Patents Examined by Timothy Thompson
  • Flat circuit body with terminal and manufacturing method thereof
    Patent number: 10085340
    Abstract: A portion of a flat conductor is exposed from an insulating layer covering at least one of surfaces of the flat conductor. A terminal includes a bottom plate on which the exposed portion of the flat conductor is provided, and crimp claws which are raised at two side edges of the bottom plate so that the exposed portion is disposed therebetween. The exposed portion is folded so as to define a bottom layer which faces the bottom plate and a top layer which faces opposite to the bottom plate. The top layer is configured to be plastically deformed so as to fill a gap between the top layer and inner surfaces of the crimp claws when the crimp claws are crimped onto the top layer, so that the bottom layer is in surface contact with the bottom plate.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: September 25, 2018
    Assignee: YAZAKI CORPORATION
    Inventor: Naoki Ito
  • Circuit board structure
    Patent number: 10080295
    Abstract: Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: September 18, 2018
    Assignee: Unimicron Technology Corp.
    Inventor: Kun-Chen Tsai
  • Carbon-fiber-reinforced plastic structure and method for producing same
    Patent number: 10080286
    Abstract: A spar includes a conductive layer laminated and formed on a carbon-fiber prepreg, and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: September 18, 2018
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventor: Hiroyuki Waku
  • Insulation film and flexible flat cable
    Patent number: 10074458
    Abstract: The present disclosure relates to an insulation film capable of being used in a flexible flat cable(FFC) and having excellent flexibility and mechanical properties, and a flexible flat cable (FFC) using the insulation film. The insulation film provided in the present disclosure has very excellent mechanical properties such as tensile strength, elongation and flexibility, and also has very excellent heat-resisting properties such as contractibility and degeneration caused by heat. In addition, by using the insulation film, the flexible flat cable provided in the present disclosure also has very excellent mechanical properties and heat-resisting properties.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: September 11, 2018
    Assignee: DOOSAN CORPORATION
    Inventors: Sung-Moon Kim, Kwang-Seok Park, Eui-Dock Ryu, In-Ki Jeong, Su-Byung Park
  • Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages
    Patent number: 10076023
    Abstract: A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: September 11, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Deog-Soon Choi, Chang-Yul Cheon, Sang-Hwa Jung, Sung-Phyo Lim, Aaron Lee
  • Multifunctional cable
    Patent number: 10074460
    Abstract: A multifunctional cable is particularly suitable for the automotive industry. The multifunctional cable has a plurality of functional elements. A core in the form of a sheathed line contains at least one inner functional element. At least one outer functional element is wound around the sheathed line core.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: September 11, 2018
    Assignee: LEONI Kabel GmbH
    Inventor: Roland Schropp
  • Electrically conductive articles
    Patent number: 10076026
    Abstract: Articles comprising a substrate having a first major surface; an electrical conductor pattern on the first major surface of the substrate, the electrical conductor pattern comprising a plurality of separated pairs of separated first and second electrically conductive metallic traces. Optionally the articles further comprise a first electrically conductive layer. Embodiments of articles described herein are useful in, for example, displays, touch sensors, lighting elements, photovoltaic cells, electrochromic windows and displays, and electroluminescent lamps and displays.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: September 11, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew H. Frey, Brock A. Hable, Thomas Herdtle
  • Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
    Patent number: 10076032
    Abstract: A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 ?g/cm2 or more and 10 ?g/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: September 11, 2018
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Takashi Kasuga, Yoshio Oka, Shigeyoshi Nakayama, Jinjoo Park, Sumito Uehara, Kousuke Miura, Hiroshi Ueda
