Patents Examined by Tszfung J Chan
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Patent number: 12255010Abstract: A soundproofing transformer includes a tank; a winding portion and a core portion provided inside the tank; an insulating fluid provided inside the tank; a reinforcing member provided outside of the tank; a cavity having a resonance space and connected to the reinforcing member by a coupling member; a partition member stacked on the cavity, and having an acoustic absorption portion; a noise inlet member having a first inlet facing the tank, connected to the resonance, and configured to transmit noise introduced from the first inlet to the resonance space; and a noise reduction panel connected to at least one of the partition member and the noise inlet member, and having a second inlet provided to communicate with the acoustic absorption portion while facing the tank.Type: GrantFiled: May 19, 2020Date of Patent: March 18, 2025Assignee: Hyundai Electric & Energy Systems Co., Ltd.Inventors: Nowak Dariusz, Bosnjak Bruno, Holaus Walter, Walker Jonas
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Patent number: 12230430Abstract: Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.Type: GrantFiled: April 28, 2022Date of Patent: February 18, 2025Assignee: Intel CorporationInventors: Srinivas Pietambaram, Kristof Darmawikarta, Gang Duan, Yonggang Li, Sameer Paital
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Patent number: 12232264Abstract: In an embodiment, an apparatus and system comprising a first inductor with a first diameter; and a switched inductor including a metal layer and a switch; wherein when the switch is closed the switch connects the metal layer of the switched inductor to form an inductor with a parallel circuit enabling current to flow through the switched conductor; and wherein when the switch is open, current is not enabled to flow through the switched conductor. In another embodiment, a method for tuning a high-Q inductor, the method comprising closing a switch of a switched inductor, wherein the switch connects the switched inductor to a first inductor; wherein closing the switch enables current to flow though the switched inductor as well as the first inductor to change the inductance of the high Q inductor.Type: GrantFiled: September 9, 2019Date of Patent: February 18, 2025Assignee: ACACIA COMMUNICATIONS, INC.Inventors: Ian Dedic, David Enright, Darren Walker, Tarun Gupta
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Patent number: 12224107Abstract: First and second wires form a wire assembly by being wound around a winding core portion together. The wire assembly includes a twisted wire portion, an inner layer portion, an outer layer portion, a plurality of outward transition portions, and an inward transition portion. The outer layer portion includes a first outer layer portion which is connected to one of the outward transition portions extending from an intermediate position of the inner layer portion and connected to the inward transition portion. The inward transition portion extends to an intermediate position of the inner layer portion.Type: GrantFiled: October 25, 2023Date of Patent: February 11, 2025Assignee: Murata Manufacturing Co., Ltd.Inventors: Ryota Hashimoto, Atsuyoshi Maeda, Chihiro Yamaguchi, Hiroyuki Tei, Kohei Kobayashi
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Patent number: 12205745Abstract: A coil component includes an insulating substrate; a coil portion including a coil pattern, having a planar spiral shape, disposed on the insulating substrate; and a body embedding the insulating substrate and the coil portion, wherein the coil pattern comprises a first conductive layer disposed to contact the insulating substrate, and a second conductive layer disposed on the first conductive layer, wherein a thickness (T1) of the insulating substrate and a thickness (T2) of the first conductive layer satisfy 10?T1/T2?20.Type: GrantFiled: September 17, 2019Date of Patent: January 21, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Seong Jeong, Jong Min Lee
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Patent number: 12205754Abstract: An inductor includes a wire, and a magnetic layer covering the wire. The wire includes a conducting line and an insulating layer. The magnetic layer contains an anisotropic magnetic particle and a binder. In a peripheral region of the wire, the magnetic layer includes an orientated region. The peripheral region is, in a cross-sectional view, a region from an outer surface of the wire to an outward distance of 1.5 times an average of the longest length and the shortest length from the center of gravity of the wire to the outer surface of the wire. The upper surface of the inductor has a protruding portion caused by the wire.Type: GrantFiled: February 5, 2020Date of Patent: January 21, 2025Assignee: NITTO DENKO CORPORATIONInventors: Yoshihiro Furukawa, Keisuke Okumura
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Patent number: 12198843Abstract: An inductor includes a wire, and a magnetic layer covering the wire. The wire includes a conducting line, and an insulating layer. The magnetic layer contains an anisotropic magnetic particle and a binder. In a peripheral region of the wire, the magnetic layer includes an orientated region in which the anisotropic magnetic particle is orientated along the periphery of the wire. The peripheral region is, in a cross-sectional view, a region from an outer surface of the wire to an outward distance of 1.5 times an average of the longest length and the shortest length from the center of gravity of the wire to the outer surface of the wire. An upper surface and a lower surface of the inductor are flat.Type: GrantFiled: February 5, 2020Date of Patent: January 14, 2025Assignee: NITTO DENKO CORPORATIONInventors: Yoshihiro Furukawa, Keisuke Okumura
