Patents Examined by Taylor J. Ross
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Patent number: 4801061Abstract: A system for fastening cable to a support system using an insulated, protective housing that has surface penetrating fastening devices mounted thereon in such a manner so as to allow a multiplicity of housings to be positioned, discharged and applied in a uniform automated process. The applicator has a base plate with a slot that cooperates to position the housings slightly above the support surface with a portion of the cable passing through the slot.Type: GrantFiled: May 15, 1986Date of Patent: January 31, 1989Inventor: Peter G. Mangone, Jr.
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Patent number: 4801064Abstract: Interlocking means are provided on the front and rear surfaces of adjacent clips to restrain relative movement between adjacent clips in one direction and to permit relative guided movement between adjacent clips in another direction and wherein the restraint of the relative movement is maintained for at least a substantial portion of the movement of the one of the adjacent clips toward a secured position on the support surface. Also, each clip has at least one bore means having first and second cross-sectional configurations so as to provide a shoulder and a surface penetrating fastening device having an enlarged head portion located in the bore means so that, when a force is applied to the surface penetrating fastening device to drive the surface penetrating fastening device into the support surface, the enlarged head will contact the shoulder so that the clip is firmly held in position on the support surface.Type: GrantFiled: December 3, 1985Date of Patent: January 31, 1989Inventor: Peter G. Mangone, Jr.
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Patent number: 4799314Abstract: A mounting method for printed circuit boards provides improved electromagnetic interference reduction while minimizing the required number of mounting screws. A conductive base plate formed with supporting members is configured to mate with a grounding circuit on the board. A central mounting screw places the board in compression to provide electrical continuity between the grounding circuit and the supporting members of the conductive plate.Type: GrantFiled: July 2, 1987Date of Patent: January 24, 1989Assignee: Unisys CorporationInventor: Ralph Lake
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Patent number: 4797994Abstract: Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to be bound is held in a second plane which is below and substantially parallel to the first plane. A die eject head located above the sawn wafer cooperates with a die bond head located between the wafer and the substrate to remove an individual die from the sawn wafer. The die bond head then rotates about an axis which is parallel to both planes and places the die on the lead frame. Also included is a transducer means which is responsive to electrical stimulus for actuating the die eject head and the die bond head such that the interactive force between the heads and the component may be precisely controlled.Type: GrantFiled: March 21, 1988Date of Patent: January 17, 1989Assignee: Kulicke & Soffa Industries, Inc.Inventors: Gerard H. Michaud, James H. Graham, Roger P. Stout
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Patent number: 4797992Abstract: A method of forming a microwave integrated circuit is disclosed. A hole is bored in an alumina substrate and a plug having a diameter substantially equal to the hole is provided. The hole and the perimeter of the plug are coated with a thermally fusable dielectric composition and the plug is embedded in the hole. Heating the substrate fuses the plug is place and crystalizes the composition into a glass with compatible thermal expansion. At least one face of the substrate and plug are then polished to provide a planar surface. The metalized circuit is then formed on this assembly, which minimizes conductive tracking on the substrate and facilitates alignment of the circuit with the plug.Type: GrantFiled: December 28, 1987Date of Patent: January 17, 1989Assignee: Hercules Defense Electronics Systems Inc.Inventors: Vernon B. Powers, Deborah C. Murphy
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Patent number: 4794691Abstract: A simple and highly effective method and apparatus for field terminating flat power cable such as used in undercarpet wiring systems. Each conductor, with tightly bonded insulation, of a multi-conductor flat power cable is (at the point of installation in-situ) slotted or cut through with thin narrow slots which leave corresponding narrow rectangular openings through the insulation and conductor. Then a thin conductive device or terminal with corresponding ribs which easily though precisely fit into the slots, is placed in the slot openings, is secured in place on the cable by a suitable means, and the assembly then crimped or flattened together to give a pressure-tight high-conductivity, electrically stable termination only about twice as thick as the insulated conductor. The applicator tooling may be a simple punch and die, and a hammer or pliers. An insulating "bandage" is applied over the termination and bonded to the conductor insulation thereby giving a water-tight joint impervious to corrosion.Type: GrantFiled: October 2, 1986Date of Patent: January 3, 1989Inventor: Edward P. Brandeau
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Patent number: 4793054Abstract: A permanent magnet motor for use in such electrically-powered devices as appliances, power tools, and the like includes a longitudinally-split cylindrical ferromagnetic wrapper having an inner diameter normally less in its free state than the outer cross-sectional dimension of a permanent magnet array. During assembly of the motor, the split wrapper is expanded to fit around the magnet array, and then is allowed to contract to urge the magnet array radially inwardly against cooperating surfaces formed on each of two end caps. This maintains a predetermined orientation or alignment of the magnet array relative to the armature, including, for example, a predetermined air gap between the magnet array and the armature. Accordingly, the conventional requirement for such additional retention mechanisms as spring clips, adhesives, fasteners, and the like, is eliminated.Type: GrantFiled: June 12, 1987Date of Patent: December 27, 1988Assignee: Black & Decker Inc.Inventors: Salvatore R. Abbratozzato, Richard T. Walter, Dale K. Wheeler
