Patents Examined by Timothy J. Dole
  • Patent number: 12198856
    Abstract: The electronic component includes: a capacitor body; first and second external electrodes on a mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes; a first bonding portion between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder; and a second bonding portion between the second external electrode and the second connection terminal, and including a second-2-th region and a second-1-th region, the second-2-th region being adjacent to the center of the capacitor body and the second-1-th region being adjacent to the other end of the capacitor body.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: January 14, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop Kim, Kyong Nam Hwang, Eun Ji Kim, Do Hyun An
  • Patent number: 12187206
    Abstract: A motor vehicle power cable comprising a flat conductor having an at least rectangular profile, wherein the flat conductor extends along a longitudinal axis, a vertical axis extending along a surface normal of a wide surface of the flat conductor, and a transverse axis extending along a surface normal of a narrow surface of the flat conductor and the flat conductor is bent about the vertical axis and having an inner bend radius and an outer bend radius, characterized in that the flat conductor has at least one forming about the longitudinal axis in the region of the inner bending radius at its inner side edge arranged at the inner bending radius.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: January 7, 2025
    Assignee: Auto-Kabel Management GmbH
    Inventor: Bernd Meyer
  • Patent number: 12170170
    Abstract: A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: December 17, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeong Kim, Myung Jun Park, Jin Soo Park, Yeon Song Kang, Eun Jin Kim, Kyu Sik Park, Kang Ha Lee
  • Patent number: 12130506
    Abstract: A display device includes a display panel including a first area, a second area, and a bending area disposed between the first area and the second area, the bending area having a curvature radius, a data driver disposed on the display panel and overlapping the second area in a plan view, and a bending protection layer disposed on the display panel and the data driver and overlapping the first area in a plan view, the bending area, and the second area. The bending protection layer includes a thermochromic pigment having a light transmittance that varies according to a temperature.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: October 29, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Tae Yong Ryu, Kyoungwoo Park, Hyoungjoo Lee
  • Patent number: 12131837
    Abstract: A high temperature superconducting, HTS, current lead comprising an HTS cable including a plurality of HTS tapes, a braided sleeve around the HTS cable, and a stabiliser material impregnating the HTS cable and the braided sleeve, the stabiliser material having a melting point above 290K and below a thermal degradation temperature of the HTS tapes.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: October 29, 2024
    Assignee: TOKAMAK ENERGY LTD
    Inventors: Bas van Nugteren, Greg Brittles
  • Patent number: 12125612
    Abstract: The wire harness includes a base film having flexibility, a cover film covering the base film and having flexibility, and electric wires disposed between the base film and the cover film. The electric wires include first end sections that extend outside the base film and the cover film and second end sections that extend outside from the base film and the cover film from an opposite side from the first end sections. The base film and the cover film include welding portions at which the base film and the cover film are joined with welding.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: October 22, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Nobuyuki Matsumura, Hiroki Shimoda, Isamu Hamamoto, Yutaroh Gotoh
  • Patent number: 12114438
    Abstract: A method for manufacturing a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layers, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: October 8, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Rihito Fukushima, Teppei Niino
  • Patent number: 12097811
    Abstract: A wiring member includes: at least one wire-like transmission member; a first sheet to which a first section located along a longitudinal direction in the wire-like transmission member is fixed; and a second sheet to which a second section located along a longitudinal direction in the wire-like transmission member is fixed, wherein the first sheet and the second sheet are separated, and at least one bending trace is formed in an intermediate section between the first section and the second section in the wire-like transmission member.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: September 24, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kenta Arai, Daisuke Ebata, Ryusuke Kudo, Masaki Mizushita, Tetsuya Nishimura, Haruka Nakano, Housei Mizuno
  • Patent number: 12100541
    Abstract: An electronic package comprises, a package substrate, and a magnetic block, where the magnetic block passes through the package substrate. the electronic package further comprises a fluidic path from an inlet to the package substrate to an outlet of the package substrate. The electronic package further comprises a conductive winding in the package substrate, where the conductive winding wraps around the magnetic block, and where the conductive winding is tubular and the fluidic path passes through the conductive winding.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: September 24, 2024
    Assignee: Intel Corporation
    Inventors: Beomseok Choi, Adel A. Elsherbini
  • Patent number: 12095244
    Abstract: A composite cable seal includes a frame material and a sealing material. The frame material can be configured to control positioning of the sealing material, and to prevent the sealing material from being over-compressed. The sealing material can be configured to provide effective sealing at a cable port and to provide effective sealing with respect to the enclosure (e.g., at a triple point of the enclosure).
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: September 17, 2024
    Assignee: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Kristof Vastmans, Jiri Zavrel
  • Patent number: 12094659
    Abstract: A ceramic electronic component has an element body having a dielectric and internal electrodes, and external electrodes formed on the element body. Each of the external electrodes has an electrical conductive layer connected to the internal electrodes. The electrical conductive layer has an outer side and an inner side. The outer side is farther from the element body than the inner side. The outer side includes more voids than the inner side.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: September 17, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Shin Nishiura, Jun Shibano
  • Patent number: 12080913
    Abstract: A wiring harness for a battery and inverter system includes a main cable. It further includes an inverter connector configured to plug the main cable into an inverter module. It further includes a first spur of the main cable terminating in a first-type battery device connector. It further includes a second spur of the main cable terminating in a second type battery device connector.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: September 3, 2024
    Assignee: Lunar Energy, Inc.
