Abstract: A set of the pulses of light in a light beam is passed through a mask toward a wafer during a single exposure pass; at least a first aerial image and a second aerial image on the wafer based on pulses of light in the set of pulses that pass through the mask is generated during a single exposure pass, the first aerial image is at a first plane on the wafer and the second aerial image is at a second plane on the wafer, the first plane and the second plane being spatially distinct from each other and separated from each other by a separation distance along the direction of propagation; and a three-dimensional semiconductor component is formed.

Abstract: A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

Abstract: A method of applying a measurement correction includes determining an orthogonal subspace used to characterize a first principal component of the measurement and a second principal component of the measurement, and rotating the orthogonal subspace by a first angle such that the first principle component rotates to become a first factor vector and the second principle component rotates to become a second factor vector. An asymmetry vector is generated by rotating the second factor vector by a second angle, where the asymmetry vector and the first factor vector define a non-orthogonal subspace. An asymmetry contribution is determined in the measurement based on the projection of the measurement onto the first factor vector in the non-orthogonal subspace. The method also includes subtracting the asymmetry contribution from the measurement.

Abstract: A method for tuning a target apparatus of a patterning process. The method includes obtaining a reference performance, and measurement data of a substrate subjected to the patterning process at the target apparatus, the measurement data indicative of a performance of the target apparatus; determining a cause of a performance mismatch based on a difference between the reference performance and the performance of the target apparatus, wherein the cause includes an optical characteristic; and responsive to the cause, adjusting an optical parameter associated with an adjustable optical characteristic to reduce the performance mismatch in the optical characteristic.

Abstract: A beam-forming and illuminating system for a lithography system, such an EUV lithography system, includes an optical element and an adjusting device. The adjusting device is configured so that, during a heat-up phase of the beam-forming and illuminating system, the adjusting device measures a field position and/or a pupil position of the beam-forming and illuminating system and adjusts the orientation and/or position of the optical element based on the measured field position and/or pupil position to keep the optical element in a desired position.

Abstract: A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.

Abstract: A method includes illuminating a mirror array with light having light amplitudes forming a first greyscale pattern, the mirror array including a number of mirrors and at least two of the mirrors are illuminated with a same amplitude of the light. The method also includes imaging the light with the light amplitudes onto a substrate to create a second greyscale pattern, different than the first greyscale pattern, at the substrate.

Abstract: An object stage bearing system can include an object stage, a hollow shaft coupled to the object stage, and an in-vacuum gas bearing assembly coupled to the hollow shaft and the object stage. The in-vacuum gas bearing assembly can include a gas bearing, a scavenging groove, and a vacuum groove. The gas bearing is disposed along an inner wall of the in-vacuum gas bearing assembly and along an external wall of the hollow shaft. The scavenging groove is disposed along the inner wall such that the scavenging groove is isolated from the gas bearing. The vacuum groove is disposed along the inner wall such that the vacuum groove is isolated from the scavenging groove and the gas bearing.

Abstract: A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

Abstract: An optical assembly and a method of making an optical assembly in which additive manufacturing techniques are used to form a support structure either directly on an optical element or on a carrier that is subsequently bonded to an optical element.

Abstract: A method, includes illuminating a structure of a metrology target with radiation having a linear polarization in a first direction, receiving radiation redirected from the structure to a polarizing element, wherein the polarizing element has a polarization splitting axis at an angle to the first direction, and measuring, using the sensor system, an optical characteristic of the redirected radiation.

Abstract: A particle removal device, along with methods of using such, are described. The device includes a handheld module having a body. A first one or more channels and a second one or more channels are formed in the body. The body includes a nozzle, and the handheld module is configured to provide suction by the nozzle and to inject an ionized fluid stream by the nozzle. The body further includes a handle attached to the nozzle.

