first signal delivered to the first output of the coupler and measuring the peak value of a second signal delivered to the second output of the coupler. The two peak values are compared and an adjustment of the capacitive value of the capacitive module is made until an equality of the peak values is obtained to within a tolerance.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 19, 2022
    Assignee: STMicroelectronics SA
    Inventors: Vincent Knopik, Jeremie Forest, Eric Kerherve
  • Patent number: 11393659
    Abstract: In one embodiment, a method of impedance matching and controlling the power delivered to a plasma chamber is disclosed. A matching network includes a variable reactance element (VRE), the VRE having different positions for providing different reactances. Based on a determined parameter, the method determines potential new positions for the VRE that would have a threshold effectiveness in providing an impedance match between the RF source and the plasma chamber. A preferred position for the VRE is determined by determining the one of the potential new positions meeting the threshold effectiveness whose efficiency in delivering RF power from the RF input to the RF output would cause an RF power at the RF output to be closest to a desired RF power.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: July 19, 2022
    Inventor: Imran Ahmed Bhutta
  • Patent number: 11387564
    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A cavity filter is provided. The cavity filter includes a plate of the cavity filter and including a feeder part for supplying an electrical signal, a housing forming an exterior of the cavity filter and coupled to the plate to form a shielded space inside the cavity filter, and a metal structure having a first end coupled to an inside of the housing and a second end that extends toward the feeder part and resonates to filter frequencies in the shielded space.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: July 12, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dongjoo Kim, Bonmin Koo, Jonghwa Kim, Seungtae Ko, Youngju Lee, Jongwook Zeong
  • Patent number: 11387531
    Abstract: A method for minimizing center frequency shift and linearity errors encountered in YIG filters, comprising the following steps: automatically generating data packages in test unit depending on the user request or containing all filter characteristic states and transmitting them to the driver circuit, adjusting the desired voltage level by means of the digital to analog converters contained in the structure of the data packages received by the driver circuit, and transmitting the adjusted voltage level to the YIG filter, measuring filter characteristics (scattering parameters) corresponding to the data packages transmitted to the YIG filter in the analyser, in order to calculate the center frequency shift of the filter, determining the center frequency and linearity calculations, and recording the characteristic features measured by the analyser in the test unit.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: July 12, 2022
    Assignee: ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI
    Inventor: Yarkin Yigit
  • Patent number: 11387532
    Abstract: Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: July 12, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: David Bowie Cruickshank, David Martin Firor, Iain Alexander MacFarlane
  • Patent number: 11380971
    Abstract: A tunable power absorbing termination for a waveguide transmission line includes a section of waveguide having a front power feed end, a back power extracting end, and guidewalls extending between the front and back end thereof. A coolant circulating dielectric taper extends into the section of waveguide in an inclined orientation relative to a guidewall of the section of waveguide such that the point end of the taper extends substantially to the front power feed end of the waveguide section. The inclined orientation of the dielectric taper creates a free volume of space adjacent the taper behind the front power feed end of the waveguide section into which a tuner element is introduced which is position adjustable within the free volume of space to provide the power absorbing termination with a tuning capability.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: July 5, 2022
    Inventor: Ray M. Johnson
  • Patent number: 11381274
    Abstract: A transmit-and-receive module includes a multiplexer, a power amplifier, and a low-noise amplifier. The multiplexer includes a transmit filter and a receive filter. The power amplifier and the low-noise amplifier are integrated with each other. In a Smith chart, impedance in a receive band of the receive filter seen from a receive terminal intersects a line connecting a center point of noise figure circles and a center point of gain circles. The center point of the noise figure circles represents the impedance at which the noise figure of the low-noise amplifier is minimized. The center point of the gain circles represents the impedance at which the gain of the low-noise amplifier is maximized.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: July 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Jin Yokoyama, Shiro Masumoto, Syunji Yoshimi