Patents Examined by Timothy J. Dole
  • Patent number: 11377048
    Abstract: A body side unit is configured to attach a wire harness wired between a vehicle body and a slide door to the vehicle body. In the body side unit, a rotary inner is attached to the wire harness. A protector supports the rotary inner rotatably and movably in an up-down direction, and is fixed to the vehicle body. A coil spring is provided between the rotary inner and the protector, and biases the rotary inner such that the rotary inner faces downward in the up-down direction.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: July 5, 2022
    Assignee: YAZAKI CORPORATION
    Inventor: Kosuke Tomosada
  • Patent number: 11382211
    Abstract: A flexible printed circuit board includes: a trunk portion; and a pair of branch portions as two portions branched from the trunk portion and arranged on a battery including multiple arrayed cells, in which for at least one branch portion of the pair of branch portions, bending is performed using a pair of parallel bending lines extending apart from the other branch portion as extending apart from the trunk portion, and the at least one branch portion is bent such that a direction of bending at one bending line of the pair of parallel bending lines and a direction of bending at the other bending line are directions opposite to each other.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: July 5, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke Tomita, Tomoki Kanayama, Shuzo Yamada
  • Patent number: 11370369
    Abstract: A terminal holder includes a holder body. Two terminal mounts extend through the holder body. Each terminal mount includes a terminal shroud that defines a terminal space around a terminal axis. A lock flange extends from the terminal shroud toward the terminal axis. A lock finger also extends from the terminal shroud toward the terminal axis. The lock flange and the lock finger are spaced apart to define a terminal lock space therebetween.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: June 28, 2022
    Assignee: Lear Corporation
    Inventors: Bhupinder Rangi, David Menzies
  • Patent number: 11373786
    Abstract: An apparatus includes a laminated bus bar assembly with first and second bus bars and an intervening insulator layer. A surge arrestor (e.g., a metal oxide varistor) has a body mounted on the bus bar assembly and first and second terminals on first and second opposite sides of the body. In some embodiments, the body may be at least partially disposed in an opening in the first bus bar and the second terminal may be conductively bonded to a surface of the second bus bar that faces the insulator layer. In some embodiments, the second terminal may include a conductive stud passing through an opening in the second bus bar. The apparatus may include a spring clamp attached to the first bus bar and contacting the first side of the body to retain the body.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: June 28, 2022
    Assignee: Eaton Intelligent Power Limited
    Inventors: Yakov L. Familiant, Paul J. Rollmann, Andrew A. Rockhill
  • Patent number: 11361901
    Abstract: A multilayer ceramic electronic component includes a rectangular parallelepiped stacked body having first and second main surfaces and first and second end surfaces, and first and second external electrodes. The first external electrode is provided on a portion of the second main surface and on the first end surface, and the second external electrode is provided on a portion of the second main surface and on the second end surface. A semiconductor layer is provided at the interface between the stacked body and a portion of the first external electrode that is located on the portion of the second main surface, and a semiconductor layer is provided at the interface between the stacked body and a portion of the second external electrode that is located on the portion of the second main surface.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: June 14, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Makoto Togawa
  • Patent number: 11362493
    Abstract: A locking structure includes: a locking protrusion and a locking arm. The locking arm includes a flexible arm main body and an engaging projection portion protruding from an outer surface of the arm main body. The locking protrusion includes a protrusion main body on which an arm guide surface, a protruding tip surface, and an engaging surface are disposed along the engagement direction, and a jig groove that is formed in the protrusion main body. The engaging projection portion is formed on the outer surface at a position away from an arm tip of the arm main body in the engagement direction. The protruding tip surface is longer than the arm tip in the engagement direction. The jig groove cuts out the protrusion main body in the engagement direction from the arm guide surface to the protruding tip surface.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: June 14, 2022
    Assignee: Yazaki Corporation
    Inventors: Tatsuhiko Ikeda, Takaaki Kakimi, Tetsuya Kato
  • Patent number: 11342690
    Abstract: A fixing structure of a splice part includes a plurality of electrical wires each having a splice part and mutually connected and a sheet material to which the splice part is fixed. The fixing structure of the splice part is considered to have a portion of the plurality of electrical wires fixed to the sheet material in addition to the splice part.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: May 24, 2022
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES LTD.
