Patents Examined by Timothy V. Eley
  • Patent number: 10583347
    Abstract: The present document describes a blade sharpening system comprising a blade sharpening device, a blade holding apparatus and a controller operatively coupled to the blade sharpening device and said blade holding apparatus to control sharpening of said blade, and methods of using the same.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: March 10, 2020
    Assignee: AIGUISAGE ELITE INC.
    Inventor: Denis Proulx
  • Patent number: 10576600
    Abstract: Disclosed is an apparatus for processing a lens edge. The apparatus comprises: a wheel-shaft-moving rotating member whose one end is fixed to a fixing frame by a moving-shaft, for moving pivotally about the moving-shaft; a wheel-shaft mounted on the other end of the wheel-shaft-moving rotating member, for moving pivotally with the wheel-shaft-moving rotating member and for being rotated by driving a wheel-rotating motor; and a cutter for processing the lens edge into a form of a step/incline shape, the cutter being coupled to one end of the wheel shaft to move with the wheel-shaft to contact the lens edge, and rotated with the wheel shaft to cut the surface of the lens, and the cutter comprising a rotating body inserted into the wheel-shaft to rotate with the wheel-shaft, and at least one cutting projection formed on the circumference of the rotating body to cut the edge and the periphery of the lens.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: March 3, 2020
    Assignee: HUVITZ CO., LTD.
    Inventors: Hyun Chul Lee, Seung Suk Ha
  • Patent number: 10569380
    Abstract: A receiving unit receives sensor data output from an eddy current sensor for detecting the film thickness of a polishing object to generate film thickness data. A correcting unit corrects the film thickness data in an inside of the edge of the polishing object based on the film thickness data generated by the receiving unit. The correcting unit corrects the film thickness data generated by the receiving unit in the inside of the edge of the polishing object using the film thickness data generated by the receiving unit in an outside of the edge of the polishing object.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: February 25, 2020
    Assignee: EBARA CORPORATION
    Inventor: Akira Nakamura
  • Patent number: 10569387
    Abstract: The invention relates to a polishing disc for a tool for fine processing optically active surfaces on spectacle lenses, having a main body which has a central axis and to which an intermediate layer that is softer than the main body and is made of a resilient material is secured, a polishing medium carrier resting on the intermediate layer. The intermediate layer has at least two regions with different degrees of hardness, said regions being arranged one behind the other in the direction of the central axis of the main body. The intermediate layer region adjoining the main part is softer than the intermediate layer region on which the polishing medium carrier rests.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: February 25, 2020
    Assignee: Satisloh AG
    Inventors: Peter Philipps, Andreas Kaufmann, Steffen Wallendorf, Holger Schäfer
  • Patent number: 10562154
    Abstract: Disclosed herein is a cutting blade including diamond abrasive grains and boron compound grains. The average grain size of the diamond abrasive grains falls within the range of 5 ?m to 50 ?m. The average grain size of the boron compound grains is greater than ? and less than or equal to ½ of the average grain size of the diamond abrasive grains.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: February 18, 2020
    Assignee: DISCO CORPORATION
    Inventors: Ryogo Maji, Ryuji Oshima, Yoshiki Ishiai
  • Patent number: 10562152
    Abstract: A process for modifying the appearance of a surface is provided. The process includes a stage of spraying particles exhibiting a maximum size of less than or equal to 500 ?m. The sprayed particles exhibit a relative density of greater than 90%, more than 5% and less than 80% by volume of the sprayed particles being particles exhibiting a salient sharp edge. The salient sharp edge is referred to as “notching particles”.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: February 18, 2020
    Assignee: SAINT-GOBAIN CETRE DE RECHERCHES ET D'ETUDES EUROPEEN
    Inventors: Anne-Laure Beaudonnet, Julien Cabrero, Thomas Lambert
  • Patent number: 10562149
    Abstract: A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: February 18, 2020
    Assignee: Cabot Microelectronics Corporation
    Inventors: Lin Fu, Rui Ma, Nathan Speer, Chen-Chih Tsai, Kathryn Bergman
  • Patent number: 10562153
    Abstract: A method for producing a coated abrasive includes producing or providing an intermediate abrasive product that comprises a substrate, a plurality of abrasive grains that are bonded to the substrate, and at least one layer of an uncured size coat that at least partially covers the abrasive grains with the uppermost size coat being uncured. The method further includes applying at least one grinding additive to the uppermost, uncured size coat with the grinding additive applied to the size coat in dry form. The method also includes curing the uppermost size coat. A coated abrasive is produced by the method and the coated abrasive is used to process a surface.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: February 18, 2020