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Patent number: 4791721Abstract: A singulation system wherein a multiplicity of circuit board members, or the like, can be fabricated by assembling components in a predetermined array on a large planar board-like member with portions of the large member defining independent circuit board assemblies which are separated from each other by intervening slots. The system includes readily adjustable punch and die plate members and accomodating platens which accomplish separation of the independent board assemblies from the large board arrangement without damage to the components mounted thereon.Type: GrantFiled: February 19, 1987Date of Patent: December 20, 1988Assignee: Wand Tool CompanyInventors: William N. Anderson, Thomas G. Anderson
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Patent number: 4790067Abstract: Apparatus for connecting a coaxial cable to a connector having a base for connection to a conductive shield of the cable via a solder ring within a heat-shrinkable tube, the apparatus including a first fixture for engaging an end of the coaxial cable and connector and a first heater mountable in a predetermined position with respect to the fixture for directing a controlled amount of heat to the solder and heat-shrinkable tube.Type: GrantFiled: June 5, 1987Date of Patent: December 13, 1988Assignee: Teradyne, Inc.Inventor: Daniel E. Grindle
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Patent number: 4790069Abstract: The present invention relates to a method and apparatus for mounting an electronic part (11) on a circuit board (28). When the part is mounted, a distance between the under surface of a part maintaining section (12) and the circuit board (38) is measured. Determination that the electronic part (11) is normally mounted on the circuit board (28) is made by comparing the measured distance with the thickness of the electronic part (11) measured in advance.Type: GrantFiled: April 28, 1986Date of Patent: December 13, 1988Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masahiro Maruyama, Eiji Itemadani, Kazuhiro Mori, Mikio Hasegawa
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Patent number: 4788766Abstract: A method of fabricating a multilayer circuit board assembly capable of operating at microwave frequencies. Specifically, multilayer circuits such as complex beam forming networks and antennas having internal via holes may be fabricated in a single bonding cycle. This is accomplished by first preparing individual circuit boards (10) by pre-forming holes (18) through circuitry (14,16) etched on opposite sides of a substrate (12). The holes (18) are next selectively plated with a conductive layer (20) and then with a material (24) capable of forming a melted fusion bond and/or a solid-state fusion bond. Bonding film (56) is placed between each board-to-board interface of a multi-board assembly and the assembly of boards is subjected to a bonding cycle of heat and pressure wherein an integral unit is effected.Type: GrantFiled: May 20, 1987Date of Patent: December 6, 1988Assignee: Loral CorporationInventors: Henry A. Burger, Harold E. White
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Patent number: 4786260Abstract: An electrical cable assembly comprising a multi-conductor cable having an end portion terminating in a multi-contact connector which includes a rigid shielding shell of electrically conductive material disposed to receive therein a dielectric insert for supporting a plurality of terminal contact members secured to respective conductors in the cable. The dielectric insert comprises a trough-like body and a cover for disposing over the opening of the body, the cover and an opposing bottom wall of the body being provided with respective similar pluralities of mutually spaced holes wherein the terminal contact members are installed. The cover is provided with a plurality of flexible tabs which engage respective ramp portions of the body for locking the cover on the body to form a unitary terminal-supporting structure prior to assembly in the rigid shielding shell of the connector.Type: GrantFiled: March 18, 1988Date of Patent: November 22, 1988Assignee: Switchcraft, Inc.Inventor: Tedford H. Spaulding
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Patent number: 4785532Abstract: A connector assembly for an anti-skid hydraulic braking system comprises a bulkhead connector extending through an aperture in a sidewall of the brake fluid reservoir, a connector harness mounted along the inside of the reservoir sidewalls extending from the bulkhead connector to three solenoid assemblies mounted on the reservoir floor, and a solenoid connector one each solenoid assembly in engagement with the connector harness. The solenoids extend through floor apertures into the master cylinder to respective hydraulic lines extending to brake cylinders in the wheels, one of the solenoids handling both rear wheels. The bulkhead connector mates with a connector outside the reservoir which is terminated to a wire harness connected to the on-board microprocessor to relay current to the solenoids when data from individual wheel speed sensors is processed to determine that a particular wheel is about to skid.Type: GrantFiled: June 29, 1987Date of Patent: November 22, 1988Assignee: AMP IncorporatedInventors: Michael D. Galloway, William H. Rose, David T. Shaffer
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Patent number: 4785530Abstract: A hand tool for assisting in the manual closure of integrated circuit (IC) storage and shipping cartridges, includes a base and a shank extending normal from one end of the base and terminating at a grip or stop formation. A pair of tines extends normal from another end of the base, along a direction of the shank. A hinged flap is mounted next to the second end such that it is rotatable to assume a position spaced parallel and extending along the tines. In use, the tines are inserted into an open end of a cartridge full of ICs, with the shank lying along the outer edge of the cartridge and thereafter pressure is manually applied via the tines against an IC to clear a pair of holes in the cartridge and permit insertion of a closure pin through the holes and between the tines. The flap is positioned against the pin to assist in driving the pin into an interference fit. After the pin is inserted the ICs are firmly retained in the cartridge in the well known and desired manner.Type: GrantFiled: July 20, 1987Date of Patent: November 22, 1988Assignee: Northern Telecom LimitedInventor: Herbert Tomlinson