    Inventors: Daichi Fukushima, Housei Mizuno, Miyu Aramaki, Tetsuya Nishimura
  • Patent number: 11338746
    Abstract: An automobile architecture includes a composite cable, a main electronic control unit, a subsidiary electronic control unit, a motor sensor, and a wheel velocity sensor. In the architecture, the composite cable connects the main electronic control unit and the subsidiary electronic control unit, and the motor sensor and the wheel velocity sensor are connected to the subsidiary electronic control unit.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: May 24, 2022
    Assignees: SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenta Kobayashi, Akira Kitabata, Takaya Kohori, Masayuki Ishikawa, Taiko Sato, Hiroyuki Ishikawa
  • Patent number: 11342096
    Abstract: A wiring member includes wires, a resin molded portion that covers the wires, and a bracket attachment that is attached to the resin molded portion. The resin molded portion includes a bracket attachment portion that is formed with at least one flat surface portion. The bracket includes a first attachment portion that is configured to be attached to an attachment location, and a second attachment portion that is connected to the first attachment portion and is crimped to the bracket attachment portion while being in surface contact with at least one of the at least one flat surface portion.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: May 24, 2022
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hironobu Yamamoto, Moriyuki Shimizu
  • Patent number: 11329465
    Abstract: A lock structure includes: an engaged body; and an engaging body capable of inserting and removing the engaged body along insertion and removal directions opposite to each other. An engaged body includes first and second engaged walls disposed opposite to each other at an interval, a connection wall which connects end portions on the insertion direction side thereof, and an engaged protrusion protruding from an outer wall surface of the second engaged wall. An engaging body has first and second engaging walls in which a space between the respective inner wall surfaces is defined as an accommodation space of the engaged body, an engaging protrusion protruding from the inner wall surface of the second engaging wall and capable of locking the engaged protrusion on the removal direction side, and a third engaging wall disposed between the first and second engaging walls.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: May 10, 2022
    Assignee: YAZAKI CORPORATION
    Inventor: Yukihiro Kawamura
  • Patent number: 11315733
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun Park, Won Kuen Oh, Tae Gyeom Lee, Ji Hong Jo
  • Patent number: 11302480
    Abstract: A ceramic electronic device including a ceramic body having ceramic layers and internal electrode layers stacked in alternating manner and a terminal electrode formed at an end face of the ceramic body. The terminal electrode includes a base electrode including a metal component and a glass component, an intermediate electrode layer including Ni and formed at an outer face of the base electrode layer, and an upper electrode layer including Pd or Au and formed at an outer face of the intermediate electrode layer. Also, a surface roughness Ra1 of the base electrode layer in the terminal electrode is 5.0 ?m or less; or the surface roughness Ra1 of the base electrode layer, a surface roughness Ra2 of the intermediate electrode layer, and a surface roughness Ra3 of the upper electrode layer satisfy a relationship of Ra1>Ra3?Ra2.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: April 12, 2022
    Assignee: TDK CORPORATION
    Inventors: Tetsuhiro Takahashi, Tomohisa Fukuoka
  • Patent number: 11294435
    Abstract: An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: April 5, 2022
    Assignee: Dell Products L.P.
    Inventors: Yong-Teng Lin, Jeffrey D. Kane
  • Patent number: 11282618
    Abstract: A high-speed flat cable includes a plurality of shielded signal units, one or more bendable composite layers, and an adhesive layer. The shielded signal units are substantially coplanar, spaced apart from each other or adjoining each other. The one or more bendable composite layers includes an inner insulating film layer, a bendable aluminum foil layer, and an outer insulating film layer. The one or more bendable composite layers composed of the inner insulating film layer, the bendable aluminum foil layer, and the outer insulating film layer increase its mechanical bending/folding property to improve the bending/folding memory. The one or more bendable composite layers allows the flat cable to be bent with ease without rebounding, thereby enhancing production efficiency.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: March 22, 2022
    Assignee: Amphenol AssembleTech (Xiamen) Co., Ltd
    Inventors: Wen Chu Yang, Zhi Ming Huang, David Rosenboom, Jesus Jaramillo
  • Patent number: 11282617
    Abstract: A wire harness that includes an electric wire that includes a core wire, an insulating inner cover that covers an outer circumference of the core wire, and a conductive shield that covers an outer circumference of the insulating inner cover; a conductive bracket including a plate that includes an insertion hole through which the electric wire is inserted and a protrusion protruding from an edge of the insertion hole in the plate; a fastener that fastens a folded-back portion of the shield that is folded back to an outer circumferential side of the protrusion to the protrusion; and a body made of resin that sandwiches the plate in a thickness direction.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 22, 2022
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Masashi Hayashi
  • Patent number: 11282646
    Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: In Kyung Jung, Dong Hwi Shin
  • Patent number: 11273774
    Abstract: A wire harness, including: a first wire including a first core wire and a second wire including a second core wire, the first core wire and the second core wire being joined together, wherein the first core wire includes a first flat surface extending along an entire length of the first core wire in a length direction, the second core wire includes a second flat surface extending along an entire length of the second core wire in a length direction, and the first flat surface and the second flat surface are overlapped and joined.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: March 15, 2022
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Hirokazu Nakai
  • Patent number: 11264148
    Abstract: A composite cable includes a pair of first electric wires, a twisted pair wire formed by twisting a pair of second electric wires having a smaller outer diameter than the first electric wires, a tape member wound into a spiral around an assembly that is formed by twisting the pair of first electric wires and the twisted pair wire together, and a sheath covering an outer periphery of the tape member. The tape member and the sheath includes an inwardly projecting part formed in a spiral along a cable longitudinal direction and formed so as to enter inward at least one of a valley part between the two first electric wires and valley parts between the first electric wires and the twisted pair wire. The inwardly projecting part has a projecting length of not less than 3% of an outer diameter of the first electric wires.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: March 1, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Yoshikazu Hayakawa, Tomoyuki Murayama, Hirotaka Eshima, Fumihito Oka, Takahiro Futatsumori
  • Patent number: 11264168
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic; and a pair of external electrodes that are formed on the two end faces; wherein: the pair of external electrodes have a structure in which a plated layer is formed on a ground layer; a main component of the ground layer is a metal or an alloy including at least one of Ni and Cu; and at least a part of a surface of the ground layer on a side of the plated layer includes an interposing substance including Mo.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: March 1, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Haruna Ubukata, Satoko Namiki, Atsuhiro Yanagisawa, Tomonori Yamatoh
  • Patent number: 11222736
    Abstract: A wiring harness (10) includes wires (20), an exterior material, such as a pipe (30), through which the wires (20) are inserted, and a reinforcing layer (40) formed to cover at least either the wires (20) or the exterior material. The reinforcing layer (40) is constituted by a resin film made of one or more materials selected from polyurea resin, polyurethane resin and mixed resin of the polyurea resin and the polyurethane resin.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: January 11, 2022
    Inventors: Hikaru Omae, Masashi Hayashi