Abstract: An IC tester having a plurality of tester pins to be connected to input terminals and output terminals of ICs to be tested comnprises: a common timing generator for generating a common timing which is common to all the tester pins; a dedicated timing generator for generating dedicated timings which are independent of each other and respectively dedicated to tester pin units, each of the tester pin units being composed of at least two of the plurality of tester pins; and a setting device for setting the respective dedicated timings generated by the dedicated timing generator to the tester pins of the corresponding tester pin units, the other tester pins selecting the common timing generated by the common timing generator.

Abstract: The invention relates to a method of determining the estimate of the stator flux of an electric machine, comprising the determination of a stator flux estimate (.PHI..sub.sest) of the electric machine as a time integral of the difference between the voltage (u.sub.s) supplied to the stator and the product of the stator current (i.sub.s) and the stator resistance estimate (R.sub.sest), whereby the stator resistance estimate (R.sub.sest) of the electric machine is determined by correcting the initial value or another earlier value of the stator resistance on the basis of the stator current component (i.sub.d.sup.s, i.sub.d.sup..delta., i.sub.d.sup.r) parallel to the stator flux estimate (.PHI..sub.sest), the air gap flux estimate (.PHI..sub..delta.est) or the rotor flux estimate (.PHI..sub.rest). To be able to follow changes in the stator resistance of the electric machine in different operational conditions of the machine, said current component (i.sub.d.sup.s, i.sub.d.sup..delta., i.sub.d.sup.

Abstract: A support arrangement is provided for an electrical device that is embedded within a support body or housing. The support arrangement responds to volumetric changes in the material of the support body during the molding of the support body. In a specific arrangement, the support arrangement accurately positions the electrical device with respect to the exterior of the support body and includes provisions for yieldingly supporting the electrical device.

Abstract: A fluxmeter which provides for a pneumatic apparatus for measuring an amount of plasma energy flux flowing into a semiconductor wafer provides for a non-electrical apparatus of measuring energy flux. A bulb has one end exposed to the plasma while the opposite end is supported by a heat sink. When plasma is applied, gas pressure in the bulb changes due to a change in temperature. This change in gas pressure is measured to provide a direct correlation to a value of energy flux impinging on the fluxmeter.

Abstract: A fluxmeter pneumatically measures the amount of plasma energy impinging onto a semiconductor wafer. The fluxmeter is comprised of two hollow bulbs filled with gas. One bulb has one end exposed to the plasma while the opposite base end is supported by a substantially constant temperature wafer chuck. The other bulb has one end exposed to a heater and the opposite base end supported by the chuck. The two bulbs are coupled to a differential pressure sensor, which output is coupled to a servo for controlling the current to the heater. When plasma energy is applied, gas pressure in the first bulb changes and is sensed by the pressure sensor. The servo then adjusts the heater current until the gas pressure in the second bulb equals that of the first bulb. Upon reaching equilibrium the heater current is measured to determine the plasma energy flux impinging on the wafer.

Abstract: A wireless test system is provided for simultaneously performing electrical tests on the opposite sides of a printed circuit board. Specially designed, double-ended pogo pins are utilized to electrically interconnect the top and bottom sides of the board under test to top and bottom printed circuit interface boards, positioned above and below the board being tested, which are electrically interconnected by a flexible printed circuit ribbon. Upwardly projecting test pins on a test and analysis circuit are engaged with contact points on the lower side of the bottom interface board to complete the wireless interconnection between the board being tested and the test and analysis circuit.

Abstract: A very fast autoscale feature can be implemented in a digitizing oscilloscope by using dedicated peak detector hardward [14] capable of operating at the maximum sampling rate of the A/D converter [12] to determine the minimum and maximum values of said input signal, in combination with a trigger counter [24, 26] to count the number of trigger events in the analog input signal. While in the autoscale mode, the oscilloscope microprocessor [22] can then set the appropriate scale and offset for the Y-axis of the display as a function of the maximum and minimum values determined by the peak detector [14] and set the sweep rate as a function of the count provided by the tripper counter [26].

Abstract: A novel test die is disclosed for use in conjunction with a semiconductor assembly machine or process. The test die includes a plurality of sets of bond pads having different bond pad pitches which permits testing of those pitches with use of a single die. Bond pads suitable for array bonding and having different bond pad pitches are also disclosed. Electrical connections are provided between bond pads and permit detection of open and short circuits or other circuit defects. A staggered arrangement of bond pads permits bond pads to be packed more densely on the die. A method for fabricating a wafer having a plurality of bond pads which form a repeating pattern is given. The patterned wafer may be cut to form a test die having bond pads which are positioned to provide bond pad pitches as required by a user.

Abstract: A waveform measuring device comprising an A/D converter for converting an input signal into a digital signal, a memory for storing output data from the A/D converter, a first trigger condition detecting unit for detecting a present input signal meeting a first trigger condition, a second trigger condition detecting unit for detecting a past input signal of a desired time which is remote from the present time and meeting a second trigger condition, and a trigger signal generating unit for generating a trigger signal when the trigger conditions of the first and second trigger condition detecting units are satisfied. The waveform of the input signal corresponding to a desired interval is displayed in accordance with the trigger signal from the trigger signal generating unit. The input signal to the second trigger condition detecting unit is given without reading it out of the memory.

Abstract: A measuring position for a microwave component having a carrier (10) for the microwave component and having at least one test probe (5). The measuring position provides for non-destructive identification of the properties of microwave circuits on small substrate surfaces even when measuring quasi-planar circuits having connecting lines in asymmetrical microstrip line technology. The spatial position of the test probe (5) is variable and adjustable in three spatial directions relative to the spatial position of the carrier (10).

