Patents Examined by Wesley A. Nicolas
  • Patent number: 6780293
    Abstract: A floatable sanitizer employs a plurality of electrodes to contact a body of water in order to achieve a near maintenance-free sanitizing chemical generator. In one embodiment, the sanitizing chemical is chlorine and the chlorine is generated by an electrolytic process. The electrolytic reaction may be powered by photovoltaic cells, making the apparatus self-contained and able to float freely within a body of water. In one embodiment, the energy source is channeled through a polarity-reversing module. The polarity-reversing module alternates the direction of the current generated by the photovoltaic cells at a predetermined time interval. The reversing of the polarity reduces scale build-up and prevents corrosion of the metal electrodes.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: August 24, 2004
    Inventors: Dell R. Munk, Stanley S. Munk
  • Patent number: 6776885
    Abstract: An apparatus for plating and planarizing metal on a substrate includes a plurality of dispensing segments, each having at least one hole for dispensing electroplating solution onto the substrate. The dispensing segments form a circular counterelectrode and are movable with respect to each other during an electroplating process, so that the counterelectrode has a variable diameter. The electroplating solution is thus dispensed on an annular portion of the substrate having a diameter corresponding to the diameter of the counterelectrode; accordingly, the variable-diameter counterelectrode permits localized delivery of the plating solution to the substrate.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: August 17, 2004
    Assignee: International Business Machines Corporation
    Inventors: Laertis Economikos, Hariklia Deligianni, John M. Cotte, Panayotis C. Andricacos
  • Patent number: 6773569
    Abstract: A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an additive to be measured therein and cycling the potential of an inert working electrode through a series of measurement steps. The series of measurement steps includes a metal stripping step including pulsing from an open circuit potential to a metal stripping potential between about 0.2 V and about 0.8 V, and holding the metal stripping potential until a corresponding current nears 0 mA/cm. The series of measurement steps further includes a cleaning step including pulsing from the metal stripping potential to a cleaning potential between about 1.2 V and about 1.6 V, and holding the cleaning potential for about 2 seconds to about 10 seconds. The series of measurement steps then includes a pre-plating step including pulsing from the cleaning potential to a pre-plating potential between about −0.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: August 10, 2004
    Assignee: Applied Materials Inc.
    Inventors: Zhi-Wen Sun, Nicolay Kovarsky, Chunman Yu, Girish Dixit
  • Patent number: 6770188
    Abstract: A structural body material layer is formed directly on a base substrate or via a sacrificing layer or a peeling layer, a groove is fabricated electrochemically along an outer configuration shape of a part constituting an object at the structural body material layer and thereafter, only the sacrificing layer or the base substrate is selectively removed or the part is mechanically separated from the peeling layer to thereby separate the part and the base substrate and provide the part constituting the object or fabricate a part having a movable portion by partially restricting a portion to be separated.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: August 3, 2004
    Assignee: Seiko Instruments Inc.
    Inventors: Masayuki Suda, Naoya Watanabe, Kazuyoshi Furuta
  • Patent number: 6767437
    Abstract: In an electroplating apparatus, an electrolytic agent is filled into the portion between an anode and a dummy cathode which is opposite substantially face to face and parallel to the anode, and an electric current is supplied to this portion, thereby suppressing changes in properties of a black film during the period in which plating to a substrate to be processed is stopped. In particular, by applying an electric current to the anode immediately before plating to the substrate is resumed, the film formation characteristics of plating to the substrate can be maximally stabilized. This can reduce the consumption power and dissolution of the anode. This apparatus is particularly effective in copper plating in which the formation of a black film is significant.
    Type: Grant
    Filed: May 21, 2001
    Date of Patent: July 27, 2004
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Tetsuo Matsuda, Hisashi Kaneko, Koji Mishima, Natsuki Makino, Junji Kunisawa
  • Patent number: 6767444
    Abstract: A new process for recycling spent nuclear fuels, in particular, mixed nitrides of transuranic elements and zirconium. The process consists of two electrorefiner cells in series configuration. A transuranic element such as plutonium is reduced at the cathode in the first cell, zirconium at the cathode in the second cell, and nitrogen-15 is released and captured for reuse to make transuranic and zirconium nitrides.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: July 27, 2004
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: William E. Miller, Michael K. Richmann
  • Patent number: 6764659
    Abstract: A frame-type ozone generator has a plurality of elongated electrodes deployed in substantially parallel, spaced relation to each other so as to form a substantially flat electrode array, and a flow generator for generating a flow of oxygen containing gas through the electrode array in a direction substantially perpendicular to the electrode array. According to a first embodiment each of the electrodes is formed from an electrically conductive core covered with polyvinyl-difluoride. According to a second embodiment each of the electrodes is formed from an electrically conductive core covered with a material which includes silicon rubber.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: July 20, 2004
    Assignee: Ozontech Ltd.
