Patents Examined by Timothy Thompson
  • Patent number: 10189422
    Abstract: A wire harness which electrically connects high-voltage devices includes a conductive path that is used as a trunk cable, a branch cable that branches from the trunk cable, and a branch connecting portion which connects the trunk cable with the branch cable, wherein the trunk cable has a trunk cable-side conductor exposed portion where a cover of the trunk cable lying in a predetermined position of the trunk cable is removed, the branch cable has a branch cable-side conductor exposed portion where a cover of the branch cable lying a predetermined position of the branch cable is removed, the trunk cable-side conductor exposed portion is connected with the branch cable-side conductor exposed portion at the branch connecting portion, and the branch connecting portion has an insulating and waterproofing portion which functions as an insulating portion and a waterproofing portion.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: January 29, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Hideomi Adachi, Hidehiko Kuboshima
  • Patent number: 10187986
    Abstract: A wiring substrate includes a first wiring layer on a surface of a first insulating layer; a via interconnect including a first portion connected to the first wiring layer and a second portion formed monolithically with the first portion and extending from an end of the first portion in a direction away from the first wiring layer; a second insulating layer on the first insulating layer; and a second wiring layer on the second insulating layer, contacting a first surface of the second portion. The area of a cross section of the first portion, parallel to the surface of the first insulating layer, increases as the position of the cross section approaches the first wiring layer from the second portion. The second portion includes a second surface that is opposite from its first surface and extends horizontally from the end of the first portion to overhang the first portion.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: January 22, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Satoshi Sunohara
  • Patent number: 10188016
    Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: January 22, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Harvey Lunsman, Steven J. Dean, Roger Ramseier, Russell Stacy
  • Patent number: 10186475
    Abstract: An insulated busbar includes a plate conductor and insulating films which cover the plate conductor. The insulated busbar further includes conductive films which are formed on inside surfaces of the insulating films so as to be in contact with the plate conductor and which cover a vacant space between an end portion of the plate conductor and the insulating films.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: January 22, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yuji Hayase
  • Patent number: 10186354
    Abstract: A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: January 22, 2019
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Yohei Shinotake
  • Patent number: 10182499
    Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: January 15, 2019
    Assignee: The University of Memphis Research Foundation
    Inventor: Bashir I. Morshed
  • Patent number: 10176924
    Abstract: A multilayer ceramic capacitor may include a ceramic body including a plurality of dielectric layers; a first internal electrode disposed in the ceramic body and exposed to a first side surface in a width direction of the ceramic body and a second internal electrode disposed in the ceramic body and exposed to the first side surface in the width direction of the ceramic body; and first to third external electrodes disposed on the first side surface in the width direction of the ceramic body.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: January 8, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Kwang Lee, Jin Kim, Ju Eun Nam, Young Ghyu Ahn
  • Patent number: 10176907
    Abstract: A cable (100) includes a power wire (1), a ground wire (3), data transmission wires (2) between the power wire and the ground wire, and an insulating outer layer (4) enclosing the outer side of the power wire, the ground wire, and the data transmission wires. The power wire includes a conductor (11), an insulating layer (12) outside the conductor, and a metal shielding layer (13) outside the insulating layer. The power wire and the data transmission wires are spaced from each other by plastic materials.
    Type: Grant
    Filed: February 19, 2017
    Date of Patent: January 8, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: A-Nan Yang, Hong-Ping Wang, Lu-Yu Chang
  • Patent number: 10176906
    Abstract: Provided is a shielded conductive path exhibiting a shielding function over a broad frequency band between a low frequency and a high frequency even when the shielding member has a small cross-sectional area. A shielded conductive path includes conductive path main bodies, insulating layers surrounding the conductive path main bodies, and shielding members facing the outer circumferential surfaces of the insulating layers, each have a configuration in which a conductive layer and a magnetic layer are layered together. Electromagnetic noise in a frequency band between a low frequency and an intermediate frequency is blocked with the conductive layer, and electromagnetic noise in a frequency band between an intermediate frequency and a high frequency is blocked with the magnetic layer. The different frequency regions are assigned to the conductive layer and the magnetic layer, and therefore, the cross-sectional areas of the conductive layer and the magnetic layer need not be increased.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: January 8, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Yoshio Mizutani
  • Patent number: 10177468
    Abstract: A heat-shrinkable protective element having at least one protective layer is obtained from a polymeric composition having a polymer material, where the polymeric composition additionally has an electrically conducting filler having a BET specific surface of at least 100 m2/g according to Standard ASTM D 6556.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: January 8, 2019
    Assignee: NEXANS
    Inventors: Arnaud Allais, Anthony Combessis, Lionel Flandin, Melek Maugin, Mathieu Badard
  • Patent number: 10173612
    Abstract: A wiring attachment assembly includes a stud having at least one channel, a gripping washer engaging the stud in the at least one channel and a wiring conduit including a receiver engaging and holding the stud. A wiring system, incorporating the wiring attachment assembly and an insulator element, as well as a method of wiring for a power folding seat are also disclosed.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: January 8, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Vincent John Buttimer, Bryn Arthur Davies, Keith Alan Brown
