Patents Examined by Thomas Hamilton, III
  • Patent number: 5342884
    Abstract: Compositions comprising a non-isocyanate based thermoplastic polymer and a finely divided isocyanate based thermoset polymer are disclosed. The compositions can optionally further comprise an adhesive thermoplastic compatibilizing agent. Finely divided scrap isocyanate based thermoset polymer materials can be used in preparing these compositions, thus lowering manufacturing and disposal costs. A method to prepare these compositions is also disclosed.
    Type: Grant
    Filed: August 20, 1993
    Date of Patent: August 30, 1994
    Assignee: The Dow Chemical Company
    Inventors: Ricky L. Tabor, Roy E. Morgan, Jr., Melissa J. Zawisza
  • Patent number: 5342889
    Abstract: The present invention relates to electrostatic dissipative polymeric compositions comprising an effective amount of a chain extended polymer and a matrix polymer or matrix polymer blend. The chain extended polymer of the subject invention has electrostatic dissipative properties and is formed from low molecular weight polyethers which are reacted with a chain extender to furnish a useful additive.
    Type: Grant
    Filed: July 10, 1991
    Date of Patent: August 30, 1994
    Assignee: The B. F. Goodrich Company
    Inventors: Francis R. Sullivan, Elaine A. Mertzel, Edmond G. Kolycheck
  • Patent number: 5338796
    Abstract: A thermoplastic composition having a good balance of mechanical and thermal properties, an improved impact strength and a good processability includes a functionalized polyphenylene ether, a polyamide, and an olefinic elastomer containing a vinylaromatic monomer grafted thereon.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: August 16, 1994
    Assignee: Montedipe s.r.l.
    Inventors: Domenico Vianello, Armando Benetton, Alessandro Moro, Roberto Pippa, Aldo Longo
  • Patent number: 5336733
    Abstract: Disclosed are polyurethane base resins, and polyurethane composites and adhesive compositions formed using the base resins. The polyurethane base resins are formed by reacting a polycarbodiimide-modified 4, 4'-diphenylmethane diisocyanate with a mixture of the following polyols: (a) a hydroxyl-terminated, linear, saturated liquid copolyester diol having a glass transition temperature of at most -10.degree. C. and at least -60.degree. C.; and (b) a homopolyester polyol that is a ring-opened polymer of a cyclic ester. The polyurethane composites include typical active hydrogen-containing species that will react with isocyanates and promote curing, in addition to the polyurethane base resin. The polyurethane adhesive compositions, which are thermosetting, include the cured polyurethane base resin, cured by exposure to moisture or any other applicable curing mechanism. The adhesive compositions have improved performance (e.g.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: August 9, 1994
    Assignee: Rheox, Inc.
    Inventors: Terrence L. Hartman, Charles A. Cody
  • Patent number: 5334636
    Abstract: There is provided a polymer composition comprising,A) a polyphenylene ether resin and,B) optionally a styrene resin and,C) optionally impact strength improving amount of one or more of impact strength improving polymer(s) and,D) from about 5 parts to about 20 parts by weight of at least one mineral filler selected from the group consisting of talc, mica, and wollastonite based on 100 parts by weight of the total of the polymers, A) the polyphenylene ether resin, B) the styrene resin, and C) the impact strength improving polymer and,E) from about 5 parts to about 40 parts by weight of a carbon black based on the total of the polymers, A) the polyphenylene ether resin, B) the styrene resin, and C) the impact strength improving polymer and,F) optionally plasticizing amount of one or more of plasticizer(s),characterized in that the surface resistivity of the composition is lower than about 10.sup.10 ohm.
    Type: Grant
    Filed: March 26, 1992
    Date of Patent: August 2, 1994
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takeshi Fujii, Manabu Ishikawa
  • Patent number: 5334635
    Abstract: Antistatic thermoplastic styrenic compositions comprising high molecular weight polyethylene oxide and a lithium salt and ethylene glycol, diethylene glycol or triethylene glycol, characterized by their possession of a balance of mechanical properties, gloss and antistatic behavior.
    Type: Grant
    Filed: December 18, 1992
    Date of Patent: August 2, 1994
    Assignee: Monsanto Company
    Inventor: Kishore Udipi
  • Patent number: 5332786
    Abstract: A reactive hotmelt adhesive composition comprising a urethane prepolymer having an isocyanate group at each end and obtained by reacting a diisocyanate with a polyolefin diol having a hydroxyl group at each end, and a tackifier substantially unreactive with the urethane prepolymer and compatible therewith.