Abstract: An apparatus and method for non-contact sensing electrical potentials of selected regions on the surface of a sample are provided. A typical sample is an integrated circuit, electronic device, or semiconductor material. The sample is positioned within a vacuum chamber and irradiated with an ultraviolet light beam so that the material emits electrons by the photoelectric effect. The electrons have kinetic energies which are variable according to the electrical potential of the surface of the material. Emitted electrons having kinetic energies within a predetermined range are selected by an electron energy analyzer. An electron detector receives the selected electrons and produces electrical signals corresponding to the energies of said selected electrons. In another embodiment of the invention, a modulated light beam other than the ultraviolet light probe beam irradiates the material in order to produce time varying modulation of the photoelectron energy spectrum.

Abstract: The invention relates to a test and repair test kit for auxiliary power units for military vehicles. The test and repair test kit allows the easy diagnosis of problems and the ability to verify their repair on a mobile platform without the need of the vehicle. The test and repair test kit is self contained and provides the auxiliarry power unit with fuel and power allowing the complete operation of the auxiliary power unit. Repairs of the auxiliary power unit are facilitated because the operator is allowed easy access to major components while attached to the test and repair stand.

Abstract: A probe interface assembly connects a set of signal lines and a set of power lines from a circuit tester to one integrated circuit (IC) chip disposed among multiple circuit chips on a semiconductor wafer. The assembly includes a plurality of electrically conductive planes including metal mesh and conductive strips which are spaced apart by ceramic planes contiguous the conductive planes. The signal lines and the power lines enter the assembly with relatively large spacing at an input plane facing the tester, and exit the assembly with relatively small spacing at an output plane facing the chip. Within the assembly, each power line branches into a plurality of conducting vias for reducing resistance and inductance of the power lines. Connection of the vias to the power lines is accomplished by conductive planes near the output plane. Other ones of the conductive planes, near the input plane, interconnect input and output signal lines. Ground planes are interposed between power planes and signal planes.

Abstract: A digital multimeter having automatic function selection capability includes a signal type detector and an analog-to-digital converter formed as an application specific integrated circuit. The signal type detector has a comparator circuit that compares the analog input signal to be measured with predetermined thresholds and stores the resulting values, which are related to the type of analog input signal, in a memory that is also a part of the signal type detector. A controller executes an automatic function selection program that causes the controller to read the stored values and generate a corresponding function code, which causes an analog-to-digital converter to be configured to perform an appropriate conversion function on the analog input signal. When a change in the type of analog input signal is sensed, the controller aborts the present measurement cycle and proceeds with a next measurement cycle in which the changed analog input signal is measured.

Abstract: In an arrangement for testing electrical circuit boards an intermediary adapter is disposed between the circuit board and a basic adapter. For converting a grid offset as well as a grid with smaller grid step width to the grid of contact areas in the basic adapter converters (11) are provided which on their top side have test piece-specific arrangements of contact needles (31), for example for SMD structural elements. On the underside the converters (11) are provided with contact pins (36) in a grid corresponding to the contact area bank of the basic adapter. The grid of the contact pins (36) is displaced laterally or diagonally relative to the side edges (44) of converters (11) so that by rotating the converters (11) about their longitudinal axes offsetting the contact pins (36) for contacting the contact areas of the basic adapter can be carried out.

Abstract: A current measuring method in which a magnetic sensor is a torodial core having a conductor for carrying a current to be measured passing through the hollow portion of the toroid. A coil on the core is excited with an AC voltage such that the positive and negative voltages induced in the coil are equal in amplitude when the conductor is not carrying current. Current in the conductor generates a change in magnetic flux which change is measured by detecting the algebraic sum of the amplitudes of the positive and negative voltages. Simultaneously, the amplifier output is applied to the input side of the AC voltage or a second coil disposed in the magnetic sensor so as to establish a magnetic equilibrium. Current measuring apparatus according to this invention include two types of apparatus composed of hardware to which the above-mentioned current measuring method is applied.

Abstract: A measurement circuit for measuring the level of an input electrical signal, the circuit comprising an input amplifier biased from a bias voltage, receiving the input signal, and producing an output signal, followed by a detector module itself followed by an integrator delivering an integration signal, these three components constituting a measurement channel, the integration signal being the sum of an offset signal and of a level signal which is proportional to the level of the input signal.

Abstract: An apparatus for applying high current fast rise time pulses simulating electrostatic discharge (ESD) to various combinations of pins of a device under test (e.g., a microcircuit). The apparatus also provides for testing of the DUT after the performance of ESD stress testing. The apparatus establishes electrical connections between the terminals of a high voltage pulse generator (HVPG) and several different combinations of the DUT pins in sequence in order to apply ESD stresses. The apparatus further provides functional parameter tests whether the connection to the DUT pins during ESD stressing has caused the DUT to fail.

Abstract: A method and apparatus for testing handheld soldering irons having a three wire soldering tip by touching the soldering iron tip to a single point sensor to measure tip temperature, tip voltage to ground the tip resistance to ground. A thermocouple sensor for use with a soldering iron testing apparatus is described.

Abstract: A semiconductor wafer (26) may have all the integrated circuits (36) formed thereon simultaneously self-tested by the addition of a power circuit, a ground circuit and clock circuit. Lead lines are formed during metallization of the integrated circuits (36) on the wafer (26). The lead lines are interconnected to the integrated circuits (36) to form a power input, a ground input and a clock input on each integrated circuit (36). A test head (28) having a power probe (44), a ground probe (46) and clock probe (48) is attached to the power, ground and clock circuits on the semiconductor wafer (36). The integrated circuits (36) are simultaneously tested by the test head (28), and failed circuits are identified by an infrared detector (42).