Patents Examined by Sylvia MacArthur
  • Patent number: 10259206
    Abstract: Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: April 16, 2019
    Assignee: ALTA DEVICES, INC.
    Inventors: Brian Brown, Brian Burrows, David Berkstressor, Gang He, Thomas J Gmitter
  • Patent number: 10246782
    Abstract: A method for etching a workpiece may be provided, which may include: determining a plurality of reference etch profiles for a plurality of positions of an etchant dispenser, each reference etch profile corresponding to a respective position of the plurality of positions of the etchant dispenser; determining a thickness profile of the workpiece; determining a respective etch duration for each position of the plurality of positions of the etchant dispenser based on the determined thickness profile and the plurality of reference etch profiles, to reduce a total thickness variation of the workpiece; and dispensing an etchant over the workpiece via the etchant dispenser for the determined respective etch duration for each position of the plurality of positions.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: April 2, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Karl Pilch, Sonja Muringer
  • Patent number: 10245623
    Abstract: A substrate dry cleaning apparatus, a substrate dry cleaning system, and a method of cleaning a substrate are disclosed. The substrate dry cleaning system includes a substrate support and a reactive species generator. The reactive species generator includes a first conduit defining a first flow channel that extends to an outlet of the first conduit, the outlet of the first conduit facing the substrate support, a first electrode, a second electrode facing the first electrode, the first flow channel disposed between the first electrode and the second electrode, a first inert wall disposed between the first electrode and the first flow channel, and a second inert wall disposed between the second electrode and the first flow channel.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: April 2, 2019
    Assignee: RAVE N.P., INC.
    Inventors: Gordon Scott Swanson, Ivin Varghese, Mehdi Balooch
  • Patent number: 10242847
    Abstract: The invention discloses a plasma processing apparatus comprising a chamber lid, a chamber body and a support assembly. The chamber body, defining a processing volume for containing a plasma, for supporting the chamber lid. The chamber body is comprised of a chamber sidewall, a bottom wall and a liner assembly. The chamber sidewall and the bottom wall define a processing volume for containing a plasma. The liner assembly, disposed inside the processing volume, comprises of three or more slots formed thereon for providing an axial symmetric RF current path. The support assembly supports a substrate for processing within the chamber body. With the liner assembly with several symmetric slots, the present invention can prevent electromagnetic fields thereof from being azimuthal asymmetry.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: March 26, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: James D. Carducci, Zhigang Chen, Shahid Rauf, Kenneth S. Collins
  • Patent number: 10236192
    Abstract: A liquid processing apparatus of the present disclosure holds and rotate a substrate in a substrate holding unit, ejects an etching liquid while moving a main nozzle of a main nozzle unit between a first position where the etching liquid reaches a center of the substrate and a second position closer to a peripheral side of the substrate than the first position, and then, ejects the etching liquid to the substrate from a sub nozzle provided at a third position closer to the peripheral side of the substrate than the first position at an ejection flow rate higher than that from the main nozzle.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: March 19, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Jun Nonaka, Shogo Mizota, Tatsuya Nagamatsu, Daisuke Saiki, Kazuhiro Teraoka, Takashi Yabuta
  • Patent number: 10226852
    Abstract: A surface planarization system is presented. The system comprises an external energy source for generating a localized energy distribution within a processing region, and a control unit for operating the external energy source to create, by the localized energy distribution, a predetermined temperature pattern within the processing region such that different locations of the processing region are subjected to different temperatures. This provides that when a sample (e.g. semiconductor wafer) during its interaction with an etching material composition is located in the processing region, the temperature pattern at different locations of the sample's surface creates different material removal rates by the etching material composition (different etch rates).
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: March 12, 2019
    Assignee: NOVA MEASURING INSTRUMENTS LTD.
    Inventor: Igor Turovets
  • Patent number: 10207389
    Abstract: A polishing pad includes and upper portion and one or more lower portions. The upper portion has an upper surface for attachment to a pad carrier and a first lateral dimension. The one or more lower portions project downward from the upper portion. A bottom surface of the one or more lower portions provide a contact surface to contact a substrate during chemical mechanical polishing. Each lower portion has a second lateral dimension that is less than the first lateral dimension. A total surface area of the contact surface from the one or more lower portions is no more than 10% of a surface area of the upper surface.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: February 19, 2019
    Assignee: Applied Materials, Inc.