  • Patent number: 10172238
    Abstract: A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor body includes first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively. The multilayer capacitor includes first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: January 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Sam Choi, Ki Pyo Hong
  • Patent number: 10164418
    Abstract: Mounting devices for an elongate flexible member, such as an electrical cable passing through the wall of a structure, are described. The mounting devices may include an elongate body having a longitudinal axis and elongate recesses that are inclined with respect to the longitudinal axis. An internal passageway for the elongate flexible member may pass through the elongate body parallel to the longitudinal axis, and apertures corresponding to the recesses may be disposed in the outer peripheral face of the elongate body. An engagement member, such as a ball, may be mounted in each recess and move along the recess. The engagement members, recesses and the apertures may be dimensioned to allow the engagement members to project partially beyond the outer peripheral face of the elongate body but to prevent the engagement members from leaving the recesses through the apertures in the outer peripheral face of the elongate body.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: December 25, 2018
    Assignee: First Subsea Limited
    Inventors: Craig Richard Thomson, John Stuart Shaw
  • Patent number: 10164420
    Abstract: A fastening device is provided for fastening of a cable termination to a bracket. The fastening device includes a flange for attachment to the cable termination, the flange having a circumferentially extending groove; and one or more attachment members for fastening the fastening device to the bracket, each of the one or more attachment members being arranged such as to be slidable along the circumferentially extending groove. An arrangement including a cable termination and a fastening device is also provided.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: December 25, 2018
    Assignee: NKT HV Cables GmbH
    Inventor: Anders Lundblad
  • Patent number: 10164348
    Abstract: A one piece integral electrical terminal has a mount portion and a wire receiving portion. The wire receiving portion has a continuous annular interior wall having a contact portion with an integral oxide breaker especially suited to breaking through the oxide layer on aluminum wire. The wire receiving portion also has a sealing portion with at least one integral seal ring. An electrical cable is made by crimping the electrical terminal to an aluminum wire using a modified hexagonal crimp.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: December 25, 2018
    Assignee: Carlisle Interconnect Technologies, Inc.
    Inventors: Kenneth J. Peters, William L. Arenburg
  • Patent number: 10163546
    Abstract: A field control device for a high-voltage system includes a shielding element for field control, which can be connected to an electrical conductor of the high-voltage system in an electrically conductive manner and, when connected to the conductor, at least partly delimits a weak-electric-field spatial region. A cooling body, which can be connected to the electrical conductor in a thermally conductive manner and which is disposed within the weak-field spatial region, has an outer surface area which is greater than an outer surface area of the shielding element. A high-voltage system having the field control device is also provided.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: December 25, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventors: Michael Hofstetter, Jochen Schaefer, Andreas Philipp
  • Patent number: 10158217
    Abstract: Method and apparatus are disclosed for interlocking wire conduits for vehicles. An example vehicle includes wiring and conduits. The conduits include a first conduit and a second conduit that each include an inner surface defining a pathway for the wiring, an outer surface, annular ribs extending from the outer surface and defining annular grooves, flanges protruding from distal ends of the annular ribs and configured to interlock with the flanges of the other of the conduits.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: December 18, 2018
    Assignee: Ford Global Technologies, LLC
    Inventor: John Orischak
  • Patent number: 10158219
    Abstract: An electric field control device for a high voltage cable includes a stress cone and a field grading adapter, wherein the stress cone and the field grading adapter are chemically bonded by vulcanization. An electric installation includes a power cable and the electric field control device. A method for producing the electric field control device is also disclosed.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: December 18, 2018
    Assignee: ABB HV CABLES (SWITZERLAND) GMBH
    Inventors: Fredrik Fälth, Markus Saltzer, Santhosh Bvmp, Hossein Ghorbani
  • Patent number: 10153070
    Abstract: A waterproof structure of a wire harness includes at least one bundle of an electric wire group in which a plurality of electric wires are linearly arranged, a damming part made of a hard resin material, the damming part which surrounds a part of the electric wire group in an extension direction of the electric wire group and which includes an outer periphery shape part according to a shape of a trapezoidal through hole in an electric wire group insertion part with a divided structure, and a water stop material which prevents water from entering a gap between the electric wire group insertion part and the outer periphery shape part and which is formed on an inner peripheral surface of the through hole.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: December 11, 2018
    Assignees: YAZAKI CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kimitoshi Makino, Tetsuro Saimoto, Akihito Shibuya, Masaaki Sugiyama, Masataka Yamamoto, Kenji Kinezuka, Shinya Matsurra, Yasuhiro Suzuki, Takafumi Mori, Takenori Tsuchiya
  • Patent number: 10153064
    Abstract: An interface device comprises a layer of a material thoroughly crossed by metal electrodes intended to electrically connect two electronic circuits. According to the present invention, the layer of material comprises a graphene layer and the electrodes each comprise a central electrically-conductive element formed across the thickness of the graphene layer and an electrically-insulating peripheral layer, interposed between the central element and the graphene layer.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: December 11, 2018
    Assignee: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventors: Abdelkader Aliane, Philippe Coronel