    Type: Grant
    Filed: March 19, 1993
    Date of Patent: July 26, 1994
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Mitsuo Nagata, Toshiyuki Adachi, Masatoshi Asakura
  • Patent number: 5328959
    Abstract: The present invention is directed to improved cover compositions for golf ball construction and the resulting intermediate modulus golf balls produced utilizing the improved cover compositions. The novel golf ball cover compositions of the invention comprise a blend of a relatively large amount of hard ionomeric resins, and a relatively low (i.e. from about 10 to about 25-30 percent) amount of soft ionomers. When the cover compositions of the invention are utilized to manufacture golf balls, the golf balls produced thereby, exhibit properties of improved distance without sacrificing playability and/or durability characteristics when compared to known hard-soft ionomer blends.
    Type: Grant
    Filed: July 9, 1992
    Date of Patent: July 12, 1994
    Assignee: Lisco, Inc.
    Inventor: Michael J. Sullivan
  • Patent number: 5326817
    Abstract: A thermoplastic resin composition is here provided which contains (I) 99 to 1% by weight of a polyphenylene ether resin alone or a mixture of the polyphenylene ether resin and a styrene polymer, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polycarbonate resin and polyoxymethylene resin, and (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the resins (I) +(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m.A method for preparing the above-mentioned thermoplastic resin composition is also provided here.
    Type: Grant
    Filed: March 21, 1989
    Date of Patent: July 5, 1994
    Assignees: Nippon Petrochemicals Co. Ltd., Nippon Oil & Fats Co. Ltd.
    Inventors: Yuichi Orikasa, Suehiro Sakazume
  • Patent number: 5324783
    Abstract: The present invention is directed to improved cover compositions for golf ball construction and the resulting intermediate modulus golf balls produced utilizing the improved cover compositions. The novel golf ball cover compositions of the invention comprise a blend of a relatively large amount of hard ionomeric resins, and a relatively low (i.e. from about 10 to about 25-30 process) amount of soft ionomers. When the cover compositions of the invention are utilized to manufacture golf balls, the golf balls produced thereby, exhibit properties of improved distance without sacrificing playability and/or durability characteristics when compared to known hard-soft ionomer blends.
    Type: Grant
    Filed: April 8, 1992
    Date of Patent: June 28, 1994
    Assignee: Lisco, Inc.
    Inventor: Michael J. Sullivan
  • Patent number: 5324782
    Abstract: Thermoplastic compositions comprised of compatible combinations of a polyphenylene ether resin and a polyamide resin and which require improved low temperature ductility can be impact modified with a modifying agent comprising a partially hydrogenated diblock copolymer of styrene and ethylene/propylene.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: June 28, 1994
    Assignee: General Electric Company
    Inventor: Gim F. Lee, Jr.
  • Patent number: 5324769
    Abstract: There are provided melt extruded blends of diene based rubber and preextruded polyphenylene ether, or blends thereof with an effective amount of a stabilizer such as a hindered phenol or metal deactivator/hindered phenol. The resulting polyphenylene ether composition can be further extruded with a polymeric organic matrix material, such as a polyamide or polyetherimide. When molded, the polyphenylene ether compositions have been found to resist loss of impact strength upon thermal aging and recycling.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: June 28, 1994
    Assignee: General Electric Company
    Inventors: William D. Richards, James F. Kelley
  • Patent number: 5321085
    Abstract: It is desirable to increase the modulus of rubbers utilized in a wide variety of applications. This invention discloses a technique for preparing high modulus rubber compositions. By utilizing this technique, high modulus can be attained without sacrificing other properties, such as hysteresis. The subject invention more specifically relates to a process for preparing a high modulus rubber composition which comprises: (1) polymerizing at least one diisocyanate with at least one member selected from the group consisting of diols and diamines in a polymer cement of a rubbery elastomer under conditions which result in the formation of a rubber cement having the crystalline polymer dispersed therein; and (2) recovering the high modulus rubber composition from the rubber cement.