    Inventor: Hung Chih Chen
  • Patent number: 10204804
    Abstract: In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: February 12, 2019
    Assignee: Infineon Technologies AG
    Inventor: Johann Kosub
  • Patent number: 10199231
    Abstract: A substrate processing apparatus includes: a substrate holder to hold a substrate in a horizontal posture while rotating the substrate about a vertical rotary axis passing through the center of a plane of the substrate; a guard member having a shape extending along at least part of a surface peripheral area of the substrate, the guard member being placed in a position close to the surface peripheral area of the substrate held by the substrate holder in a noncontact manner; a cup being a tubular member with an open top end, the cup being provided so as to surround the substrate held by the substrate holder and the guard member together; and a nozzle from which a processing liquid is discharged to the surface peripheral area of the substrate held by the substrate holder. The nozzle is placed on a side opposite the cup with respect to at least part of the guard member.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: February 5, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Tomonori Fujiwara, Nobuyuki Shibayama, Yukifumi Yoshida, Tetsuya Shibata, Akiyoshi Nakano
  • Patent number: 10196272
    Abstract: Disclosed is an apparatus and method of manufacturing a graphene film, wherein the apparatus includes a wrinkle flattening device configured to flatten wrinkles in a lamination structure including a base substrate and a graphene film laminated on the base substrate; and a first lamination apparatus configured to laminate a first substrate on the graphene film, wherein the wrinkle flattening device applies a vacuum to the base substrate when the wrinkle flattening device is in contact with the base substrate.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: February 5, 2019
    Assignee: Graphene Square, Inc.
    Inventors: Wan Soo Kim, Jung Hee Han, Byung Hee Hong
  • Patent number: 10199242
    Abstract: A planarization processing device for polishing a substrate, such as a semiconductor wafer, includes a drive motor that rotates the substrate about a rotational axis. A support plate holds a pad for polishing the substrate such that the surface of the pad faces the surface of the substrate. The surface of the pad contains a catalyst, e.g., composed of a transition metal compound. A liquid that supports a catalytic reaction for polishing the substrate is supplied between the surfaces of the substrate and the pad. A reciprocating drive device causes the support plate to undergo reciprocating motion in a direction parallel to the surface of the pad by at least an amount that makes possible planarization of the substrate based on the catalytic reaction.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: February 5, 2019
    Assignees: OSAKA UNIVERSITY, TOHO ENGINEERING CO., LTD.
    Inventors: Eisuke Suzuki, Kazuto Yamauchi, Tatsutoshi Suzuki, Daisuke Suzuki
  • Patent number: 10186417
    Abstract: A coating film removing apparatus includes: a substrate holding mechanism that holds a substrate; an end surface detection mechanism that detects an end surface of the substrate; an end portion removing mechanism that removes an end portion of the coating film applied on the substrate; and a moving mechanism that moves the substrate holding mechanism or the end portion removing mechanism, wherein the end portion removing mechanism removes the end portion of the coating film applied on the substrate while the moving mechanism is relatively moving the substrate holding mechanism and the end portion removing mechanism according to the end surface of the substrate detected by the end surface detection mechanism.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: January 22, 2019
    Assignee: Tokyo electron Limited
    Inventors: Norihiko Okamoto, Makoto Yamasaki
  • Patent number: 10177024
    Abstract: A semiconductor substrate processing apparatus comprises a vacuum chamber in which a semiconductor substrate may be processed, a showerhead module through which process gas from a process gas source is supplied to a processing zone of the vacuum chamber, and a substrate pedestal module. The substrate pedestal module includes a platen, a stem having a side wall defining a cylindrical interior region thereof, a lower surface, and an upper end that supports the platen, and an adapter having a side wall defining a cylindrical interior region thereof and an upper surface that supports the stem. The lower surface of the stem includes a gas inlet in fluid communication with a respective gas passage located in the side wall of the stem and a gas outlet located in an annular gas channel in the upper surface of the adapter. The upper surface of the adapter includes an inner groove located radially inward of the gas outlet and an outer groove located radially outward of the inner groove.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: January 8, 2019
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Troy Alan Gomm, Timothy Thomas
  • Patent number: 10167571