    Inventors: Gena Perlov, Boris Malkin, Shmuel Yannai
  • Patent number: 6761809
    Abstract: An electrically regeneratable battery of electrochemical cells for capacitive deionization (including electrochemical purification) and regeneration of electrodes is operated at alternate polarities during consecutive cycles. In other words, after each regeneration step operated at a given polarity in a deionization-regeneration cycle, the polarity of the deionization step in the next cycle is maintained. In one embodiment, two end electrodes are arranged one at each end of the battery, adjacent to end plates. An insulator layer is interposed between each end plate and the adjacent end electrode. Each end electrode includes a single sheet of conductive material having a high specific surface area and sorption capacity, preferably a sheet formed of carbon aerogel composite. The battery further includes a plurality of generally identical double-sided intermediate electrodes that are equidistally separated from each other, between the two end electrodes.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: July 13, 2004
    Assignee: The Regents of the University of California
    Inventors: Tri D. Tran, David J. Lenz
  • Patent number: 6761813
    Abstract: A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface material disposed between the bottom surface of the heat dissipating device and the backside surface of the heat generating device. The thermal interface material may comprise a polymer material with thermally conductive filler components dispersed therein. For one embodiment, the thermally conductive filler components may be covalently bonded together. For one embodiment, the thermally conductive filler components may be covalently bonded with the polymer material.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: July 13, 2004
    Assignee: Intel Corporation
    Inventor: Youzhi E. Xu
  • Patent number: 6761812
    Abstract: In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative of the current flow in each contact portion may be determined. Moreover, for precise control of the currents, means are provided for monitoring the currents.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: July 13, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Preusse, Gerd Marxsen
  • Patent number: 6758957
    Abstract: Carbon nanoparticles including both nanofilaments and nanotubes produced by an electrochemical deposition method from organic solutions at room temperature, in which the formation and growth of carbon nanoparticles are stimulated by the catalyst, such as iron and nickel. It has been found that the electrochemical deposition conditions have a strong influence on the growth phenomenon of the carbon nanotubes. Scanning electron microscope (SEM) and transmitting electron microscope (TEM) characterizations show that the diameter of nanotubes is of the order of approximately 100 nm, and the length of filaments can be up to approximately 50 &mgr;m, depending on the size of catalyst particles.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: July 6, 2004
    Assignee: University of Central Florida
    Inventors: Dan Zhou, Lee Chow
  • Patent number: 6755955
    Abstract: A method for producing a catalytic converter includes depositing a layer of catalytically active metallic material by electrochemical deposition on a planar substrate by immersing the substrate in an electrolyte that contains the catalytically active metallic material. A high overvoltage at which a large number of seeds of the metallic material are formed on the substrate is set for a predetermined first time period between the substrate and the opposing electrode. The overvoltage is reduced for a predetermined second time period to a value at which the seeds which are deposited in the first time period grow on the substrate.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: June 29, 2004
    Assignee: DaimlerChrysler AG
    Inventors: Hubertus Biegert, Gabriele Stäb, Gabor Toth, Peter Urban
  • Patent number: 6755954
    Abstract: An apparatus for electrochemical treatment of a substrate, in particular for electroplating an integrated circuit wafer. An apparatus preferably includes dynamically operable concentric anodes and dielectric shields in an electrochemical bath. Preferably, the bath height of an electrochemical bath, the substrate height, and the shape and positions of an insert shield and a diffuser shield are dynamically variable during electrochemical treatment operations. Step include varying anode current, bath height and substrate height, shield shape, and shield position.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: June 29, 2004
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Timothy Patrick Cleary, Michael John Janicki, Edmund B. Minshall, Thomas A. Ponnuswamy
  • Patent number: 6755953
    Abstract: In order to preventing thiol-coated metal particles from being liberated from a self-aligning membrane on a substrate during coating the metal particles deposited on the self-aligning membrane with thiol molecules, this invention provides a process for forming a metal particle ordered structure wherein a voltage is applied on the substrate for preventing the metal particles from being liberated from the self-aligning membrane during coating the metal particles deposited on the self-aligning membrane on the substrate with thiol molecules.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: June 29, 2004
