Abstract: A composite deposit in which insoluble particles are co-deposited and dispersed in a metal matrix is formed on an article by dipping the article in a metal plating solution having insoluble particles dispersed therein and effecting an electroplating or chemical plating process. By adjusting the specific surface area of insoluble particles to be dispersed in the metal plating solution, the amount of insoluble particles co-deposited in the composite deposit can be controlled. Better results are obtained with insoluble particles having a specific surface area of 10 m.sup.2 /g or less.

Abstract: A method for making an x-ray mask having a low-stress absorber layer. A substrate is placed in an electroplating system and an electroplating solution is provided to the electroplating system. The electroplating solution has a gold sulfite based component and a thallium based component. The thallium based component is at a concentration of at least 20 milligrams per liter of electroplating solution. A gold containing absorber layer is electrodeposited onto the substrate. A high concentration of thallium produces an absorber layer insensitive to the brightener concentration in the electroplating solution and having a stress less than approximately 1.times.10.sup.8 dynes/cm.sup.2. In addition, the absorber has a small grain size, a low surface roughness, and a low defect density. Thus, the absorber layer is easier to inspect and, if required, to repair.

Abstract: A process for laser patterning of a substrate so that it can be subsequently electroplated or electrolessly plated. The process utilizes a laser to treat an inactive (inert) layer formed over an active layer to either combine or remove the inactive layer to produce a patterned active layer on which electrodeposition can occur. The process is carried out by utilizing laser alloying and laser etching, and involves only a few relatively high yield steps and can be performed on a very small scale.

Abstract: In a method of producing metallic lead from a material including lead dioxide and/or metallic lead, including a step for dissolving the lead contained in the material and an electrolysis step for the cathodic deposition of the dissolved lead, the dissolving step is carried out with the use of an acid electrolyte in the presence of a redox couple which has a potential between its oxidised and reduced oxidation states such as to reduce the lead dioxide and/or oxidise the lead and which can be regenerated during the step for the electrochemical deposition of the dissolved lead. The method is used, in particular, for the production of lead from the active material of spent accumulators.

Abstract: A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

Abstract: In the manufacture of a silicon-containing iron sheet for electrical applications consisting of 0.1-8% by weight Si, optionally up to 1% by weight Al, remainder iron and unavoidable impurities, iron sheet is made by electrodeposition, and silicon or a silicon-containing material is incorporated in the electro-deposited iron sheet. The silicon-containing material may be included in the electrolyte, becoming embedded during the electro-deposition in the iron sheet. The method can be performed without a step of thickness reduction of the iron sheet made by electro-deposition. The sheet is annealed to homogenize the silicon content.

Abstract: A method of forming holes extending perpendicular to a first surface of a workpiece comprises providing the substrate wafer of n-doped, single-crystal silicon, and then electrochemically etching the substrate wafer to form a structured layer having the desired perforations. The electrochemical etching particularly occurs in a fluoride-containing electrolyte, and the substrate wafer is connected as an electrode. If the process parameters are maintained, the electrochemical etching will produce holes having a constant, substantially uniform cross section. However, varying the process parameters can cause changes in the cross section of the hole adjacent a base of the hole so that it is possible to enlarge the hole to facilitate stripping the workpiece as a lamina from the substrate.

Abstract: A method for separating an electroformed article from a mandrel comprising: (a) masking a portion of a mandrel with a mask comprising an electrically nonconductive outer surface; (b) electroforming an article on the mandrel wherein the electroforming material is deposited on the mandrel surface but fails to adhere to the nonconductive outer surface of the mask, whereby the end of the electroformed article is adjacent to the mask; and (c) removing the article from the mandrel by either: (i) pushing the mask against the end of the article to effect movement of the article in the direction of separation; or (ii) removing the mandrel while keeping the mask stationary, whereby the end of the article pushes against the mask during withdrawal of the mandrel.

Abstract: Disclosed is a method for increasing the molar ratio of aluminum to chlorine in a polyaluminum chloride solution by the electrochemical dissolving of aluminum, including contacting a polyaluminum chloride solution having a molar ratio of aluminum to chlorine of equal to or greater than 0.5 with a galvanic element. The galvanic element includes metallic aluminum and an electrochemically more noble metal. Contact is maintained until the aluminum to chlorine ratio is increased to the desired level.

Abstract: A process for the production of a printed wiring board, which comprises preparing a copper-clad laminate having a through-hole formed by drilling; providing a first resist pattern on the surface of the copper-clad laminate so as to cover a portion to be formed as a conductor pattern; etching the copper-clad laminate; removing the first resist pattern; subjecting the whole laminate to an electroless copper plating; laminating a dry film resist on the copper-clad laminate; exposing and developing the dry film resist to form a second resist pattern in such a manner that the through-hole and a portion to be plated are exposed; subjecting the exposed portions to an electrolytic copper plating; removing the second resist pattern; and removing the exposed electroless copper plating through etching.

Abstract: A process for producing a structure including an anodic film exhibiting a colored pattern, and the resulting structures. The process involves anodizing a surface of a metal substrate or article made of or coated with aluminum or an anodizable aluminum alloy to produce an anodic film, preferably having pores extending from the film surface inwardly towards the underlying metal. A semi-reflective layer of a non-noble metal is then deposited within the pores of the film in order to generate a color by effects including light interference. Limited areas of the resulting film are then contacted with a solution of an acid or other leaching material, preferably by a maskless procedure, in order to leach the non-noble metal from the film, at least partially. The film is then contacted by a solution of a more noble metal compound (e.g. Pd, Au or Pt). The more noble metal from the solution at least partially replaces the non-noble metal remaining in or on the film and stabilizes the deposits against further leaching.