    Assignee: sia Abrasives Industries AG
    Inventors: Adrian Schoch, Bruno Oberhaensli
  • Patent number: 10556319
    Abstract: A grinder includes a motor, a housing, a spindle and a cover. The spindle protrudes downward from the housing, is driven by the motor, and thereby rotates. The cover at least partially covers a tool accessory mounted on the spindle. The cover includes a first cover part and a second cover part. The first cover part is fixed to the housing and at least partially covers the tool accessory from above. The second cover part is held such that it is capable of moving relative to the first cover part. The grinder is configured such that the area of the tool accessory covered by the cover changes in accordance with the relative movement.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: February 11, 2020
    Assignee: MAKITA CORPORATION
    Inventors: Junichi Iwakami, Hideharu Muto, Naoki Soeda, Ryosuke Otani
  • Patent number: 10556313
    Abstract: A grinding or sanding machine for grinding or sanding a surface of a workpiece includes a transportation device for transporting a work piece, a revolving grinding or sanding belt, and at least one pressure beam for exerting a pressure toward the transportation device. A plate is provided that is movable in a plane perpendicular to the direction in which pressure is exerted. The plate is disposed between the belt and the pressure beam. A drive device randomly moves the plate in plate movement directions in terms of either or both direction and speed.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: February 11, 2020
    Assignee: Karl Heesemann Maschinenfabrik GmbH & Co. KG
    Inventor: Christoph Giese
  • Patent number: 10549727
    Abstract: Wheel cleaning systems and methods are described for removing corrosion from a wheel rim. An enclosure comprises a plurality of walls that define a work area, and houses a turntable that can hold a wheel rim. The turntable is driven by a motor to rotate the wheel about an axis. The enclosure may have a transparent shield or window to allow a user to view the wheel during the cleaning process and be protected from sparks and other debris. The enclosure may be fully enclosed with gloved openings, or contain one or more open sections to allow the user to maneuver a tool (e.g., a grinder) in multiple positions within the enclosure, and clean the wheel rim. The system further comprises an exhaust unit that draws out small particles and airborne debris from within the enclosure, and produced during a cleaning process.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: February 4, 2020
    Assignee: Matthews Tire, Inc.
    Inventor: Trevor Rezner
  • Patent number: 10537974
    Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: January 21, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
  • Patent number: 10537972
    Abstract: A polishing method including rubbing a wafer held by holding means against a polishing pad attached to a turntable while cooling the turntable by supplying a refrigerant to a refrigerant flow path provided in the turntable which is driven to rotate by a motor, thereby performing polishing, the polishing method being characterized in that, during standby after end of the polishing of the wafer and before performing the polishing of a next wafer, a flow volume of the refrigerant is controlled to be less than a flow volume of the refrigerant during the polishing where the wafer is polished, the turntable is rotated by the motor, and a water retaining liquid having a temperature adjusted to a room temperature or more is supplied to the polishing pad.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: January 21, 2020
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Junichi Ueno, Michito Sato, Kaoru Ishii
  • Patent number: 10537976
    Abstract: Provided is a formed rotary dresser that has regions in which diamond abrasive grains are scattered and arranged on an outer circumferential surface thereof brought into contact with a grindstone, and slit regions in which the diamond abrasive grains are not arranged on the outer circumferential surface thereof. The plurality of slit regions are provided to be inclined with respect to a rotational axis. A plurality of octahedral diamond abrasive grains are arranged along downstream edges of the slit regions in a rotating direction such that any face of an octahedron is parallel with the outer circumferential surface.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: January 21, 2020
    Assignee: NSK LTD.
    Inventors: Susumu Nakano, Masashi Yanagisawa, Sadao Sakakibara
  • Patent number: 10532442
    Abstract: A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: January 14, 2020
    Assignees: SHIN-ETSU HANDOTAI CO., LTD., FUJIKOSHI MACHINERY CORP.