    Type: Grant
    Filed: April 16, 1992
    Date of Patent: June 14, 1994
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: William C. T. Tung, Douglas D. Callander, Wen-Liang Hsu, Adel F. Halasa
  • Patent number: 5312868
    Abstract: A thermosetting covering sheet comprising an unhardened or semihardened layer made of a thermosetting resin composition is provided. The thermosetting resin composition comprises, as main ingredients, a reactive acrylic resin, which is in a solid state at ordinary temperatures, and a blocked isocyanate, the reactive acrylic resin containing a plurality of at least one kind of functional group selected from the group consisting of hydroxyl, amino, and carboxyl, and the weight average molecular weight of the reactive acrylic resin being in the range of 100,000 to 1,000,000.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: May 17, 1994
    Assignee: Sekisui Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Abe, Akitaka Miyake, Shunro Aoto, Yoshihiro Nishiyama, Natsuki Morishita, Yosuke Oshikawa, Makoto Yamaguchi
  • Patent number: 5312866
    Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
    Type: Grant
    Filed: May 14, 1992
    Date of Patent: May 17, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toshihiko Tsutsumi, Toshiyuki Nakakura, Shuichi Morikawa, Katsunori Shimamura, Toshiaki Takahashi, Atsushi Morita, Nobuhito Koga, Akihiro Yamaguchi, Masahiro Ohta, Yoshihisa Gotoh, Masaki Amano, Hiroyasu Oochi, Kayako Ito
  • Patent number: 5310821
    Abstract: A resin composition is provided which contains (A) 5-80 weight parts polyphenylene ether resins and (B) 20-90 weight parts polyamide resins, wherein the (B) polyamide resins: (a) comprise 1-50 weight percent of polyamide resins having a number-average molecular weight not greater than 11,000, and a terminal amino group content of at least 7.0.times.10.sup.-5 mole/g, and (b) have an overall number-average molecular weight of 9,500 to 32,000, and a terminal amino group content of 5.5.times.10.sup.-5 mole/g or less. The resin compositions have both good impact resistance (in particular at low temperatures) and good melt flow. The resin compositions can be used in a wide range of applications, and so are industrially useful.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: May 10, 1994
    Assignee: GE Plastics Japan, Ltd.
    Inventors: Tetsuji Kodaira, Hiromi Ishida, Hidekazu Kabaya
  • Patent number: 5304600
    Abstract: Process for the manufacture of modified polyphenyl ether or structurally related polymers comprising the reaction of said compound with a para substituted phenylsulphonyl halide, in the presence of a substituted pyridine derivative as catalyst and an acid neutralizing agent, and in a vinyl substituted aromatic monomer as solvent; modified polyphenylene ethers or structurally related polymers so obtained and use of them for the manufacture of modified high temperature rigid poly(vinyl substituted aromatic) polymer compositions.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: April 19, 1994
    Assignee: Shell Research Limited
    Inventors: Laurentius N. I. H. Nelissen, Henricus C. M. Timmermans, Johannes M. Zijderveld
  • Patent number: 5304607
    Abstract: A coating composition which is capable of curing at ambient temperature to form a coating comprises (A) an anhydride-functional polymer containing at least two cyclic carboxylic acid anhydride groups per molecule and (B) an amine-functional polymer and is characterized in that the amine-functional polymer (B) contains at least two secondary amine groups per molecule, the polymer (B) being substantially free from hydroxy and ether oxygen atoms and amine nitrogen atoms in the alpha and beta positions with respect to the amine nitrogen atoms, and the carbon atoms directly bonded to the amine nitrogen atoms not being tertiary carbon atoms.
    Type: Grant
    Filed: December 31, 1991
    Date of Patent: April 19, 1994
    Assignee: Courtaulds Coatings (Holdings) Limited
    Inventor: Alastair R. Marrion
  • Patent number: 5302429
    Abstract: Vinyl aromatic polymers having a minimum molecular weight of about 500,000, and preferably of about 1,500,000, are blended at levels of from about 1 to about 25% with thermoplastic resins to improve the melt rheology of the thermoplastic resins and facilitate blow molding, thermoforming, extrusion and similar processes.
    Type: Grant
    Filed: November 21, 1991
    Date of Patent: April 12, 1994
    Assignee: Rohm and Haas Company
    Inventor: Nazir A. Memon
  • Patent number: 5300568
    Abstract: A thermoplastic resin composition which comprises 100 parts by weight of a composition comprising 95-5% by weight of at least one polyolefin-resin (A) selected from homopolymers of ethylene or .alpha.-olefin or copolymers thereof and these homopolymers or copolymers modified with a polyfunctional compound (E) and/or an unsaturated monomer (L) and 5-95% by weight of at least one polyphenylene-ether-resin (B) selected from polyphenylene ether, modified polyphenylene ether with the above (E) and/or (L) and a composition comprising the polyphenylene or modified polyphenylene ether and an aromatic vinyl polymer resin (M) and 0.001-10 parts by weight of a dinitrodiamine (D) of the following formula (I). ##STR1## (wherein X represents a divalent chain aliphatic group, a cyclic aliphatic group or an aromatic group which may contain a halogen or an oxygen atom, R.sup.1 represents a hydrogen atom, a chain aliphatic group, a cyclic aliphatic group or an aromatic group and when both of X and R.sup.
    Type: Grant
    Filed: April 8, 1991
    Date of Patent: April 5, 1994
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroomi Abe, Takeshi Fujii, Masashi Yamamoto, Shinichi Yachigo, Hideo Nagasaki, Naoki Inui