  • Printed circuit board with connector header mounted to bottom surface
    Patent number: 10076033
    Abstract: An apparatus may include a printed circuit board, an integrated circuit mounted on a first surface of the printed circuit board, and one or more vias that extend through the printed circuit board from the first surface to a second surface of the printed circuit board to provide electrical connectivity for the integrated circuit. The second surface of the printed circuit board may be opposite the first surface of the printed circuit board. The apparatus may include a pin header that mechanically supports one or more pins that provide electrical connectivity for the integrated circuit. The pin header may be mounted to the second surface of the printed circuit board to mate the one or more pins with the one or more vias to provide electrical connectivity for the integrated circuit.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: September 11, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Boris Reynov, Shreeram Siddhaye, Venkata S. Raju Penmetsa, Jack W. Kohn
  • Copper alloy element wire, copper alloy stranded wire, and automotive electric wire
    Patent number: 10074452
    Abstract: A copper alloy element wire 1 has a chemical composition including: 0.45 mass % or more and 2.0 mass % or less, in total, of at least one additive element selected from the group consisting of Fe, Ti, Sn, Ag, Mg, Zn, Cr and P; in mass ppm, 10 ppm or less of H content, and the balance being Cu and unavoidable impurities. A copper alloy stranded wire 2 includes a plurality of the copper alloy element wires 1 twisted together. An automotive electric wire 5 includes the copper alloy stranded wire 2 and an insulator 3 that covers the outer periphery of the copper alloy stranded wire 2.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: September 11, 2018
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hiroyuki Kobayashi, Akiko Inoue
  • Method for producing an electrode lead or a catheter, and associated semifinished product
    Patent number: 10068681
    Abstract: A method for producing a medical electrode lead or a catheter, and also to an associated semifinished product. The semifinished product for this purpose includes a cable having at least one electrical conductor, which is embedded in a sheath made of an electrically insulating, thermoplastic material. It is characterized in that the cable, at least at one cable end, forms a connection point, via which the conductor can be attached permanently and non-detachably to further components, wherein part of the surface of the conductor is exposed in the region of the connection point and forms a contact face, and the sheath has, in the region of the connection point, a recess that is continuous in the longitudinal direction of the cable.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: September 4, 2018
    Assignee: BIOTRONIK SE & Co. KG
    Inventors: Eckardt Bihler, Marc Hauer, René Toelke
  • Electrical device
    Patent number: 10070545
    Abstract: The invention relates to an electrical device (1) having a housing (2) and at least one receiving shaft (3), which is accessible from an outer side of the housing (2), for an electronic data storage means (4) which can be inserted into the receiving shaft (3) and, as a result, can make contact with electrical components arranged in the electrical device (1) and optionally can be removed again from the receiving shaft (3), wherein the receiving shaft (3) is surrounded at least partially by a recessed grip (5) on the outer side of the housing (2), which recessed grip is designed as a depression with respect to the outer contour of the housing (2), wherein at least one light exit opening (9) for light output by at least one electric light source (10) of the electrical device (1) is arranged within the recessed grip (5).
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: September 4, 2018
    Assignee: WAGO VERWALTUNGSGESELLSCHAFT MBH
    Inventor: Lars Binner
  • Rare earth materials as coating compositions for conductors
    Patent number: 10068683
    Abstract: A conductor includes a core with at least one conductive filament, and a coating deposited on a surface of the core. The coating is made of a rare earth material that includes at least one rare earth element selected from the group consisting of Lanthanum (La), Cerium (Ce), Praseodymium (Pr), Neodymium (Nd), Promethium (Pm), Samarium (Sm), Europium (Eu), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), Thulium (Tm), Ytterbium (Yb), Lutetium (Lu), Scandium (Sc) and Yttrium (Yt).