    Inventors: Peter H. J. How, Tanner Bruce DeVoe, Mark Holveck, Anthony Sagneri, Christopher Breckenridge Todd, Randol Aikin, Mark Daniel Goldman, Conrad Xavier Murphy, Kevin Richard Fine, Brian M. Neil
  • Patent number: 12080447
    Abstract: A wire harness according to one aspect of the present disclosure includes: a first wire harness that includes a first electric wire, a first shielding member, and a first connector; a second wire harness that includes a second electric wire, a second shielding member, and a second connector; and a connection member that electrically connects a drain wire of the first shielding member and a drain wire of the second shielding member to each other. A drain wire drawn out from an end portion of the first shielding member on the first connector side is grounded. A drain wire drawn out from an end portion of the second shielding member on the second connector side is inserted into a vacant cavity of the second connector.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: September 3, 2024
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Kenji Sugahara
  • Patent number: 12068219
    Abstract: A heat sink integrated insulating circuit substrate includes: a heat sink including a top plate part and a cooling fin; an insulating resin layer formed on the top plate part of the heat sink; and a circuit layer made of metal pieces arranged on a surface of the insulating resin layer opposite to the heat sink, wherein, when a maximum length of the top plate part is defined as L, an amount of warpage of the top plate part is defined as Z, and deformation of protruding toward a bonding surface side of the top plate part of the heat sink is defined as a positive amount of warpage, and a curvature of the heat sink is defined as C=|(8×Z)/L2|, a ratio P/Cmax between a maximum curvature Cmax(I/m) of the heat sink during heating from 25° C. to 300° C. and peel strength P (N/cm) of the insulating resin layer satisfies P/Cmax>60.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: August 20, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toyo Ohashi, Yoshiaki Sakaniwa
  • Patent number: 12068593
    Abstract: An example busway system is provided that includes a first busway, a second busway, and a joint seal coupling the first busway to the second busway. The first busway includes a first end and an opposing second end, and the second busway includes a third end and an opposing fourth end. The joint seal includes panels configured to at least partially slide over the first or the opposing second end of the first busway, and at least partially slide over the third or the opposing fourth end of the second busway to couple the first busway to the second busway. The joint seal creates a seal at a joint formed by the first busway, the second busway, and the joint seal.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: August 20, 2024
    Assignee: Starline Holdings, LLC
    Inventors: Frank Joseph Stifter, Jr., Douglas Raymond Moore, David Philip Marple, John Donald Berenbrok, Lucas Anthony Andrews, Timothy Russell Fox, Edward James Schultz
  • Patent number: 12030441
    Abstract: An in-vehicle relay apparatus provided on a roof of a vehicle includes: a first connector connected to a power line and a communication line provided on one pillar of the vehicle; a second connector to which a power line and a communication line provided on a different pillar are connected; a branch line connector to which power lines and communication lines extending from a plurality of in-vehicle devices provided on the roof are connected; a branching portion branching a single wire system into power lines connected to the branch line connector, the single wire system being a system in which the power lines respectively connected to the first connector and the second connector are integrated into one system; and a relay unit relaying data passing between the communication lines connected to the first connector and the second connector and the communication lines connected to the branch line connector.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: July 9, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hiromichi Yasunori, Makoto Chujo
  • Patent number: 12021322
    Abstract: An electrical connection sheet includes a conduction part including a conductive rubbery elastomer, an adhesion member, and a sheet-shaped connection member fitted with the conduction part and the adhesion member. Both surfaces of the electrical connection sheet are adhesible.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: June 25, 2024
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Yasuyoshi Watanabe, Hideaki Konno, Tsubasa Kamiya
  • Patent number: 12014849
    Abstract: An insulated wire with bonding layer includes: a conductor; an insulating coating layer that covers an outer circumference of the conductor; and a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat, wherein the insulating coating layer contains polyvinyl chloride, and the bonding layer contains a modified polyolefin resin and a polyamide resin.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: June 18, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yuta Yasuyoshi, Toyoki Furukawa
  • Patent number: 12009154
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hye Han, Jung Min Kim, Byung Woo Kang, Hong Je Choi, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
  • Patent number: 12009758
    Abstract: A half-bridge includes a substrate, semiconductor switches, power connections and signal connections. The power and signal connections are formed in a flat conductor frame. The signal connections are electrically connected to the semiconductor switches such that they can be switched via the signal connections and the power connections are electrically connected to the semiconductor switches such that they allow or interrupt electricity transfer between the power connections. The semiconductor switches, signal connections, and power connections are on a first surface of the substrate in a casting compound. First end sections of the signal connections formed in the flat conductor frame each extend from a second surface orthogonal to the first surface, exiting the casting compound. Second end sections of the signal connections, which are separate from the flat conductor frame, are connected to the first end section outside the casting compound and are perpendicular to the first surface.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: June 11, 2024
    Assignee: ZF Friedrichshafen AG
    Inventors: Manuel Raimann, Sebastian Besold, Gerhard Müller, Pengshuai Wang