Patents Examined by Thiem Phan
  • Patent number: 9976709
    Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: May 22, 2018
    Assignee: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Sheng-Hung Yi, I-Lin Tseng, Po-Cheng Huang, Hui-Ju Yang
  • Patent number: 9980420
    Abstract: The assembling machine is provided with fiducial marks which are attached to a defined position on a moving head, and an image processing section which recognizes the holding state of the component by the holding member based on high resolution data which is generated by super-resolution processing which uses a plurality of items of image data. The image processing section includes a displacement amount calculation section which calculates each displacement amount of imaging positions of other items of image data in relation to the imaging position of reference data, a positioning processing section which performs the positioning of the other items of image data in relation to the reference data, and a reconstruction processing section which generates the high resolution data based on the plurality of items of image data which are positioned.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: May 22, 2018
    Assignee: FUJI MACHINE MFG. Co., LTD.
    Inventors: Masafumi Amano, Hiroshi Oike, Hirotake Esaki
  • Patent number: 9978513
    Abstract: According to an exemplary embodiment, an apparatus for assembling an amorphous metallic transformer core from a plurality of amorphous metallic strip packets comprises an unwinding section comprising a plurality of uncoilers. Each of the plurality of uncoilers operated to unwind a coil comprising a single-ply continuous strip of a metallic material. A collection tray is configured to transport a composite metallic strip from the unwinding section, the composite metallic strip comprising a plurality of single ply metallic strips that are unwound from the plurality of uncoilers of the unwinding section. A shearing section operably coupled to the collection tray and configured to receive the composite metallic strip from the unwinding section, the shearing section configured to shear the composite metallic strip into a plurality of packets, the shearing section comprising an accumulator for holding the plurality of the packets of the composite metallic strips.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: May 22, 2018
    Assignee: LAKEVIEW METALS, INC.
    Inventor: Kevin C. Looby
  • Patent number: 9972880
    Abstract: A method of forming a connection receptacle over a substrate includes printing a first dielectric layer over the substrate between first and second transmission lines, the first dielectric layer having a tapered cross-section along a plane extending from the first transmission line to the second transmission line; disposing a conductive layer over the printed first dielectric layer; and electrically connecting the conductive layer to a conductor of the first transmission line and a conductor of the second transmission line.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: May 15, 2018
    Assignee: Keysight Technologies, Inc.
    Inventor: John R. Lindsey
  • Patent number: 9968438
    Abstract: High resolution active matrix nanowire circuits enable a flexible platform for artificial electronic skin having pressure sensing capability. Comb-like interdigitated nanostructures extending vertically from a pair of opposing, flexible assemblies facilitate pressure sensing via changes in resistance caused by varying the extent of contact among the interdigitated nanostructures. Electrically isolated arrays of vertically extending, electrically conductive nanowires or nanofins are formed from a doped, electrically conductive layer, each of the arrays being electrically connected to a transistor in an array of transistors. The nanowires or nanofins are interdigitated with further electrically conductive nanowires or nanofins mounted to a flexible handle.
    Type: Grant
    Filed: November 7, 2015
    Date of Patent: May 15, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bahman Hekmatshoartabari, Ghavam G. Shahidi, Davood Shahrjerdi
  • Patent number: 9974186
    Abstract: A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: May 15, 2018
    Assignee: UNITECH PRINTED CIRCUIT BOARD CORP.
    Inventors: Ming Yi Yeh, Shun Yueh Hsu, Kun Chi Chen, Hung Min Chen
  • Patent number: 9966820
    Abstract: A method of maintaining a high voltage bushing can comprise inspecting a high voltage bushing connection, the high voltage bushing connection comprising a tubular lead, a lower stud connector, and the high voltage bushing. A method of maintaining a high voltage bushing can also comprise restoring the high voltage bushing connection, which can further comprise applying conductive material to at least one of a mating portion of a tubular lead and a mating portion of a high voltage bushing, machining an outside diameter of at least one of the mating portion or the tubular lead and the mating portion of the high voltage bushing to a predetermined outer diameter, and machining a mating portion of a lower stud connector to a predetermined inner diameter. A high voltage bushing connection can comprise a restored mating portion of a tubular connector and a restored lower stud connector.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: May 8, 2018
    Assignee: AGT Services, Inc.
