Abstract: A grinding arm for grinding workpieces with an inner profile with a grinding wheel. The grinding arm has a tube-shaped base body with a longitudinal axis, in which the grinding wheel is supported at one axial end region. A first drive for the grinding wheel is arranged in its other axial end region. A first transmission system transmits the rotation from the first drive to the grinding wheel. In order to adjust arbitrary angles of inclination of the grinding wheel in the grinding arm, the grinding wheel is arranged on a grinding spindle driven by the first transmission system and rotating around an axis of rotation. The grinding spindle is supported in a carrier body arranged in the base body rotatable around an axis perpendicular to the longitudinal axis as well as perpendicular to the axis of rotation, wherein the axis of rotation and the axis intersect.
Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.
Abstract: A polishing tool unit (1) includes a brush-shaped grinding stone (4) and a tool holder (2). The tool holder (2) includes a shank (2a), a sleeve (6), a gear screw (30), and a nut (36). The nut (36) is screwed onto a bolt portion (34) of the gear screw (30). The brush-shaped grinding stone (4) is connected to the front side of the nut (36) and held by the tool holder (2). The gear screw (30) is rotatable relative to the shank (2a) and the sleeve (6) about the axis (L). While rotation of the nut (36) about the axis (L) is regulated, the gear screw (30) is rotated, whereby the nut (36) is moved and the protruding amount of linear grinding members (3) is adjusted.
Abstract: A system and a method for sawing control joints in concrete barriers is provided. The system includes a barrier mounting frame slidably mountable about the barrier, on the top, first and second lateral faces of the barrier. The system also includes a saw attachment having a circular saw attached thereto, the circular saw being manually operable. A linkage assembly connects the frame mounting barrier to the saw attachment, and allows to manually move the circular saw up or down, and towards or away from the barrier, when in use, to create the control joint transversally along the top, first and second lateral faces of the barrier.
Abstract: The present invention relates to a polishing method and a polishing apparatus for polishing a substrate such as a wafer while measuring a film thickness based on optical information included in reflected light from the substrate.
Abstract: A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.
Abstract: A method of certifying uniform distribution of mechanical pressure comprises an apparatus for moving an object, the apparatus including an arm (410) with a joint (430) for adjusting a fixture (420) having a flat surface area (420a). The fixture includes vacuum suction for holding the object. The method further uses a pressure sensor (450) with a flat surface area (450a), displaying output voltage as a function of mechanical pressure applied. When the sensor is placed on a chuck with vacuum suction, the apparatus moves (460) to bring the flat fixture surface in touch with the flat sensor. Mechanical pressure is applied from the fixture to the sensor; the voltage output of the sensor is monitored to certify uniform distribution of the fixture pressure across the sensor area.
Abstract: An apparatus for machining an object includes a wheel having a first circular surface, a second circular surface oriented parallel to the first circular surface, a first rim surface extending from the first circular surface at a first edge, and a second rim surface extending from the second circular surface at a second edge and towards the first rim surface. A gradient of the first rim surface has a radial component, and a gradient of the second rim surface has a radial component. The first edge defines a curved surface between the first circular surface and the first rim surface, and the second edge defines a curved surface between the second circular surface and the second rim surface.
August 12, 2016
Date of Patent:
August 20, 2019
Manikanta Saravanan Rajarathinam, Wu Xin Charles Ng, Vigneshwaran Ramalingam
Abstract: The present invention relates to a CMP apparatus having a polishing pad surface property measuring device for measuring surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer.
Abstract: Disclosed is a chemical mechanical polishing apparatus. The chemical mechanical polishing apparatus comprises a lower base, a platen configured to rotate and provided on a top surface of the lower base, a polishing pad on the platen; and at least one slurry supply device that is disposed adjacent to the polishing pad and supplies a slurry to the polishing pad. The slurry supply device comprises a capillary nozzle that is disposed over the polishing pad and includes a pin-type conductive tip therein, a slurry supply unit that supplies the slurry into the capillary nozzle, and a voltage supply unit that applies a voltage to the pin-type conductive tip.
Abstract: A blast cleaning system has a nozzle configured to deliver a pressurized blast cleaning media. The blast cleaning media includes a pressurized fluid and water ice particles as the primary blast cleaning component. The system includes an input hopper configured to accept supplied water ice in bulk form from an outside source. The system further includes a particle sizing module configured to produce the water ice particles for the pressurized blast cleaning media from the supplied water ice after the supplied water ice has been accepted into the input hopper.
