Patents Examined by Xiaoliang Chen
  • Patent number: 10856404
    Abstract: A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: December 1, 2020
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Shou-Te Yen, Chao-Min Lai, Ping-Chia Wang
  • Patent number: 10849220
    Abstract: A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: November 24, 2020
    Assignee: Super Micro Computer, Inc.
    Inventors: Manhtien V. Phan, Mau-Lin Chou, Chih-Hao Lee
  • Patent number: 10849235
    Abstract: A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: November 24, 2020
    Assignee: TACTOTEK OY
    Inventors: Tomi Simula, Mika Paani, Miikka Kärnä, Outi Rusanen, Johanna Juvani, Tapio Rautio, Marko Suo-Anttila, Mikko Heikkinen
  • Patent number: 10847908
    Abstract: A connected board includes a first circuit board including a first ground and a second circuit board including a second ground. The first circuit board includes a rigid portion and a flexible portion. The rigid portion includes a section of a conductive layer having flexibility and hard substrates prepared from an insulator and having rigidity. The section of the conductive layer is bonded to the hard substrates and held by the hard substrates. The flexible portion includes a section of the conductive layer extending from the rigid portion and a soft substrate covering the section. The soft substrate includes a connection hole for connecting the second circuit board to the first circuit board. The second circuit board is mounted to the flexible portion in the connection hole. The second ground is directly connected to the conductive layer of the first circuit board.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: November 24, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Masashi Tsubotani
  • Patent number: 10842030
    Abstract: A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: November 17, 2020
    Assignee: VITESCO TECHNOLOGIES GMBH
    Inventors: Jürgen Zacherl, Erich Mattmann, Waldemar Brinkis
  • Patent number: 10842015
    Abstract: Provided is a conductive member including a busbar having a through hole, and a metal member fixed to the busbar, the metal member including a shaft portion passed through the through hole, and a first head portion at one end portion of the shaft portion, the first head portion having an outer diameter larger than the diameter of the through hole. Since the metal member includes the first head portion, it is possible to increase the heat capacity of the metal member as compared with that achieved with a conventional conductive member that does not include the first head portion. Accordingly, it is possible to further increase the heat dissipation of the conductive member using a simple configuration.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: November 17, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Yukinori Kita
  • Patent number: 10839723
    Abstract: A flexible display is provided. The flexible display includes a flexible panel and a backboard body fixedly connected with the flexible panel. A glue-free surface is disposed on a side of the backboard body away from the flexible panel, and the backboard body includes a first backboard and a second backboard. At least one mark is disposed on the glue-free surface of the first backboard and the glue-free surface of second backboard, and all of the marks on the same backboard are arranged along a length direction of a bending line.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: November 17, 2020
    Inventors: Wu Li, Peiyu Lai, Wei Bi, Huan Xu, Hong Gao, Hanning Yang
  • Patent number: 10840216
    Abstract: The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: November 17, 2020
    Assignee: Cerebras Systems Inc.