    Inventors: Vincent Rigosu, Jr., Michael Bresney, Nick Rebich, Charles Marino, Randy Snyder
  • Patent number: 9966638
    Abstract: A manufacturing method for a non-aqueous secondary battery includes the following steps. (a) Preparing an electrode body including a positive electrode having a positive electrode active material layer and a negative electrode having a negative electrode active material layer. (b) Constructing a battery assembly using the electrode body and a non-aqueous electrolyte. (c) Initially charging the battery assembly. (d) Aging the battery assembly at a temperature of 60° C. or higher. (e) Forcibly starting to discharge the battery assembly in said temperature region after lowering the temperature of the battery assembly down to a temperature region of 35° C. or higher and 55° C. or lower. (f) Adjusting the SOC of the battery assembly. (g) Measuring a voltage drop amount by self-discharging the battery assembly. And (h) determining whether or not the battery assembly is qualified based on the voltage drop amount.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: May 8, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yukiyoshi Ueno, Junko Ohira
  • Patent number: 9961820
    Abstract: Provided are a component replenishment support method, and a component replenishment support system of a component mounting line that are capable of preventing a decrease in facility operation rate due to component shortage, in which a component shortage time of each part feeder is predicted, a component replenishment work is started from the present time in a case where the component shortage time is earlier than the virtual work end time, a virtual work end time of the work target selection feeders in a case where the work is assumed to be performed in sequence of early time by using the part feeder within the warning consideration start time as a target is predicted, and a worker is warned of a man-hour lack to the selection feeder, in a case where the selection feeder of which the component shortage time is earlier than the work end time is present.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: May 1, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hisashi Maezono, Hideki Sumi, Yasuhiro Maenishi
  • Patent number: 9960452
    Abstract: A method of producing a nonaqueous secondary battery includes: preparing an electrode body (S10); constructing a battery assembly with the electrode body and a nonaqueous electrolyte (S20); initially charging the battery assembly (S30); aging the battery assembly at 40° C. or higher (S40); adjusting an SOC of the battery assembly (S60), wherein, the adjusting the SOC is performed such that a residual capacity percentage of the battery assembly is 11.5% or more and 14% or less; self-discharging the battery assembly and measuring a voltage drop amount (S70); and determining a quality of the battery assembly based on the voltage drop amount (S80).
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: May 1, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yukiyoshi Ueno, Junko Ohira
  • Patent number: 9960502
    Abstract: A wiring harness assembly is presented. The wiring harness assembly is formed by a method that includes the steps of crimping an electrical wire cable within a crimping feature of an electrical terminal having wire strands protruding from the crimping feature and fusing the wire strands of protruding portion, or “wire brush” so that the wire strands are in intimate contact, thereby eliminating voids between individual wire strands of the wire brush. The wires may be fused by laser welding, soldering, or brazing. The method may be especially beneficial for wire strands having an insulative oxide layer, such as aluminum. The bonding reduces the resistance between the wire strands due to insulating oxide layers on the surface of the wire strands and inhibiting of corrosion by eliminating inter-strand gaps where electrolytes in solution may enter and cause galvanic corrosion.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 1, 2018
    Assignee: Delphi Technologies, Inc.
    Inventors: Geroge Albert Drew, Kurt Paul Seifert, Gina Sacco
  • Patent number: 9950436
    Abstract: A method of assembling an electronic subassembly for a personal care product by providing an adapter having a body with a tapered guide surface. A first circuit board is positioned within the adapter. A flexible portion of the first circuit board extends from one end of the adapter and a rigid end of the first circuit board extends from the other end of the adapter. A housing is provided with a first opening and a second opening and a chamber (between the first and second openings. A second circuit board having an electrical connector into the chamber thru the first opening. The tapered surface of the adapter engages a corresponding tapered guide surface of the housing. The rigid end of the first circuit board is connected to the electrical connector.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: April 24, 2018
    Assignee: The Gillette Company LLC
    Inventors: Norbert Broemse, Klaus Heubach, Juergen Behrendt
  • Patent number: 9954333
    Abstract: A commutator is formed by providing an electrically insulating commutator body. First and second areas are defined on the commutator body covering a brush contact surface in an alternating manner. At least the surfaces of the first areas are formed of laser direct structured material. The first areas are treated by a laser to form metal particle layers. Conductive layers are formed on the metal particle layers by a plating process to form commutator segments. Terminals are connected to the conductive layers for connecting the commutator to rotor windings.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: April 24, 2018
    Assignee: Johnson Electric S.A.
