Abstract: A hybrid micromachined ultrasound transducer includes a piezoelectric micromachined transducer and a capacitive micromachined transducer. The capacitive micromachined transducer is vertically stacked with the piezoelectric micromachined transducer. The piezoelectric micromachined transducer and the capacitive micromachined transducer include a common shared electrode.

Abstract: The present invention relates to a piezoelectric fiber having excellent flexibility, the piezoelectric fiber employs a conductive fiber member as an inner electrode, on which a piezoelectric polymer layer, an outer electrode and a coating layer are sequentially formed, thereby having excellent flexibility and sufficient elasticity to be sewed, woven, knotted or braided. Therefore, the piezoelectric fiber can be applied in power supplies for a variety of sizes and types of wearable electronic devices, portable devices, clothing, etc. In addition, since the piezoelectric fiber has excellent piezoelectricity and durability because of the above-described structure, it can effectively convert deformation or vibration caused by external physical force into electric energy, and thus can replace existing ceramic-based and polymer piezoelectric bodies, etc. Furthermore, an economical and simple method of manufacturing a piezoelectric fiber having excellent piezoelectricity is provided.

Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.

Abstract: A bulk acoustic wave resonator includes: a support part disposed on a substrate; a layer disposed on the support part, wherein an air cavity is formed between the support part, the substrate and the layer; and a frame extending along the layer, within the air cavity, and spaced apart from the support part.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Abstract: A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 ?m or less.

Abstract: The piezoelectric element comprises a piezoelectric body extending in a lateral direction and a first and second electrodes that are provided on the piezoelectric body. The piezoelectric body has an active portion sandwiched between the first and second electrodes in a thickness direction that is vertical to the lateral direction, and an inactive portion connected to the active portion in the lateral direction. The first electrode has an active electrode portion disposed on the active portion. The active electrode portion includes an interface region that is adjacent to the interface of the active portion and the inactive portion in the lateral direction, and an inner region that is separated from the interface of the active portion and the inactive portion in the lateral direction. The cross sectional surface area per unit length of the interface region in the cross section of the active electrode portion is greater than the cross sectional area per unit length of the inner region.

Abstract: A piezoelectric micromechanical resonator includes a supporting beam including a fixed edge that is fixed to a supporting member and a free edge opposite the fixed edge, a piezoelectric sensor including an edge attached to the supporting member, the piezoelectric sensor further including a lower electrode, a piezoelectric unit, and an upper electrode sequentially stacked on a surface of the supporting beam, and a lumped mass provided on the surface of the supporting beam at a side of the supporting beam including the free edge, the upper electrode having a Young's modulus smaller than a Young's modulus of the lower electrode.

Abstract: The present invention relates to a zinc oxide-based piezoelectric device, utilizable both as a sensor and as an actuator. More in particular, the present invention relates to a piezoelectric device (1, 101) comprising at least two carbon fibre crossed yarns (2a, 2b; 102a, 102b), at the intersection of which a zinc oxide layer (3, 103) in nanorod form is arranged, wherein an end (4a, 4b) of each of said yarns (2a, 2b; 102a, 102b) is connected to an operative unit (5).

Abstract: The piezoelectric element includes a piezoelectric composite including a plurality of piezoelectrics and a reaction product, and an electrode pair. The plurality of piezoelectrics is disposed in alignment at an interval of 1 to 10 ?m. The aspect ratio of each of the piezoelectrics is 5 or higher. The reaction product is a reaction product of a crosslinkable epoxy resin composition containing an elastomer component, a crosslinkable epoxy resin, and a crosslinking agent. One or each of a number of epoxy groups per molecule of the crosslinkable epoxy resin and a crosslinking value of the crosslinking agent is 3 or more.

Abstract: A vibration wave motor includes a vibrator including a piezoelectric element; a friction member with which the vibrator comes into contact by receiving pressurizing force; and a guide member that holds the vibrator. The guide member includes an input portion on one end portion, the input portion receiving force from outside, and a pressurizing portion on another end portion positioned on an opposite side of the one end portion, the pressurizing portion providing the pressurizing force to the vibrator. A guide portion extending in a direction of relative movement of the vibrator and the friction member is formed between the input portion and the pressurizing portion.

Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

Abstract: A piezoelectric generator is specified, comprising a deformation body, which spans a projection surface and is embodied with a setpoint pressure surface situated opposite the projection surface, wherein the projection surface can be converted from a smaller projection surface when not loaded under pressure into a larger projection surface when pressure is applied to the setpoint pressure surface substantially perpendicular to the projection surface, and a spring effect is provided which counteracts an application of pressure to the setpoint pressure surface, wherein an electromechanical transducer element comprising a piezoelectric material wholly or partly spans the projection surface, such that the transducer element is embodied in an expandable fashion upon pressure being applied to the deformation body, and electrical microenergy can be generated by means of the piezoelectric material.

Abstract: A system that may be used for energy harvesting includes a flexible beam secured between a first support and a second support. The supports are spaced apart at a distance less than a length of the flexible beam such that the beam is buckled. Responsive to external vibrations the flexible beam switches between a first position and a second position. A magnetic proof mass is coupled to the flexible beam at the beam's midpoint. At least one permanent magnet is positioned proximate to the magnetic proof mass and has the same polarity. The permanent magnet is positioned to expose the magnetic proof mass to a repulsive force when the magnetic proof mass is located at both the first position and the second position. Piezoelectric transducers are located above and below the first and second positions of the flexible beam to harvest energy.

Abstract: A piezoelectric vibration member that includes a substrate having a main surface on or in which a piezoelectric vibration member is mounted, a lid having a recess that is open so as to face the main surface and which includes a flange portion that projects outward from an opening edge of the recess, and a bonding layer that bonds the substrate and the lid together so as to hermetically seal the piezoelectric vibrator in a space between the recess and the main surface. The surface roughness of a side surface of the flange portion is greater than the surface roughness of the surface of the recess, and the bonding layer extends from the main surface of the substrate to the side surface of the flange portion.

Abstract: A bulk acoustic wave resonator includes: a support part disposed on a substrate; a layer disposed on the support part, wherein an air cavity is formed between the support part, the substrate and the layer; and a frame extending along the layer, within the air cavity, and spaced apart from the support part.

Abstract: Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

Abstract: A transducer (140) having a mechanical impedance over an operative frequency range and having a desired power coupling (145) to a load over the operative frequency range comprises a piezoelectric device (141) having a frequency distribution of modes in the operative frequency range; and an overmould (143). The overmould (143) is arranged to surround at least part of the piezoelectric device (141); and the parameters of the overmould (143) are selected to provide a required impedance matching between the mechanical impedance of the transducer (140) and the mechanical impedance of the load. An alternative transducer comprises a mounting means for holding a discrete portion of at least a part of the periphery of the piezoelectric device wherein the parameters of the mounting means are selected to provide a required boundary condition for the periphery of the piezoelectric device whereby the desired power coupling between the transducer and the load is provided.

Abstract: An acoustic wave filter device includes a substrate, a filter disposed on the substrate, a wall member disposed on the substrate and surrounding the filter, and a cap member disposed above the wall member and, with the wall member, forming an internal space. The cap member has a curved shape and comprises a first cap member comprising a first material and a second cap member comprising a second material.

Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.