Patents Examined by Teresa J. Walberg
  • Patent number: 7819177
    Abstract: A heat exchanger assembly includes a first single-piece manifold and a second single-piece manifold spaced from and parallel to the first single-piece manifold. Each of the first and second single-piece manifolds has a tubular wall defining a flow path. A plurality of flow tubes extend in parallel between the first and second single-piece manifolds and are in fluid communication with the flow paths. An insert having a distribution surface is slidably disposed in the flow path of the first single-piece manifold to establish a distribution chamber within the first single-piece manifold. A series of orifices defined in the distribution surface of the insert are in fluid communication with the flow path and the distribution chamber for uniformly distributing a heat exchange fluid between the flow path and the flow tubes.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: October 26, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Henry Earl Beamer, Robert Michael Runk
  • Patent number: 7819175
    Abstract: A method and incorporated hybrid air and liquid cooled heat sink that is provided for cooling electronic components. The heat sink comprises a finned structure having fins positioned for air to pass easily through them. The finned structure is flanked by a heat source plate on one side (closer to direction of heat flowing from electronic components) and a second plate on its opposing side such that both of the plates are in thermal communication with fin tips and fin base of the finned structure. The heat source plate itself is composed of two complementary halves with fins on each half. When brought together, the two halves form a unitary, fluid sealed plate while allowing passage of fluids through it by allowing the fins on each half to create and interleaving structure. A fluid re-circulator is also disposed at least partially in the plates for circulating fluids though the plates and the finned structure such that both fin tips and fin base are cooled.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: October 26, 2010
    Assignee: International Business Machines Corporation
    Inventor: Randy J. Zoodsma
  • Patent number: 7814966
    Abstract: A heat exchanger system is provided including a first and second heat exchanger each configured to pass air therethrough. The second heat exchanger is mounted upstream of the first heat exchanger. The second heat exchanger may be selectively movable between a first position and a second position such that an amount of the air is diverted from the second heat exchanger to the first heat exchanger when the second heat exchanger is in the first position. Alternately, the second heat exchanger may be spaced from the first heat exchanger, with at least one selectively openable shutter mounted adjacent to the first and second heat exchangers. The at least one shutter is movable between a first position and a second position such that an amount of the air is diverted from the second heat exchanger to the first heat exchanger when the at least one shutter is in the first position.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: October 19, 2010
    Assignee: GM Global Technology Operations, Inc.
    Inventor: Gregory P. Prior
  • Patent number: 7814967
    Abstract: A heat exchanger having an active surface over which a fluid flows to affect an exchange of heat between the active surface and the fluid. In some embodiments, the active surface includes a logarithmic spiral wherein the radius of the logarithmic spiral measured at equiangular radii unfolds at a constant order of growth. Further embodiments exhibit an active surface conforming to the internal or external surface of particular classes or genera of shells.
    Type: Grant
    Filed: July 7, 2007
    Date of Patent: October 19, 2010
    Assignee: New Pax, Inc.
    Inventor: Jayden David Harman
  • Patent number: 7810552
    Abstract: In one embodiment, a method of making a heat exchanger is provided, comprising the steps of generating a stereolithography file from design data, slicing the stereolithography file into two-dimensional patterns, and depositing at least one layer of a material having a high thermal conductivity onto a top surface of a substrate to form a heat exchanger. Preferably, the heat exchanger does not require assembly of separate pieces to form the heat exchanger. In another embodiment a heat exchanger made by this embodiment of the method is provided wherein the heat exchanger may have a design comprising tapered fins and/or alternating airfoil cross-sections.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: October 12, 2010
    Assignee: The Boeing Company
    Inventor: Victor Blakemore Slaughter
  • Patent number: 7806166
    Abstract: An insulated spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The insulated spray cooling system for extreme environments includes an insulated enclosure that isolates the electronic devices being thermally managed from the external environment and a thermal management unit within the enclosure for thermally managing electronic devices.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: October 5, 2010
    Assignee: Parker-Hannifin Corporation
    Inventors: Charles L. Tilton, William J. Beasley, Douglas W. Miller, Randall T. Palmer
  • Patent number: 7806170
    Abstract: In a heat exchanger having a casing in which a joint of the casing and between a core and the casing are brazed and fixed without a gap, the section of a portion in contact with the casing body is formed at a right angle at both ends of an upper edge portion of a header plate, and an upper lid is fitted so that it is brought into contact with the upper edge of the header plate over the entire length.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: October 5, 2010
    Assignee: T. Rad Co., Ltd.