    Inventors: Michito Sato, Junichi Ueno, Kaoru Ishii, Hiromi Kishida, Yuya Nakanishi, Ryosuke Yoda, Yosuke Kanai
  • Patent number: 10532443
    Abstract: A method is disclosed for grinding grooves on workpieces using a profiled grinding wheel, the profile of which is crushed. A reshaping crush process includes driven crush rollers, each being controlled on the basis of a rotational speed and current consumption. Thus, relative advancement between the grinding wheel and crush roller is controlled according to the speed and current consumption. A grinding machine is also disclosed for grinding a workpiece, wherein the workpiece is held by means of a workpiece spindle head. A crush device comprising a crush roller with a dedicated rotary drive is provided on the grinding machine. The grinding wheel is applied to the crush roller in order to dress the grinding wheel profile. The crush roller has a profile-crushing portion for profile-crushing the grinding wheel with a first dressing volume and a reshaping profile-crushing portion for profile-crushing the grinding wheel with a second dressing volume.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: January 14, 2020
    Assignee: Erwin Junker Maschinenfabrik GmbH
    Inventor: Erwin Junker
  • Patent number: 10532415
    Abstract: A sample preparation saw (10) has a base (130, 146, 14, 47), a housing (12, 76), a saw (10) assembly (30, 58) mounted to the base (130, 146, 14, 47), a dressing assembly (58), a sample clamping assembly (100) mounted to the base (130, 146, 14, 47), and a reservoir assembly (30, 58). The saw (10) assembly (30, 58) includes a blade assembly (30) with a rotating blade (24). The blade assembly (30) is movable along x-, y- and z-axes by at least two drives (27, 36). The dressing assembly (58) is operable to dress the rotating blade (24). The sample clamping assembly (100) includes a rail (102), a sample mount (104) removably positioned on the rail (102) and a saddle (106) operable to hold a sample. The reservoir assembly (30, 58) is operable to recirculate a rinse fluid sprayed on the rotating blade (24), and includes a basin (178) having a pump (180) and a series of weirs (188A, 188).
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: January 14, 2020
    Assignee: Illinois Tool Works Inc.
    Inventors: Bryan J. Kordus, Chelsea B. Frid, Jeffrey E. Joray, Nanu M. Vahora, Sarah M. Beranek, Michael Shtilman, Douglas A. Ceckowski
  • Patent number: 10525564
    Abstract: Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: January 7, 2020
    Assignee: Ebara Corporation
    Inventors: Kenichi Akazawa, Kenichi Kobayashi, Akihiro Yazawa, Manao Hoshina
  • Patent number: 10518379
    Abstract: Provided is a grinding machine for processing a sweep edge of a rotor blade, including a grinding unit with a driven grinding tool, a workpiece receiving device which is designed for receiving a rotor blade to be ground, and a workpiece drive unit which is configured for moving the workpiece receiving device, with a rotor blade received thereon, relative to the grinding tool for the purpose of machining the sweep edge, wherein the workpiece drive unit has a pivot axis at which the workpiece receiving device is held in such a way that the sweep edge of a rotor blade received thereon is engaged with the grinding tool in the course of a pivot movement of the workpiece receiving device about the pivot axis.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: December 31, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Julian Philip Heiderich, Karsten Schäffer, Stefan Sellmann, Marat Visajtaev, Felix Vogt
  • Patent number: 10518381
    Abstract: A method of lapping multiple row bars provided in a stack, including the steps of electrically connecting at least one row bar bond pad of a first row bar to at least one carrier bond pad of a carrier, electrically connecting an outermost row bar of the stack to the first row bar of the stack by at least one electrical trace, wherein the outermost row bar comprises at least one electronic lapping guide, lapping an outer surface of the outermost row bar until a signal provided by the at least one electronic lapping guide of the outermost row bar reaches a predetermined value, terminating the lapping of the outermost row bar, and removing the outermost row bar from the stack to expose a second row bar, wherein the second row bar is electrically connected to the first row bar with the at least one electrical trace.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: December 31, 2019
    Assignee: Seagate Technology LLC
    Inventors: Gary J. Kunkel, Zoran Jandric