    Abstract: A wafer carrier and methods of making the same for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition. The wafer carrier includes wafer retention pockets recessed in its body. A thermally-insulating spacer is situated at least partially in the at least one wafer retention pocket and arranged to maintain a spacing between the peripheral wall surface and the wafer, the spacer being constructed from a material having a thermal conductivity less than a thermal conductivity of the wafer carrier such that the spacer limits heat conduction from portions of the wafer carrier body to the wafer. The wafer carrier further includes a spacer retention feature that engages with the spacer and includes a surface oriented to prevent centrifugal movement of the spacer when subjected to rotation about the central axis.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 1, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, William E. Quinn, Jeffery S. Montgomery, Joshua Mangum, Lukas Urban
  • Patent number: 10161042
    Abstract: A plasma processing system has an upper electrode and a lower electrode. The upper electrode includes a first and a second upper electrode portions. The first upper electrode portion annularly surrounds the second upper electrode portion. The lower electrode includes a first and a second lower electrode portions, and the first lower electrode portion annularly surrounds the second lower electrode portion. A radio frequency (RF) power source provides RF energy to the second lower electrode portion. The lower surface of the first upper electrode portion is non-planar with a substrate-facing surface of the second upper electrode portion such that the first gap between the lower surface of the first upper electrode portion and the upper surface of the first lower electrode portion is smaller than the second gap between the substrate bearing surface of the second lower electrode portion and the substrate-facing surface of the second upper electrode portion.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: December 25, 2018
    Assignee: Lam Research Corporation
    Inventor: Rajinder Dhindsa
  • Patent number: 10160093
    Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: December 25, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
  • Patent number: 10151028
    Abstract: A film deposition apparatus includes a vacuum chamber and a turntable provided in the vacuum chamber. A concave portion is formed in a surface of the turntable to accommodate a substrate therein, and a pedestal portion is provided to support a location inside a periphery of the substrate in the concave portion. At least one communication passage is formed in a wall portion of the concave portion to cause a first space around the pedestal portion in the concave portion to be in communication with a second space outside the turntable provided in an end area of the concave portion located opposite to a first center of the turntable when seen from a second center of the concave portion. An exhaust opening is provided to evacuate the vacuum chamber.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: December 11, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Takashi Chiba, Takahito Umehara, Masayuki Hasegawa
  • Patent number: 10147628
    Abstract: An electrostatic chuck includes a base plate including a penetration hole, a cylindrical insulating component inserted in the penetration hole, the cylindrical insulating component including a protruding portion protruding from an upper end of the penetration hole, a placing table arranged on the base plate, a dent portion formed in a lower face of the placing table, the dent portion in which the protruding portion of the cylindrical insulating component is fitted, a concave portion formed in the dent portion of the placing table, an electrode formed in the concave portion of the placing table, and a power feeding terminal arranged in an inner part of the cylindrical insulating component, the power feeding terminal connected to the electrode.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: December 4, 2018
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Norio Shiraiwa, Jiro Kawai
  • Patent number: 10137528
    Abstract: A blank etching apparatus is provided that positions an etching screen relative to a blank. The blank etching apparatus includes a worktable having a table top and a base. The table top has a pair of lateral sides and a pair of longitudinal sides. A first jig is movable with respect to the table top along an x-axis. The first jig includes a first pair of lateral segments and a first pair of longitudinal segments. A screen frame is received between the first pair of longitudinal segments and the first pair of lateral segments of the first jig. The screen frame is moveable relative to the first jig and the table top along a y-axis. The screen frame receives and carries the etching screen and cooperates with the first jig to accurately and repeatably position the etching screen relative to the blank.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: November 27, 2018
    Assignee: AUTODIE LLC
    Inventors: Scott R. McCallum, Charles Slagter, Jordan A. Klein, James K. Feutz
  • Patent number: 10134614
    Abstract: A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: November 20, 2018
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Yasunari Suto, Hirofumi Ichihara, Kenya Ito, Tamami Takahashi