Patents Examined by Young S. Whang
  • Patent number: 5196988
    Abstract: A front plate adapter panel containing television and telephone hookups can be factory-installed or field-installed within existing metallic power pedestal enclosure to provide such telephone and television facility along with electric power facility.
    Type: Grant
    Filed: February 21, 1991
    Date of Patent: March 23, 1993
    Assignee: General Electric Company
    Inventor: Dale W. Horn
  • Patent number: 5193050
    Abstract: An enclosure for different subsystem variations of a data processing system has a box with front and rear regions separated by an interconnection carrier. The front is divided into standard-size bays for functional modules, while support modules slide into rear bays. A vertical central carrier contains electrical interconnections between the functional and support modules. An environmental module provides cooling air through the enclosure.
    Type: Grant
    Filed: November 14, 1991
    Date of Patent: March 9, 1993
    Assignee: International Business Machines Corporation
    Inventors: Roger F. Dimmick, Vernon J. Kleve, Timothy L. Meyer, Gary A. Thompson, Gordon W. Westphal
  • Patent number: 5193053
    Abstract: A plastic semiconductor device has a lead frame provided with an island for received a semiconductor element. A plurality of leads project from a square outer frame and are distributed around the periphery of the island. An insulating substrate covers and is bonded to one principal surface of the island while exposing the semiconductor element. Distributing wires are formed on one principal surface of the insulating substrate to conform with the leads. A conductive substance connects the distributing wires to the leads and fills any through-holes formed in the insulating substrate. Bonding wires connect input-output terminals of the semiconductor element to the leads. A resin body encloses and embeds the bonding wires and the semiconductor element. A heat sink may be bonded to the back face of the island.
    Type: Grant
    Filed: October 23, 1991
    Date of Patent: March 9, 1993
    Assignee: NEC Corporation
    Inventor: Kaoru Sonobe
  • Patent number: 5191513
    Abstract: A securing device for securing two boards firmly to one another with a predetermined distance therebetween. The securing device is integrally formed of resin and comprises a resilient reverse retention member to support a first board, a rectangular linkage member, resilient legs provided on both sides of the linkage member to engage the first board, and a support base to support a second board thereon. Characteristically provided with recesses at the foot of both widthwide sides of the linkage member, the securing device of this invention is enabled to have the advantages of both having a rectangular-shaped linkage member and an improvement in strength.
    Type: Grant
    Filed: December 5, 1991
    Date of Patent: March 2, 1993
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Haruyuki Sugiura, Katsumasa Takahashi
  • Patent number: 5191514
    Abstract: The card guide with hook/card lock as disclosed is designed to prevent a printed circuit board (PCB) from being disengaged without first moving the mechanical card locking hook an adequate distance. When the mechanical card locking hook is flexed to disengage a PCB, the card lock will move only enough to allow the PCB to be disengaged and removed. The card guide has a built in fixed stop to prevent the extended card lock from deforming or breaking during disengagement of a PCB.
    Type: Grant
    Filed: December 9, 1991
    Date of Patent: March 2, 1993
    Assignee: AG Communication Systems Corporation
    Inventors: Zbigniew Kabat, Arcangel N. Capulong
  • Patent number: 5184279
    Abstract: A front plate adapter panel container television and telephone hookups can be factory-installed or field-installed within existing metallic power pedestal enclosures to provide such telephone and television facility along with electric power facility. A weather-tight luminaire adapter unit is attached to the top surface of such power pedestals to provide illumination to the electrical components contained within the power pedestal enclosure as well as to provide "stumble lighting" to the ground area in the immediate vicinity of the power pedestal.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: February 2, 1993
    Assignee: General Electric Company
    Inventor: Dale W. Horn
  • Patent number: 5182698
    Abstract: A function expanding apparatus for a compact electronic device includes a casing having a supporting portion and a supporting plate attached to the casing to be movable in a predetermined direction. A pair of retaining portions are formed on the supporting plate. The rear portion of the electronic device is mounted on the supporting portion and is positioned in its width direction by a pair of positioning members provided at the supporting portion. The front end portion of the electronic device is mounted on the supporting palte and the retaining portions engage the front edge of the electronic device so as restrain the movement of the electronic device in the depth direction thereof. The position of the retaining portion is adjusted by moving the supporting plate, in accordance with the depth of the mounted electronic device.
