Patents Examined by Tai Van Nguyen
  • Patent number: 7555828
    Abstract: A read sensor for a magneto resistive head is formed through the use of a bilayer lift-off mask. According to one embodiment, a release layer is formed on top of a sensor layer. A silicon-containing resist layer is formed over the release layer. The resist layer is patterned according to the desired dimensions of the read sensor. Then, plasma etching, such as oxygen plasma etching, is used to remove the portion of the release layer that is exposed by removal of resist material. The release layer may be etched to undercut the patterned resist layer, or may entirely removed beneath the patterned resist layer to provide a bridge of the resist material. In either case, isotropic plasma etching, anisotropic plasma etching, or some combination thereof may be applied.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: July 7, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Gregory Breyta, Mark Whitney Hart, Bulent Nihat Kurdi, Dennis Richard McKean, Alfred Floyd Renaldo, Douglas Johnson Werner
  • Patent number: 7401398
    Abstract: A magnetic element for multi-phase is composed by burying a plurality of coils in a composite magnetic material such that a negative coupling of magnetic fluxes or a positive coupling of magnetic fluxes exists between at least two coils. This structure more miniaturizes inductors, or choke coils as the multi-phase magnetic element suitably used for application of a large current to many kinds of electronic equipment. Such multi-phase magnetic element has an excellent ripple current property.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: July 22, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuya Matsutani, Hidenori Uematsu, Tsunetsugu Imanishi
  • Patent number: 7398593
    Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like foil by a constant lenght toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: July 15, 2008
    Assignee: Showa Denko K.K.
    Inventors: Hiroshi Nitoh, Toshihiro Okabe, Kenji Ishii, Atsushi Sakai
  • Patent number: 7383628
    Abstract: Disclosed is a punch tool which is used to create apertures at any desired location in a raceway duct. The punch tool has two opposed jaws. A first jaw has an angularly-truncated tubular blade. The other jaw has a tube-shaped blade receiving device which receives the blade when it cuts through the wall. The use of this tool with the methods of the present invention enables the user to make cable drops at any position along the duct in order to reach computing equipment below.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: June 10, 2008
    Assignee: Sprint Communications Company L.P.
    Inventors: Dough Robinett, Todd Daugherty
  • Patent number: 7373718
    Abstract: A test device for a heat dissipating fan, which is suitable for testing if the fan wheel is secured to the housing firmly, includes a support post, a transverse slide unit, which is disposed at the top of the support post and provides a transverse slide seat, a vertical slide unit, which is disposed at the transverse slide seat and provides a vertical slide seat. Further, the test device provides a clamping unit, a suction unit and a sensing element, which are moved with the vertical slide seat. The clamping unit clamps the housing and the suction unit absorbs the fan wheel. The heat dissipating fan is admitted in case of the sensing unit sensing the fan wheel being incapable of moving upward under the suction force and is carried away by the transverse slide unit in case of the sensing unit sensing the fan wheel being capable of moving upward under the suction force.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: May 20, 2008
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chun-Pin Lin
  • Patent number: 7370404
    Abstract: A spin valve sensor in a read head has a spacer layer which is located between a self-pinned AP pinned layer structure and a free layer structure. The free layer structure is longitudinally stabilized by first and second hard bias layers which abut first and second side surfaces of the spin valve sensor. The AP pinned layer structure has an antiparallel coupling layer (APC) which is located between first and second AP pinned layers (AP1) and (AP2). The invention employs a resetting process for setting of the magnetic moments of the AP pinned layers by applying a field at an acute angle to the head surface in a plane parallel to the major planes of the layers of the sensor. The resetting process sets a proper polarity of each AP pinned layer, which polarity conforms to processing circuitry employed with the spin valve sensor.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: May 13, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hardayal Singh Gill, Jinshan Li, Kenneth Donald Mackay, Kouichi Nishioka, Andy Cuong Tran
  • Patent number: 7370396