Abstract: Systems and methods for treating concrete, which includes the steps of wetting a surface of concrete with colloidal silica, allowing time for the colloidal silica to penetrate the concrete surface, and cutting the surface of the concrete with a bladed or segmented tool wherein the longitudinal blade or edge portion is positioned approximately at an angle between 30 degrees and 90 degrees relative to the surface of the concrete.
Abstract: An apparatus for detecting an abnormality in polishing of an edge portion of a substrate is provided. The apparatus includes: a substrate holder configured to rotate the substrate; a pressing device configured to press a polishing tool against the edge portion of the substrate to polish the edge portion; a measuring device configured to measure a position of the polishing tool relative to a surface of the substrate; and a controller configured to determine an amount of polishing of the substrate from the position of the polishing tool, calculate a polishing rate from the amount of polishing of the substrate, and judge that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
Abstract: A grinding machine, includes a pivotable tool spindle with a workpiece spindle adapted to receive a gearwheel workpiece and for rotationally driving the gearwheel workpiece about a workpiece spindle axis, wherein the tool spindle is configured to receive a grinding tool and rotationally drive the grinding tool about a tool spindle axis, and is carried by a pivot axis in such a way that the tool spindle together with the grinding tool can be pivoted about the pivot axis, and wherein the pivot axis (A) intersects the workpiece spindle axis (C) in a common plane projection, and wherein the pivot axis is offset laterally relative to the workpiece spindle axis and does not intersect the workpiece spindle axis.
Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.
Abstract: A controller of a cutting apparatus includes: a storage section configured to preliminarily store as a threshold an arbitrary value based on a load current value of a motor detected when a cutting blade is rotated at a predetermined rotational speed while supplying a predetermined quantity of cutting water in a state in which a cutting water supply nozzle is positioned in an appropriate position; and a judgment section configured to judge normality or abnormality according to the result of comparison between a load current value detected when the cutting blade is rotated at the predetermined rotational speed while supplying the predetermined quantity of cutting water and the threshold stored in the storage section.
Abstract: A processing apparatus of an embodiment includes a stage that can have a sample placed thereon, a rotation mechanism that rotates the stage, a first nozzle that injects a substance onto the sample, and a second nozzle that supplies fluid to the rotation center of the sample.
Abstract: A honing tool has a tool body and shells disposed on the tool body. Honing stone sets each provided with two or more honing stones are provided. The shells each support one of the honing stone sets. Guide bars of the honing tool are placed against the bore and a portion of the bore is conically honed with decreasing stroke of the honing tool, wherein a lower reversing point of the honing tool remains substantially unchanged. Honing is terminated as soon as an upper reversing point has reached a predetermined terminal value. Alternatively, a portion of the bore is conically honed with a constant stroke of the honing tool, wherein reversing points of the stroke of the honing tool remain substantially unchanged and a feeding force pressing the honing stones against the bore is controlled as a function of a position of the honing tool in the bore.
October 22, 2016
Date of Patent:
June 18, 2019
Gehring Technologies GmbH
Gerhard Flores, Erwin Baumgartner, Manuel Waiblinger, Andreas Wagner
Abstract: A rotating tool includes a tool body including a polishing tool and a shank, and a flange part provided in the tool body. The polishing tool includes a plurality of linear grinding members and a grinding member holder to hold the linear grinding members. The flange part is an annular member, and attached to the grinding member holder, so as to be movable in the direction of an axial line and rotatable about the axial line. When the inner circumferential surface of a hole formed in a workpiece is processed, the grinding member holder and the annular member are inserted into the hole. When run-out on the front side of the rotating tool occurs, the annular member comes into contact with the peripheral wall surface of the hole, whereby the run-out of the tool body is reduced.
Abstract: A method for raising a polishing pad for polishing a silicon wafer, wherein a polishing pad made of foamed urethane resin is attached to a polishing machine, after dressing is performed, dummy polishing is performed, after processing to remove the polishing residues that have built up in the polishing pad by the dummy polishing is then performed, an amount of polishing residues in the polishing pad is measured, and a rise of the polishing pad subjected to the dummy polishing is judged based on the measured amount of polishing residues. As a result, a method for raising a polishing pad can improve the particle level in the polishing pad life early stage.