    Inventor: Yoichi Nakamura
  • Patent number: 7806169
    Abstract: In a heat exchanger including a plurality of tubes 1 through which a first fluid passes, a housing 2 in which the tubes 1 are installed, and sealing members for sealing a second fluid that flows over surfaces of the tubes 1, the housing 2 includes an inlet 4 for introducing the second fluid therein and a first outlet 5 and second outlets 6 for discharging the second fluid, and the sealing members include a first sealing member 3a positioned on one of end sides of the tubes 1, a second sealing member 3b positioned on the other end side of the tubes 1, and a third sealing member 3c positioned between the first and second sealing members 3a and 3b. The third sealing member 3c is provided so that a gap 7 is provided between the first sealing member 3a and the third sealing member 3c while another gap 7 is provided between the second sealing member 3b and the third sealing member 3c, and that a flow path for the second fluid is formed therein. The second outlets 6 are provided so as to be connected to the gaps 7.
    Type: Grant
    Filed: February 7, 2005
    Date of Patent: October 5, 2010
    Assignee: JMS Co., Ltd.
    Inventors: Shinichi Yoshida, Minoru Tanaka, Tomokazu Niitsuma
  • Patent number: 7793709
    Abstract: A jet generating device includes a vibrating member which vibrates gas, a driving unit which drives the vibrating member, and a housing which has a first opening and a first chamber connected to the first opening and containing the gas. The housing supports the vibrating member, and is such that, of sounds generated as a result of vibrating the vibrating member, the sound having a maximum noise level has a predetermined frequency. In addition, the housing discharges the gas as pulsating gas through the first opening as a result of driving the vibrating member.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: September 14, 2010
    Assignee: Sony Corporation
    Inventors: Tomoharu Mukasa, Kazuhito Hori, Hiroichi Ishikawa, Kanji Yokomizo, Takuya Makino, Norikazu Nakayama
  • Patent number: 7784528
    Abstract: A heat exchanger system includes a duct having a duct wall with a duct wall outer surface and a duct wall inner surface; and a heat exchanger partial shell hermetically joined to the duct wall inner surface. The heat exchanger partial shell and a shell portion of the duct wall inner surface constitute a heat exchanger. A heat exchanger inlet manifold is defined by a nonplanar inlet sheet of material hermetically joined to the duct wall outer surface. A heat exchanger outlet manifold is defined by a nonplanar outlet sheet of material hermetically joined to the duct wall outer surface. A heat exchanger inlet opening extends through the duct wall between the inlet manifold and the heat exchanger, and a heat exchanger outlet opening extends through the duct wall between the outlet manifold and the heat exchanger.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: August 31, 2010
    Assignee: General Electric Company
    Inventors: Nathan Wesley Ottow, Scott Richard Zearbaugh, Phillip Michael Lariviere
  • Patent number: 7784531
    Abstract: A method for providing for thermal conduction using an array of carbon nanotubes (CNTs). An array of vertically oriented CNTs is grown on a substrate having high thermal conductivity, and interstitial regions between adjacent CNTs in the array are partly or wholly filled with a filler material having a high thermal conductivity so that at least one end of each CNT is exposed. The exposed end of each CNT is pressed against a surface of an object from which heat is to be removed. The CNT-filler composite adjacent to the substrate provides improved mechanical strength to anchor CNTs in place and also serves as a heat spreader to improve diffusion of heat flux from the smaller volume (CNTs) to a larger heat sink.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: August 31, 2010
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Jun Li, Meyya Meyyappan, Carlos Dangelo
  • Patent number: 7779896
    Abstract: A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: August 24, 2010
    Assignee: Parker-Hannifin Corporation
    Inventors: Charles L Tilton, Donald Tilton, Thomas D Weir, Randall T. Palmer
  • Patent number: 7775266
    Abstract: A heat exchanger, especially an intercooler for a motor vehicle. The heat exchanger comprises a box, a chamber in which a flowing medium is distributed and/or accumulated, a bundle of tubes, tubes, a tube base, openings, a housing lid, two lateral walls, a stabilizing element, a first receiving element, a first transmission element, a second receiving element, a second transmission element, a force transducing element and a flow guide surface.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: August 17, 2010
    Assignee: Behr GmbH & Co. KG
    Inventors: Marius Freitag, Georg Kämmler
  • Patent number: 7775263
    Abstract: The present invention relates to a heat exchanger, which can independently controls the volume of heat exchange medium flowing through tubes of a left heat exchange part and a right heat exchange part to independently control the temperature of a driver's seat and a passenger's seat, thereby realizing a compact structure since a temp door for controlling temperature is omitted from an air-conditioning system for the vehicle, which can reduce an operating force and increase durability since heat exchange medium controlling means are in a rotational structure, and which can minimize a temperature difference between the right and left sides thereof since the heat exchange medium is distributed to the tubes uniformly.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: August 17, 2010