    Assignees: NEC Corporation, Japan Science and Technology Corporation
    Inventor: Masakazu Baba
  • Patent number: 6755947
    Abstract: An apparatus for generating ozone, oxygen, hydrogen, and/or other products of water electrolysis, having an electrolyte cell that can be acted upon by water. The water is delivered and carried away in a supply line communicating with the electrolyte cell, wherein a bypass line is embodied around the supply line. The electrolyte cell can be connected via the bypass line to the supply line and subjected to water from the supply line. A valve engaging the supply line and the bypass line is provided, and with the valve, the supply line and the bypass line can be opened and/or closed.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: June 29, 2004
    Inventors: Dirk Schulze, Wolfgang Beyer
  • Patent number: 6752916
    Abstract: A method for determining an end point of a planarization process for removing metal from a surface of a substrate submerged in an electrolytic solution or slurry. A first electrode is provided which is operable to contact the surface of the substrate, such as a working electrode of a potentiostat system. A second electrode is provided which is operable to contact the electrolytic solution, such as a reference electrode of the potentiostat system. The first electrode is contacted to the surface of the substrate and an electrochemical property is measured, such as the electrochemical potential between the first and second electrodes, where the electrochemical property is indicative of an electrochemical characteristic of the substrate-slurry system. The planarization process is preferably stopped when a substantial change in the electrochemical potential of the system is measured.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: June 22, 2004
    Assignee: LSI Logic Corporation
    Inventors: Yan Fang, Jayanthi Pallinti, Ronald J. Nagahara
  • Patent number: 6752915
    Abstract: The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the plurality of rollers has a mechanism for limiting deformation of the web within Y/E, and a web conveying method using a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and the web is conveyed while the deformation of the web is limited within Y/E by a mechanism that is provided for at least one roller of the plurality of rollers. The apparatus and the method prevent meandering of the web.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: June 22, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kozo Arao, Noboru Toyama, Yuichi Sonoda, Yusuke Miyamoto
  • Patent number: 6749738
    Abstract: A method is provided for forming an inorganic layer on a surface of a copper material, made of copper or of a copper-based alloy: a browning anodic oxidation process is performed on the copper material in an electrolytic bath containing only an alkali (for example NaOH) at a specified concentration in aqueous solution, under controlled condition of temperature and anodic current density and for a period of time suitable to form a continuous layer basically formed of copper (I) oxide (Cu2O): layers highly adherent to the copper substrate and having good mechanical behavior are produced: different colors and optical properties may be obtained by controlling the process conditions so as to influence the crystalline form of the Cu2O layers.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: June 15, 2004
    Assignee: Europa Metalli S.p.A.
    Inventors: Alberto Billi, Stephan Hoveling, Stefan Priggemeyer
  • Patent number: 6746579
    Abstract: An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously detecting a deterioration state of the gold sulfite complex plating solution, and to provide an apparatus for monitoring the deterioration of the electrolytic gold plating solution. The present invention is characterized by an electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, wherein the gold plating is performed while deterioration of the plating solution is being always or intermittently detected during plating.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: June 8, 2004
    Assignee: Hitachi Kyowa Engineering Co., Ltd.
    Inventor: Hiroyuki Kadota
  • Patent number: 6746591
    Abstract: A method and apparatus for electrochemically depositing a metal onto a substrate. The apparatus generally includes a head assembly having a cathode and a wafer holder disposed above the cathode. The apparatus further includes a process kit disposed below the head assembly, the process kit including an electrolyte container configured to receive and maintain a fluid electrolyte therein, and an anode disposed in the electrolyte container. The apparatus further includes a power supply in electrical communication with the cathode and the anode, the power supply being configured to provide a varying amplitude electrical signal to the anode and cathode.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: June 8, 2004
    Assignee: Applied Materials Inc.
    Inventors: Bo Zheng, Renren He, Girish Dixit