Abstract: An edge exposure tool may include a lens adjustment device that is capable of automatically adjusting various parameters of an edge exposure lens to account for changes in operating parameters of the edge exposure tool. In some implementations, the edge exposure tool may also include a controller that is capable of determining edge adjustment parameters for the edge exposure lens and exposure control parameters for the edge exposure tool using techniques such as big data mining, machine learning, and neural network processing. The lens adjustment device and the controller are capable of reducing and/or preventing the performance of the edge exposure tool from drifting out of tolerance, which may maintain the operation performance of the edge exposure tool and reduce the likelihood of wafer scratching, and may reduce the down-time of the edge exposure tool that would otherwise be caused by cleaning and calibration of the edge exposure lens.

Abstract: A model-based tuning method for tuning a first lithography system utilizing a reference lithography system, each of which has tunable parameters for controlling imaging performance. The method includes the steps of defining a test pattern and an imaging model; imaging the test pattern utilizing the reference lithography system and measuring the imaging results; imaging the test pattern utilizing the first lithography system and measuring the imaging results; calibrating the imaging model utilizing the imaging results corresponding to the reference lithography system, where the calibrated imaging model has a first set of parameter values; tuning the calibrated imaging model utilizing the imaging results corresponding to the first lithography system, where the tuned calibrated model has a second set of parameter values; and adjusting the parameters of the first lithography system based on a difference between the first set of parameter values and the second set of parameter values.

Abstract: Provided is a position measurement apparatus in which a measurement error in a target is reduced. A position measurement apparatus measuring a position of a target includes an illumination unit configured to illuminate the target with illumination light including light of a first wavelength and light of a second wavelength different from the first wavelength, a measurement unit configured to measure the position of the target by detecting light from the target illuminated with the illumination light, and a control unit configured to adjust a ratio of a light intensity of the first wavelength to a light intensity of the second wavelength such that a measurement error varying depending on the position of the target in the measurement unit is reduced.

Abstract: A reticle transport system having a magnetically levitated transportation stage is disclosed. Such a system may be suitable for use in vacuum environments, for example, ultra-clean vacuum environments. A magnetic levitated linear motor functions to propel the transportation stage in a linear direction along a defined axis of travel and to magnetically levitate the transportation stage.

Abstract: An overlay metrology system includes a controller to receive, from an overlay metrology tool, overlay measurements on multiple sets of overlay targets on a sample with a range of values of a measurement parameter, where a particular set of overlay targets includes overlay targets having one of two or more overlay target designs. The controller may further determine scaling metric values for at least some of the overlay targets, where the scaling metric for a particular overlay target is based on a standard deviation of the overlay measurements of the corresponding set of overlay targets. The controller may further determine a variability of the scaling metric values for each of the two or more sets of overlay targets. The controller may further select, as an output overlay target design, one of the two or more overlay target designs having a smallest scaling metric variability.

Abstract: Apparatus and method for directly curing photopolymer printing plates, such as with UV radiation. Printing plates are cured directly by radiation, such as emitted from a high power UV laser beam. No LAMS layer or film bearing the image information is required on top of the polymer plate. The laser beam may be split into several individually-modulated beams by means of an Acousto Optical Deflector. Each individual beam is capable of curing pixels of the image that are to be transferred to the printing plate. Support shoulders for the printing details, formed by the pixels are determined by the caustic of the UV beam propagation.

Abstract: The present application provides a method, an apparatus, and a system for forming code. The method includes while a substrate is transferred to an exposure machine, adjusting the substrate to align with an exposure alignment mark on the substrate with the exposure machine; forming a code formation area on the adjusted substrate by controlling the exposure machine; while the substrate formed with the code formation area is transferred to a code formation machine, adjusting the substrate to align the exposure alignment mark on the substrate with the code formation machine; and forming an identification code in the code formation area on the adjusted substrate by controlling the code formation machine.

Abstract: A mask for cleaning a lithography apparatus includes a mask substrate and a coating provided on a surface of the mask substrate. The coating is configured to trap particulate contaminant matter from the lithography apparatus. A method of cleaning a lithography tool is also provided preparing a cleaning mask including a particle trapping layer formed on a substrate. The method includes transferring the cleaning mask through a mask transferring route of the lithography tool. Subsequently, the method includes analyzing a particle trapped by the particle trapping layer.