    Abstract: An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode arranged on a surface of the piezoelectric material layer on the substrate side. The piezoelectric material layer is sandwiched between the first electrode and the second electrode. The first electrode has a smaller surface area than the piezoelectric material layer. A portion where the piezoelectric material layer is exposed from the first electrode includes a portion that is thinner than a thickness of the piezoelectric material layer between the first electrode and the second electrode.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: May 13, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiko Namba, Keiji Onishi, Katsu Takeda
  • Patent number: 7367095
    Abstract: Embodiments of an acoustically-coupled transformer have a first stacked bulk acoustic resonator (SBAR) and a second SBAR. Each of the SBARs has a lower film bulk acoustic resonator (FBAR) and an upper FBAR, and an acoustic decoupler between the FBARs. The upper FBAR is stacked atop the lower FBAR. Each FBAR has opposed planar electrodes and a piezoelectric element between the electrodes. The piezoelectric element is characterized by a c-axis. The c-axes of the piezoelectric elements of the lower FBARs are opposite in direction, and the c-axes of the piezoelectric elements of the upper FBARs are opposite in direction. The transformer additionally has a first electrical circuit connecting the lower FBAR of the first SBAR to the lower FBAR of the second SBAR, and a second electrical circuit connecting the upper FBAR of the first SBAR to the upper FBARs of the second SBAR.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: May 6, 2008
    Assignee: Avago Technologies General IP Pte Ltd
    Inventors: John D. Larson, III, Yury Oshmyansky
  • Patent number: 7363702
    Abstract: A working system for a circuit substrate enabling a control of stopping the substrate without inconvenience. A PWB detector 308 held by a Y-axis slide 252 of an XY robot 266 moving a component mounting head, has reflection type photoelectric sensors 310, 312 spaced from each other in a direction of conveyance of a PWB 12 by a conveyor 14. When the PWB 12 carried in the system, the sensors 310, 312 are moved to a position corresponding to a downstream-side edge of the PWB 12 stopped at a predetermined stop position. The PWB 12 is decelerated when detected by one of the sensors on the upstream side, and stopped at a desired position regardless of its shape, dimensions and conveying direction, when detected by the other or downstream sensor. Electronic circuit components 16 can be supplied to plural kinds of PWBs 12 with one component supply device.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: April 29, 2008
    Assignee: Fuji Machine MFG. Co., Ltd.
    Inventor: Toshihiro Kondo
  • Patent number: 7363697
    Abstract: A system and method for the production level screening of low flying magnetic heads in the manufacture of disk drive head disk assemblies (HDAs) is disclosed. A test disk is provided and has a plurality of bumps extending from at least one surface thereof. The test disk is rotated to fly a head of a head gimbal assembly selected from the group adjacent the surface of the test disk. An interaction of the head with one or more of the plurality of bumps may be sensed and the head gimbal assembly may be screened out from the group in response to the sensing of the interaction.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: April 29, 2008
    Assignee: Western Digital (Fremont), LLC
    Inventors: Victor K. F. Dunn, Ciuter Chang
  • Patent number: 7360303
    Abstract: There are proposed a manufacturing method of a winding assembly of a rotating electrical machine using a rotation block and a fixed block and a manufacturing apparatus used for the same. The rotation block includes a rotation surface rotatable around a rotation axis, and the fixed block includes a first surface and a second surface opposite to each other and a shaping surface. The shaping surface is formed between end parts of the first and the second surfaces, is made to have an almost semicircular shape with the rotation axis as the center, and extends along the rotation axis. Plural wire rods are simultaneously fed from the first surface of the fixed block to the rotation surface of the rotation block, and the wire rods positioned on the rotation surface are bent by rotation of the rotation block.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: April 22, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yutaka Hirota, Norihiro Murata, Toshiaki Kashihara
  • Patent number: 7356894
    Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: April 15, 2008
    Assignee: Fujitsu Limited
    Inventors: Masanao Fujii, Toru Okada, Masayuki Kitajima, Hidehiko Kobayashi, Seiichi Shimoura
  • Patent number: 7356905
    Abstract: Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: April 15, 2008
    Assignee: Riverside Research Institute
    Inventors: Jeffrey A. Ketterling, Mary Lizzi, legal representative, Frederic L Lizzi
  • Patent number: 7353604