    Assignee: Halla Climate Control Corporation
    Inventor: Seongseok Han
  • Patent number: 7766076
    Abstract: A cooler for heat generating electronic components comprising a heat exchange plate configured for heat exchange communication with one or more heat generating electronic components includes a fin stack having a plurality of heat exchange fins and one or more heat pipes and/or thermosyphon tubes in heat exchange communication with the heat exchange plate and said plurality of fins, and a fan for directing air to and/or from the fins, each of said fins having a centered interior circular opening or hole, the fins stacked with the holes coaxially aligned and substantially centered in the fin stack and defining an elongated cavity having a first open end adjacent to the heat exchange plate and a second open end adjacent to the fan, and an elongated insert centrally positioned lengthwise along the cylindrical cavity and having a exterior surface of revolution smaller than the diameter of the cavity and defining an airflow channel between the insert and the fin openings and wherein the exterior surface of revoluti
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: August 3, 2010
    Assignee: Rocky Research
    Inventors: Kaveh Khalili, Uwe Rockenfeller
  • Patent number: 7757752
    Abstract: A heat exchanger includes a corrugated plate that has a corrugation; a fluid-flux portion that stores the corrugated plate, and makes a fluid flow; a first structure that constitutes the fluid-flux portion; and a second structure that constitutes the fluid-flux portion, and is provided on a heat source side with respect to the first structure, wherein at least a portion constituting the fluid-flux portion in the second structure has a flat plate shape. The flat plate shape of the portion constituting the fluid-flux portion in the second structure enables easy manufacturing of the heat exchanger. The flat plate shape in the second structure further enables a close contact of the fluid-flux portion to the heat source, resulting in a heat exchange with high efficiency.
    Type: Grant
    Filed: May 8, 2007
    Date of Patent: July 20, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Akira Egawa, Kunihiko Takagi, Koichi Saito, Kenji Matsuyama
  • Patent number: 7753108
    Abstract: A cooling plate of a liquid cooling includes a chamber hermetically defined therein, an outlet, and an inlet. The outlet and the inlet communicate with the chamber for circulating liquid through the chamber. One of the outlet and the inlet is located in the other one of the outlet and the inlet.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: July 13, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Patent number: 7748438
    Abstract: A heat exchanger for medical use, comprising a tube bundle formed by a plurality of tubes having a straight axis for the conveyance of a primary fluid, which are embedded at their ends in disks located at the end faces of an outer jacket which is adapted to delimit, together with the disks, a portion of space for the containment of the tube bundle which is designed to be crossed by a secondary fluid, each tube having, at least at a portion of its length, a plurality of consecutive crimps adapted to determine a progressive variation of the shape of the passage section.
    Type: Grant
    Filed: September 25, 2006
    Date of Patent: July 6, 2010
    Assignee: Eurosets S.R.L.
    Inventors: Nicola Ghelli, Edgardo Costa Maianti, Roberto Balanzoni
  • Patent number: 7743819
    Abstract: A heat pipe and a method for producing the heat pipe are disclosed. The heat pipe includes a hollow metal casing and a honeycombed wick structure arranged at an inner surface of the hollow metal casing. The wick structure includes a plurality of slices stacked together. Each of the slices defines a plurality of pores therein to form a plurality of micro-channels in the wick structure, whereby porosity of the wick structure can be accurately controlled.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: June 29, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7740054
    Abstract: A heat dissipation device includes a heat dissipation fin module, a heat pipe and a centrifugal fan. The heat pipe is connected to the heat dissipation fin module at one end and connected to a heat generating source at an opposite end. The centrifugal fan includes a motor rotating a centrifugal impeller. A spiral housing encloses the centrifugal impeller and the motor. The spiral housing includes an air inlet, a first air outlet and a second air outlet. The air inlet exposes the centrifugal impeller such that the rotating centrifugal impeller introduces air through the air inlet. The first air outlet is connected to the heat dissipation fin module and the heat pipe, the second air outlet exposes the heat pipe. An isolation wall is disposed between the second air outlet and the air inlet.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: June 22, 2010
    Assignee: Quanta Computer Inc.
    Inventor: Chi-Hsueh Yang