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Patent number: 12183502Abstract: An inductor component includes an element assembly formed of an insulator material and an inner electrode arranged in the element assembly. The insulator material contains a base material formed of an amorphous material containing B, Si, O, and K and a crystalline filler and includes a filler-poor glass portion in a region along the inner electrode. The content of the crystalline filler in the filler-poor glass portion is lower than the content of the crystalline filler in the element assembly excluding the filler-poor glass portion.Type: GrantFiled: October 20, 2023Date of Patent: December 31, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Rikiya Sano, Kenta Kondo, Yoshiyuki Oota
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Patent number: 12165797Abstract: The present technology provides a chip inductor of which the height can be reduced. The chip inductor includes a sealing resin having a mounting face; a coil conductor disposed in the sealing resin, including an inner end and an outer end, and spirally wound; an inner terminal disposed on the mounting face, and electrically connected to the inner end; and an outer terminal disposed on the mounting face and electrically connected to the outer end.Type: GrantFiled: March 29, 2019Date of Patent: December 10, 2024Assignee: ROHM Co., LTD.Inventor: Takuma Shimoichi
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Patent number: 12154708Abstract: An inductor device includes a first coil, a second coil and a toroidal coil. The first coil is partially overlapped with the second coil in a vertical direction. The toroidal coil is disposed outside the first coil and the second coil. The first coil is interlaced with the second coil at a first side and a second side of the inductor device.Type: GrantFiled: April 21, 2021Date of Patent: November 26, 2024Assignee: Realtek Semiconductor CorporationInventors: Hsiao-Tsung Yen, Ka-Un Chan
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Patent number: 12148559Abstract: A reactor includes an assembly of a coil and a magnetic core, a case for accommodating the assembly inside, a sealing resin portion for at least partially sealing the assembly by being filled into the case, and a supporting portion to be fixed to the case in a cantilever manner. The case includes a bottom plate portion, and a side wall portion. The side wall portion includes a pair of short side portions and a pair of long side portions having different lengths along a circumferential direction of the case. The supporting portion includes a fixed end to be fixed to an end surface of the short side portion of the side wall portion, an overlapping region configured to overlap the outer core portion from above, and a free end not to be fixed to the case.Type: GrantFiled: November 5, 2019Date of Patent: November 19, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Takehito Kobayashi, Kohei Yoshikawa, Seiji Shitama, Naotoshi Furukawa
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Patent number: 12142412Abstract: An inductor device includes a first coil and a second coil. The first coil includes a first connection member and a plurality of first circles. At least two first circles of the first circles are located at a first area, and half of the first circle of the first circles is located at a second area. The second coil includes a second connection member and a plurality of second circles. At least two second circles of the second circles are located at the second area, and half of the second circle of the second circles is located at the first area. The first connection member is coupled to the at least two first circles and the half of the first circle. The second connection member is coupled to the at least two second circles and the half of the second circle.Type: GrantFiled: September 17, 2020Date of Patent: November 12, 2024Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Cheng-Wei Luo, Chieh-Pin Chang, Kai-Yi Huang, Ta-Hsun Yeh
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Patent number: 12142410Abstract: An iron core (1, 11, 31) for a stationary induction apparatus according to one embodiment is configured by laminating a plurality of electromagnetic steel plates (5, 16, 33). The electromagnetic steel plates are laminated so that joint parts (6, 17, 18, 32), at which the end portions of the electromagnetic steel plates abut one another, are disposed in a staggered manner; and the electromagnetic steel plates are provided with a magnetic domain fine differentiation processed part (7, 19, 34), which is located on the portion, of a surface of the end portion of each of the electromagnetic steel plates, lapped with the joint part of another electromagnetic steel plate, and which has been subjected to warping-derived magnetic domain fine differentiation.Type: GrantFiled: November 6, 2019Date of Patent: November 12, 2024Assignees: Toshiba Industrial Products and Systems Corp.Inventors: Tsuyoshi Masuda, Eiji Shimomura, Masato Enokizono
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Patent number: 12134130Abstract: A blank for a conduit arrangement includes an annular conduit having a first end and a second end, which is formed by a channel surrounded by a wall. The conduit arrangement has an axis of rotation and the conduit extends in a circumferential direction over an angle of more than 360 degrees about the axis of rotation and forms at least one wind turn. The axis of rotation is arranged perpendicularly to a base surface, the wall having first surfaces which are arranged at a first angle of at least 30 degrees relative to the base surface or in which a surface normal forms at least one second angle of 0 to 60 degrees with respect to the base surface. First partial surfaces of the walls, which face one another in an axial direction, of adjacent turns are arranged spaced apart from one another. The blank is produced by an additive manufacturing process.Type: GrantFiled: May 24, 2018Date of Patent: November 5, 2024Assignee: GKN Driveline International GmbHInventors: Rolf Cremerius, Thomas Weckerling, Ümit Aydin, Galina Ermakova