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Patent number: 4786084Abstract: The present invention is directed to a photocopy prevention film applied to a document to be protected that comprises either a volume holographic refraction grating or a surface holographic refraction grating. The refraction grating is bonded to a document and either causes normally scattered light to be focused toward the photoreceptors of a photocopy machine or causes light normally reflected toward the receptors to be scattered away from the receptors. The film is created by splitting a coherent laser beam into a reference beam and a target beam. The target beam reflects off of a special target and onto a photographic emulsion. The reference beam is also incident to the photographic emulsion. The beam reflected from the target and the reference beam create interference planes within the emulsion which can be developed to create differing refractive index planes within the emulsion or etched away to create a surface grating.Type: GrantFiled: November 18, 1985Date of Patent: November 22, 1988Assignee: Copyguard, Inc.Inventors: James L. Karney, Roland Handy
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Patent number: 4783894Abstract: A lock plates inserting machine and a method of automatically and mechanically inserting a plurality of lock plates into corresponding openings defined in the key cylinder. The lock plates inserting machine includes a key holder having a plurality of grooves corresponding to respective serrations of a key to be inserted. At least one key serrations detecting member having a key serrations detecting convex portion is inserted into one of the grooves of the key holder. At least one slide member is slidable upon pivotal movement of the key serrations detecting member and upon concave portions equal in number to the different sizes of the key serrations. A plurality of first push members corresponding to respective concave portions of the slide member are positioned so that a proper one of the first push members is inserted into its corresponding concave portion of the slide member in accordance with the slide members's position.Type: GrantFiled: August 20, 1986Date of Patent: November 15, 1988Assignee: Kabushiki Kaisha Tokai Rika Denki SeisakushoInventors: Terumoto Yamaguchi, Akira Kominami
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Patent number: 4782576Abstract: For adjustment of the relative positions of two machine parts, at least one of the machine parts is provided with projections outwardly formed by stamping, the projections having contact surfaces which lie against the other machine part. The adjustment is performed by setting the projections back under the influence of a pressing force according to requirements. By this operation a relatively large contact surface can be provided. The deformation process takes place exclusively in the transition region between the projection and the rest of the machine part. The restoring forces are relatively small and relatively constant over the entire restoring range.Type: GrantFiled: February 17, 1987Date of Patent: November 8, 1988Assignee: SKF GmbHInventors: Manfred Brandenstein, Horst M. Ernst
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Patent number: 4780958Abstract: A contact terminal for insertion into a plated through-hole of a printed circuit board is formed from thin metal stock of uniform thickness with a tubular compliant mounting section. A plurality of slits are spaced around the mounting section, and along one side of each slit are a pair of outward projections to engage the wall of the plated through-hole so that the metal on one side of each slit is deflected radially inwardly by the plated through-hole when the terminal is inserted, to mechanically secure the terminal therein. Outer edges of the projections along the slits penetrate the plating material during insertion. A method for making such a terminal includes piercing the mounting portion area of the blank, forming slits therein, forming projections along one side of each slit to extend out of the plane of the blank, and rolling at least that portion of the terminal into a tubular shape so that the pairs of projections extend radially outwardly.Type: GrantFiled: February 4, 1988Date of Patent: November 1, 1988Assignee: AMP IncorporatedInventor: Howard R. Shaffer
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Patent number: 4779338Abstract: A method of mounting an LSI or IC on a wiring circuit substrate by hot-pressing which comprises the steps of placing the pins of the LSI or IC on a heat sealant printed over the circuit pattern of the substrate, placing a film sheet on the entire or partial surface of the LSI chip or IC chip including the pins of the chip, and carrying out a hot-pressing operation on the film sheet.Type: GrantFiled: January 22, 1987Date of Patent: October 25, 1988Assignee: Sharp Kabushiki KaishaInventors: Ichirou Kohara, Kazuhito Ozawa
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Patent number: 4779341Abstract: An installation tool comprising an elongated shaft having a threaded section and a blunt section, the tool having a threaded opening in one end and a hex opening in the other end. The installation tool is used to assemble a loadbreak reducing tap plug including a threaded mounting bolt mounted in the threaded end of the plug, and a threaded cable connector mounted in a visible-break "T" type connector housing, by the following method. Turning the threaded mounting bolt into the threaded opening of the installation tool. Turning the tool threaded section into the cable connector. Turning the tap plug into the cable connector. And removing the tool from the cable connector.Type: GrantFiled: October 13, 1987Date of Patent: October 25, 1988Assignee: RTE CorporationInventor: Paul M. Roscizewski