Abstract: Wax, alloy or plastic molds for containers used in hot isostatic pressing of metal and/or ceramic powders are surface conditioned for electroplating, coated with several metallic layers and removed from the resulting container.

Abstract: A cleaning agent is used to wash surfaces of aluminum products in a cleaning bath. The cleaning agent is a water-soluble acid containing ferric ions. During the cleaning process, the ferric ions are reduced to ferrous ions. The used cleaning agent is sent to an electrolytic tank so that the ferrous ions are subject to the electrolytic oxidation to be converted into ferric ions. The regenerated cleaning agent is returned to the cleaning bath.

Abstract: A method of manufacturing a copper-polyimide substrate, includes hydrophilicating the surface(s) of a polyimide film, applying a catalyst thereto, subjecting the film to electroless plating, heat-treating it in an inert atmosphere, and subjecting it to electroless copper plating or to electroless copper plating followed by electrolytic copper plating. The hydrophilication of the surface(s) of the polyimide film is effected with an aqueous solution containing a hydrazine hydrate and an alkali metal hydroxide or with an aqueous solution containing a permanganate and/or a hypochlorite, then a catalyst is applied to the surface(s) by an ordinary way, then the surface(s) is/are subjected to electroless plating with any one of nickel, cobalt nickel alloys or cobalt alloys to form a plated layer thereon having a thickness of from 0.01 to 0.1 .mu.

Abstract: An electrolyte containing a tetravalent salt of titanium in a methanesulfonic acid solution. A reducing agent consisting of trivalent titanium in the same solution. A cell wherein the catholyte is the above electrolyte. The reduction of tetravalent titanium into trivalent titanium by electrolysis. Simultaneous reduction of tetravalent titanium into trivalent titanium and oxidation of trivalent cerium to tetravalent cerium by electrolysis is also disclosed. Reduction of organic compounds using trivalent titanium in methanesulfonic acid.

Abstract: An apparatus for electroplating, particularly in the production of metal matrices for manufacturing articles of plastic, such as compact discs, said apparatus comprising a container having a peripheral wall and opposed first and second end walls so as to form a plating space therein, adapted to house an electrolyte, and an anode, a carrier with an electrically conductive surface to be plated forming the cathode and means being arranged between the anode and the cathode for providing a flow of electrolyte from said cathode towards said anode. For allowing a faster production of metal matrices with better quality it is suggested according to the invention that the peripheral wall is formed with an internal contour which substantially corresponds to the surface to be plated, said carrier forming the second container end wall which through intermediate current supply members is sealingly urged against the mating edge of the peripheral wall, while the anode is located adjacent said first end wall of the container.

Abstract: The bulk material is transportable in an electrolyte in the conveying trough of a vibrator conveyor. The perforated conveying trough constitutes one of the two electrodes. According to the invention, the polarity of the conveying trough (21) and of the other electrodes (36 to 39) is reversible. The conveying trough (21) and the other electrodes (36 to 39) may be fastened preferably on common supporting stringpieces (22 to 27), which serve at the same time as power lead for one of the two electrodes and are connected with the central pipe (2). With this design the life of the other electrodes (36 to 39) is lengthened.

Abstract: A method and apparatus for continuously forming printed circuits, the apparatus including a cylindrical drum rotatable about a generally vertical axis and a tank for holding an electrolytic plating solution. The tank is dimensioned to surround a lower portion of the drum and immerse the lower portion of the drum in the electrolytic plating solution. Means for introducing electrolytic solution into the tank are provided, and a plurality of metallic anodes are disposed within the tank surrounding and facing the lower portion of the drum defining a generally uniform gap therebetween. A plurality of cathodes are disposed above the tank and facing an upper portion of the drum, the cathodes being biased toward the drum. The apparatus is adapted to receive a movable continuous flexible web having a thin layer of conductive metal on one side thereof. The metal layer is masked to expose a plurality of patterns aligned along the web and a continuous strip of exposed metal along one edge of the web.

Abstract: A method and apparatus are disclosed for producing copper wire by electrolytically engrossing a copper starting wire. Basically the invention utilizes an electrolytic tank employing a pair or pairs of shafts positioned externally of the tank upon which a minimum of one but generally at least two starting wires are transported on each pair for transfer of the wires through the tank. Multiple tanks, e.g., 10 to 1000 or more, may be used in a single facility for refining or electrowinning processes depending on the quantity of copper wire desired to be produced.

Abstract: Disclosed are electro-plated steel sheets having a primer coating composed of 5 to 30% by weight of Cr, 0.005 to 5% by weight of cation polymer, with the balance being Zn, with or without a further Zn or Zn-alloy coating formed on the primer coating. The primer coating may contain fine particles of oxides and/or iron-group metals, and may further be applied with a chromate film and/or an organic coating. Also disclosed is the process for producing an electro-plated steel sheet having excellent corrosion resistance and surface brightness, comprising performing electro-plating in an acidic Zn plating bath containing Cr ions and cation polymer, with the ratioof Cr.sup.6+ ions/Cr.sup.3+ ions being not more than 0.1.