    Inventor: Jean-Philippe Fricker
  • Patent number: 10833001
    Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
  • Patent number: 10834829
    Abstract: Embodiments herein describe a variable inductor containing a capillary. The capillary includes an eutectic conductive liquid (e.g., EGaIn) containing suspended magnetic particles and an electrolyte (e.g., NaOH). In one embodiment, the variable inductor has a pair of electrodes (e.g., negative and positive electrodes) at the respective ends of the capillary to seal the eutectic conductive liquid and the electrolyte. The variable inductor also includes an inductor coil disposed around the capillary, and the inductor coil is connected to a circuit and provides inductance for the connected circuit. Using a DC voltage between the pair of electrodes, the eutectic conductive liquid can extend inside the capillary, which in turn, causes the variable inductor to have a desired inductance.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Stuart B. Benefield, Samuel R. Connor, Matthew S. Doyle
  • Patent number: 10834818
    Abstract: A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 10, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takakuni Nasu, Kengo Tanimori, Yousuke Kondo, Masahiro Kamegai, Kouta Kimata, Junya Matsura, Fumio Shiraki, Guangzhu Jin
  • Patent number: 10825601
    Abstract: In an exemplary embodiment, a coil component includes: an element body part 10 that contains magnetic metal grains and nonmagnetic materials and has insulation property; and a coil 30 embedded in the element body part 10 and formed by a winding conductor. The element body part 10 has a main part 11 and a low magnetic permeability part 50 whose relative permeability is lower than that of the main part 11; the coil 30 has a first surface 36 and a second surface 38 respectively representing surfaces positioned on opposite sides in the direction of the coil axis and intersecting the coil axis; and the low magnetic permeability part 50 is provided between a first plane 37 flush with the first surface 36, and a second plane 39 flush with the second surface 38, in a manner away from the first plane 37 and the second plane 39.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: November 3, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takashi Nakajima, Naoya Terauchi, Shinsuke Takeoka
  • Patent number: 10827614
    Abstract: A printed circuit board of an embodiment includes a board, a first ground plane provided on a first face of the board and having a first opening, a first wiring provided above the first ground plane, a second ground plane provided on a second face facing the first face of the board and having a second opening, a second wiring provided above the second ground plane, and a third wiring penetrating the board between the first opening and the second opening and connecting the first wiring and the second wiring. The third wiring is provided in the first opening and in the second opening when viewed from a direction perpendicular to the first face of the board.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: November 3, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Hitoshi Imi, Motochika Okano, Toshihiro Tsujimura
  • Patent number: 10823355
    Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
    Type: Grant
    Filed: September 15, 2019
    Date of Patent: November 3, 2020
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Ching-Tang Fu, Chia-Jung Tsai, Han-Ming Lee
  • Patent number: 10824032
    Abstract: A display device includes a first substrate, a second substrate, s driver circuit, a first substrate connecting member, a spacer portion, and a spacer joint portion. The second substrate is opposed to overlap the first substrate and includes a first substrate non-overlapping portion not overlapping the first substrate. The driver circuit is mounted on the first substrate non-overlapping portion on a same side as the first substrate. The first substrate connecting member is connected to the first substrate and includes a portion disposed to overlap the driver circuit. The spacer portion is disposed between the first substrate connecting member and the driver circuit. The spacer portion has an insulating property. The spacer joint portion is disposed to overlap a section of the first substrate non-overlapping portion not overlapping at least the driver circuit on the same side as the first substrate.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: November 3, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Shinji Tomokawa
  • Patent number: 10820425
    Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: October 27, 2020
    Assignee: Innolux Corporation
    Inventors: Wei-Cheng Chu, Chia-Cheng Liu, Chih-Yuan Lee, Chin-Lung Ting, Tong-Jung Wang
  • Patent number: 10820421
    Abstract: A display panel and a display device are provided. The display panel includes a rigid underlay and a flexible circuit board. The rigid underlay includes: a first surface including connection pins, and a second surface. The flexible circuit board includes a first flat portion, a bending portion, and a second flat portion. The bending portion is located between the first and second flat portions. The first flat portion contacts with the first surface. The bending portion is attached to the second surface. The second flat portion is positioned at a side of the rigid underlay facing away from the first surface with the bending portion bended. The first flat portion is electrically connected to the connection pins. The second flat portion includes a driving circuit connected to the connection pins through the flexible circuit board. An angle between the first and second surfaces is a rounded or chamfered angle.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: October 27, 2020
    Assignee: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Wei Huang, Zhanshu Wang, Mingyan Huang
  • Patent number: 10813219
    Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 20, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
  • Patent number: 10813231
    Abstract: The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: October 20, 2020
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Po-Hsuan Liao, Wen-Fang Liu
  • Patent number: 10809776
    Abstract: A water block mounting holder with reinforced structure includes a holder body and a reinforcement structure provided on an upper side of the holder body, and is used with a water block to attach the latter to a heat-producing element mounted on a motherboard. The holder body has a hollow-out central opening and a plurality of through holes spaced along an outer area of the holder body for a plurality of fixing elements provided on the motherboard to extend therethrough and fixedly hold the holder body to the motherboard, so that the holder body is connected to the water block with the opening being fitted around the water block. With the reinforcement structure provided on the holder body, the water block mounting holder has effectively reinforced overall structural strength to avoid pressure deformation thereof.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: October 20, 2020
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventor: Sung-Wei Lee