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Patent number: 12125629Abstract: A transformer with integrated cooling is disclosed. The transformer comprises a primary winding and a secondary winding, and a coolant line partly or completely embedded in at least one of the primary or secondary windings. The coolant line is supplied with coolant from a supply device. The coolant line has a plurality of exit holes that are arranged to lead in a direction of at least one of the primary or secondary winding, so as to supply it with coolant.Type: GrantFiled: June 2, 2021Date of Patent: October 22, 2024Assignee: DEERE & COMPANYInventors: Nicolai Tarasinski, Volker Kegel, Dennis Kremer
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Patent number: 12119152Abstract: A laminate of a laminated coil includes first and second sections in a stacking direction from a first surface toward a second surface. The number of windings of each of coil conductor patterns on insulation resin layers, respectively, in the first region is equal to or more than the number of windings of a coil conductor pattern on an insulation resin layer in the second section, and is more than the number of windings of the coil conductor pattern closest to the second surface in the second section. The number of main conductor portions per unit distance in the first section is more than the number of main conductor portions per unit distance in the second section. The outermost main conductor portion of the coil conductor pattern in the second section has a width more than a width of the main conductor portion of the coil conductor pattern in the first section.Type: GrantFiled: May 29, 2018Date of Patent: October 15, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shingo Ito, Takumi Tanaka
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Patent number: 12112875Abstract: An integrated circuit includes a first coil and a second coil. The first coil is disposed on the first side of the integrated circuit. The second coil is disposed on the second side of the integrated circuit, and is partially overlapped with the first coil at a junction. The first coil is not interlaced with the second coil at the junction.Type: GrantFiled: April 21, 2021Date of Patent: October 8, 2024Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Ka-Un Chan
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Patent number: 12106885Abstract: A coil component includes a body having one surface and another surface opposing each other, opposing end surfaces each connecting the one surface and the other surface to each other, and opposing side surfaces each connecting the end surfaces to each other. An internal insulating layer is embedded in the body, and a coil portion is disposed on at least one surface of the internal insulating layer and includes the first and second lead-out portions. The body has a recess disposed in each end surface of the body to expose the first and second lead-out portions. First and second external electrodes each include a connection portion disposed in the recess to be connected to a respective one of the first and second lead-out portions, and each include a pad portion disposed on the one surface of the body. A filling portion fills the recess and covers the connection portion.Type: GrantFiled: August 9, 2022Date of Patent: October 1, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Mo Lim, Byeong Cheol Moon, Dong Sik Yoo, Doo Ho Park, Tae Jun Choi, Jeong Hoon Ryou, No Il Park, Tai Yon Cho
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Patent number: 12106880Abstract: A circuit element includes a multilayer body, internal elements inside the multilayer body, and first outer electrodes and second outer electrodes on outer surfaces of the multilayer body, and the multilayer body includes laminated base material layers. The internal elements include coil conductors connected to the second outer electrodes, the coil conductors have a winding axis in the laminating direction of the base material layers, the first outer electrodes are in contact with a mounting surface of the multilayer body, the second outer electrodes are in contact with side edges of the multilayer body and separated from the mounting surface, and maximum widths of the second outer electrodes are smaller than maximum widths of the first outer electrodes.Type: GrantFiled: September 9, 2021Date of Patent: October 1, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Shigematsu, Kenichi Ishizuka
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Patent number: 12100540Abstract: A coil device capable of minimizing defects and increasing a thickness of a conductor pattern is provided. The coil device includes: a base substrate; a seed pattern formed on the base substrate and including a seed region and a lead-in wiring region; a first conductive pattern formed on the seed region; a second conductive pattern formed on at least a portion of the first conductive pattern; and a protective layer formed to contact at least one or more of the base substrate, the seed pattern, the first conductive pattern, and the second conductive pattern, in which the seed pattern of the lead-in wiring region extends to a cut line.Type: GrantFiled: November 28, 2020Date of Patent: September 24, 2024Assignee: STEMCO CO., LTD.Inventors: Young Jun Kim, Chang Hoon Han, Dong Gon Kim, Su Jeong Shin