    Inventor: Wilfried Gorlt
  • Patent number: 9953667
    Abstract: A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: April 24, 2018
    Assignee: Western Digital Technologies, Inc.
    Inventor: Tzong-Shii Pan
  • Patent number: 9949420
    Abstract: Whether or not a lead wire has been normally cut and clinched can be reliably detected. A contact pipe is arranged in lead wire insertion holes of a pair of fixed pawls in a state of being electrically insulated from the fixed pawls. In a case where the lead wire is shorter than a set length after the lead wire is inserted into the lead wire insertion holes, a clearance of the pair of lead wire insertion holes is widened by a set amount in the event of outward bending of the lead wire and is narrowed by a set amount in the event of inward bending. A cut-and-clinch operation is performed with S4 bypassed in a case where the length of the lead wire is at least the set length.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: April 17, 2018
    Assignee: FUJI MACHINE MFG.CO., LTD.
    Inventors: Kaname Asao, Kazuya Degura, Yasunari Mizuno, Toshimi Higashi
  • Patent number: 9948168
    Abstract: A manufacturing method of a stator for manufacturing a stator by mounting a concentrated winding coil wound with a square wire conductor on each of a plurality of teeth in a stator core and welding end of the concentrated winding coil to corresponding end of another concentrated winding coil, characterized in that a first set of concentrated winding coils and a second set of concentrated winding coils are mounted on the teeth, and the welding of each end in the first set of concentrated winding coils and corresponding end in the second set of concentrated winding coils is started while a third set of concentrated winding coils is mounted on the teeth.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: April 17, 2018
    Assignee: AISIN AW CO., LTD.
    Inventors: Mutsumi Kawamoto, Susumu Kato, Shingo Hashimoto, Takeshi Yokoyama, Hiroyuki Tanaka, Kazuya Iwatsuki, Shingo Sato
  • Patent number: 9939854
    Abstract: A tool for handling a modular information handling resource may include a drive portion, a first finger mechanically coupled to the drive portion, the first finger configured to apply a first force to a first side edge of the information handling resource when the information handling resource is engaged with the tool, and a second finger mechanically coupled to the drive portion, the second finger configured to apply a second force to a second side edge of the information handling resource opposite from the first side edge when the information handling resource is engaged with the tool. When the information handling resource is coupled to a connector via a bottom edge of the information handling resource adjacent and perpendicular to the side edges, a retention force applied by the connector to the information handling resource overcomes the first and second forces such that the tool releases the information handling resource.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: April 10, 2018
    Assignee: Dell Products L.P.
    Inventors: Jeffrey Patti, Aaron Donald Vowell
  • Patent number: 9942995
    Abstract: A metal core substrate is obtained as a result of outline shaping performed on a substrate including a core plate and an insulating layer provided on each of two surfaces of the core plate. An outer circumferential edge of the metal core substrate has an insulating structural portion, which includes an end surface of the core plate that is retracted from an end surface of the outer circumferential edge of the metal core substrate and an insulating covering portion covers the end surface of the core plate. Separation portions to be filled with the resin and coupling portions which are to be removed before outline shaping are formed at outline shaping positions of the core plate. At the time of outline shaping, only the resin is present at the outline shaping positions.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: April 10, 2018
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Tomotsugu Shiratori, Shinichi Jingama
  • Patent number: 9942992
    Abstract: Systems and methods for assembling an LED connector board wherein the assembly can be provided with a metal track with an integrated recess for receiving an injection molded base, onto which a set of leaf spring connectors with extended insulating bosses for electrical wires can be secured.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: April 10, 2018
    Assignee: AMERLUX LLC
    Inventors: Itai Leshniak, Paresh Shah, Jonathan Walsh
  • Patent number: 9942990
    Abstract: A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: April 10, 2018
    Assignee: International Business Machines Corporation
    Inventors: Brian L. Carlson, John R. Dangler, Roger S. Krabbenhoft, Kevin A. Splittstoesser