    Abstract: A method for manufacturing an inkjet head includes producing a flow path unit, producing an actuator unit, bonding the actuator unit with the flow path unit to produce a bonded structure; measuring a frequency characteristic of impedance of the piezoelectric structure of the bonded structure in each of regions facing at least one of the pressure chambers, and determining whether or not the bonded structure is a good product on a basis of at least one of a distribution of (Fa?Fr) in the plural regions where Fa represents antiresonance frequency of each region at which impedance of each region are maximal and Fr represents resonance frequency of each region at which impedance of each region is minimal, a distribution of Fr in the plural regions, and a distribution of Zr in the plural regions, where Zr represents impedance of each region at the resonance frequency of each region.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: April 8, 2008
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Atsushi Hirota, Shin Ishikura
  • Patent number: 7350289
    Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shoriki Narita, Shuichi Hirata, Kanji Hata, Hirokuni Miyazaki, Youhei Matsumoto
  • Patent number: 7346980
    Abstract: A press-connecting head of a pair of press-connecting pliers for connecting a coaxial terminal, it is composed of an inserting/retracting member and two pressing dies respectively provided on two mutually opposite sides of the inserting/retracting member; wherein the inserting/retracting member is assembled with the press-connecting pliers by an inserting mode, hence by a simple action of inserting/retracting, different pressing dies of the same press-connecting head can be mutually changed to be exactly aligned with a fixed block, or the press-connecting head can be changed for another one with pressing dies of other specifications. And then the press-connecting pliers using the press-connecting head structure can allow execution of press-connecting operation of the coaxial terminals of different specifications with a coaxial signal line; thus the range of application of the press-connecting pliers can be enlarged.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: March 25, 2008
    Assignee: Hanlong Industrial Co., Ltd.
    Inventor: Chien-Chou Liao
  • Patent number: 7343679
    Abstract: A manufacturing method for manufacturing a liquid ejection element substrate for a liquid ejection element for ejecting liquid through an ejection outlet, the liquid ejection element substrate including an energy generating element for generating energy for ejecting the liquid and an electrode for supplying electric power to the energy generating element, includes a step of forming on a front side of the substrate an energy generating element and wiring electrically connecting with the energy generating element; a step of forming a recess in the form of a groove on the side of the substrate at a position where the wiring is formed; a step of forming an embedded electrode electrically connected with the wiring by filling electrode material in the recess; and a step of thinning the substrate at a back side after formation of the embedded electrode to expose the embedded electrode at the back side of the substrate, thus providing an electrode exposed at the back side of the substrate.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: March 18, 2008
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hirokazu Komuro
  • Patent number: 7345403
    Abstract: A method of manufacturing a lamination-type piezoelectric element includes forming a ceramic laminated body in which ceramic layers and inner electrode layers are alternately laminated on each other. A pair of outer electrodes are respectively joined to a pair of joining faces formed on an outer circumferential face of the ceramic laminated body. A belt-shaped outer circumferential groove portion coming into contact with an outer circumferential end portion of at least some part of the inner electrode layers is formed on the outer circumferential face of the ceramic laminated body. This outer circumferential groove portion has at least one dent portion protruding from the adjoining portion. The outer circumferential groove portion has at least one of an insulating portion made of insulating material and a conductive portion made of conductive material.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: March 18, 2008
    Assignee: Denso Corporation
    Inventors: Akio Iwase, Tetuji Itou, Toshio Ooshima, Shige Kadotani
  • Patent number: 7343664
    Abstract: A method for fabricating a magnetic head includes forming a first pole and a flux shaping layer in spaced relation to the first pole. A nonmagnetic layer is formed adjacent the flux shaping layer and positioned on an air bearing surface (ABS) side of the flux shaping layer. A tapered recess is created in the nonmagnetic layer, the taper of the recess increasing (i.e., becoming deeper) towards the flux forming layer. The recess is filled with a magnetic material. A probe layer is formed such that it is in electrical communication with the magnetic material filling the recess.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: March 18, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Gautam Khera, Sanford J. Lewis, Galina Moutchaidze, Aron Pentek, Hugo Alberto Emilio Santini, Mason Lamar Williams, III
  • Patent number: 7340826
    Abstract: A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.
    Type: Grant
    Filed: December 9, 2004
    Date of Patent: March 11, 2008
    Assignee: Infineon Technologies AG
    Inventors: Harry Hedler, Jörg Zapf