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: September 4, 2018
    Assignee: Southwire Company, LLC
    Inventor: Bobby G. Watkins, II
  • Insulation structure for splice portion, harness mounting plate, and wiring unit
    Patent number: 10069286
    Abstract: An insulation structure for a splice portion, a harness mounting plate, and a wiring unit that are capable of reducing labor-hours that are required when insulating a splice portion where a plurality of electrical wires are connected by a splice terminal. A plurality of electrical wires are connected by a splice terminal, wherein an opening portion that allows the splice portion to be inserted thereinto and removed therefrom is formed in a splice housing portion that surrounds and insulates the splice portion, and the insulation structure is provided with a separation restricting portion that restricts the splice portion that is housed in the splice housing portion from becoming separated from the opening portion.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: September 4, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kosuke Sone, Tetsuji Tanaka, Osamu Nakayama, Tomohide Maki
  • Heat-shrinkable tube attachment jig, method for manufacturing heat-shrinkable tube-equipped wire, and heat-shrinkable tube-equipped wire
    Patent number: 10069220
    Abstract: A heat-shrinkable tube attachment jig includes a terminal holding portion that holds a plate-shaped counterpart connecting portion of a terminal, a placement portion on which a distal end portion of a heat-shrinkable tube that is located on the counterpart connecting portion side is placed, and a wire holding portion that holds a wire. The placement portion clamps the distal end portion of the heat-shrinkable tube between the placement portion and a bottom portion of the terminal on which the wire held by the terminal holding portion is arranged. A placement surface of the placement portion on which the distal end portion of the heat-shrinkable tube is placed is disposed at a higher position than a lower surface of the counterpart connecting portion of the terminal held by the terminal holding portion.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: September 4, 2018
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Hiroshi Sudou
  • Power adapter
    Patent number: 10070543
    Abstract: A power adapter including a first substrate, a second substrate, a transformer and an insulating frame is provided. The first substrate includes a first terminal set. The second substrate includes a second terminal set. The transformer includes a primary side connection terminal and a secondary side connection terminal, wherein the primary side connection terminal is connected to the first terminal set and the secondary side connection terminal is connected to the second terminal set. The insulating frame is disposed between the first substrate and the second substrate, and the transformer leans against the insulating frame.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: September 4, 2018
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Chih-Pin Sung, Kuo-Lung Chang, Yi-Ling Chen, Kun-Hua Tsai, Zih-Yi Yang
  • Rigid joint assembly
    Patent number: 10063044
    Abstract: A rigid joint assembly for jointing two cables; the assembly includes outer cable entry parts outside a water-tight casing assembly. A first and second cable insulation system deformation preventing devices are provided, each including a rigid pipe, which surrounds a respective first or second cable core end section, and a bedding material layer, which extends at least partially along a length of an inner surface of the respective rigid pipe. The assembly further includes first and second grooved pipes of elastic material having a plurality of grooves on the side facing the cable, each grooved pipe surrounding the respective first or second cable core end section at a respective inner cable entry part inside the water-tight casing assembly 30.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: August 28, 2018
    Assignee: NKT HV Cables GmbH
    Inventors: Håkan Sandell, Andreas Tyrberg, Armando León-Guarena, Henrik Ekholm
  • PCB processing method and PCB
    Patent number: 10064271
    Abstract: The present disclosure discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present disclosure, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: August 28, 2018
    Assignee: ZTE CORPORATION
    Inventors: Bi Yi, Fengchao Ma, Yonghui Ren, Wang Xiong, Yingxin Wang
  • Multilayer electronic component and board having the same
    Patent number: 10062511
    Abstract: A multilayer electronic component includes a capacitor body with first and second external electrodes on a mounting surface of the capacitor body. First and second connection terminals include insulators and are respectively connected to the first and second external electrodes. The first connection terminal includes first to third conductive patterns and a first cut portion a side surface. The second connection terminal includes fourth to sixth conductive patterns and a second cut portion in a side surface.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: August 28, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji
  • High density shielded electrical cable and other shielded cables, systems, and methods
    Patent number: 10056170
    Abstract: A shielded cable includes adjacent first and second conductor sets, each conductor set includes a pair of insulated conductors. At least 90% of a periphery of each conductor set is encompassed by a shielding film. The cable also includes first and second non-conductive polymeric films disposed on opposite sides of the cable. The polymeric films include cover portions and pinched portions. In transverse cross section, the cover portions of the polymeric films in combination surround the conductor sets, and the pinched portions of the polymeric films in combination form pinched portions of the cable on each side of the cable. When the cable is laid flat, a center-to-center spacing of the pair of insulated conductors for the first conductor set is ?1 and a center-to-center spacing of the first and second conductor sets is ?. ?/?1 is less than 4.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: August 21, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Douglas B. Gundel, Rocky D. Edwards, Mark M. Lettang, Charles F. Staley