    Type: Grant
    Filed: December 14, 1990
    Date of Patent: January 26, 1993
    Assignees: Kabushiki Kaisha Toshiba, Kel Corporation
    Inventors: Takaichi Kobayashi, Kazuka Shibasaki, Takashi Hosoi, Masami Honda, Kazuyoshi Takahashi
  • Patent number: 5181167
    Abstract: Heatpipe elements having a thin flat, rectangular geometry are contstructed according to known heatpipe techniques. An electronic circuit module incorporating multiple discrete and integrated circuit elements is integrally imbedded into a recessed top exterior surface of each heatpipe element. The heatpipe elements are longer in one dimension that the circuit modules imbedded therein, the excess length being partitioned equally on each side of a circuit module. The remaining opposing edges of each circuit module equally overhanging the lateral edges of the heatpipe are configured as area array connectors. The resultant heatpipe/circuit module forms bilateral thermal contact areas for thermally contacting complementary surfaces of immediately adjoining heatpipe/circuit modules. Circuit modules electrically contact preceding and succeeding circuit modules via stacking connectors interposed between the respective area array connectors.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: January 19, 1993
    Assignee: Sun Microsystems, Inc.
    Inventors: Howard L. Davidson, Satyanarayana Nishtala
  • Patent number: 5179503
    Abstract: A modular automobile power distribution box having a housing for mounting a plurality of interchangeable support modules. Each support module is adapted for supporting a specific electrical component such as an ISO relay, a mini-fuse, a maxi-fuse, etc., and the support modules are uniform so as to permit interchangeable positioning within the housing for selective variation of combinations of electrical components.
    Type: Grant
    Filed: April 19, 1991
    Date of Patent: January 12, 1993
    Assignee: United Technologies Automotive, Inc.
    Inventors: Mark E. Fouts, Thomas F. Rahrig, David E. Champlin, Zenon Hotra
  • Patent number: 5179502
    Abstract: A pocket-size electronic device adapted for use as an electronic organizer which includes a casing having a coordinate input section of a tablet type, a telescopic touch pen for writing in the coordinate input section, a cover hinged to the casing by means of an upper hinge and a lower hinge disposed at a distance from each other so as to cover the coordinate input section, a touch pen holder disposed between the upper hinge and the lower hinge, the touch pen holder having a first holder member and a second holder member, an end of the touch pen being retained by the first holder and the other end being retained by the second holder.
    Type: Grant
    Filed: July 18, 1991
    Date of Patent: January 12, 1993
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Masaru Matsuda
  • Patent number: 5177672
    Abstract: A structure for covering an interconnection of a folding electronic device includes a main body and a cover member each having a flat internal cavity coupled to each other rotatably at each back end. Circuit substrates in respective internal cavities are electrically connected to each other by the interconnection sheet disposed traversing a window opening provided at the back end of the main body. A cover unit guarding the interconnection sheet is provided in the proximity of the window opening in the main body. This cover unit includes a cover plate biased elastically to protrude outwards from the window opening. By a guide edge provided at the back end of the cover member to be abutted against the cover plate according to the closing/opening operation of the cover member, the cover plate blocks the window opening to prevent exposure of the wiring sheet.
    Type: Grant
    Filed: July 18, 1991
    Date of Patent: January 5, 1993
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Toshihito Ito
  • Patent number: 5177668
    Abstract: Arrangement of a multi-layer through-contacting integrated circuit board with bonding-wires extending between chip contacts and substrate contacts, particularly designed for a compact circuit assembly of signal processors in an airborne body. The substrate contacts are arranged within a narrow connector strip extending parallel to the boundary of a chip-mounting region, and are in the plane of the substrate surface at approximately the same measurement and geometric sequence as the chip contacts of the circuit. Thin conductive paths extend and spread apart in a fan-like manner from the substrate contacts in an edge strip of the chip-mounting region, and terminate at mutually offset end surfaces of through-holes or vias which have a substantially larger cross-sectional area than the width of the thin conductive paths.
    Type: Grant
    Filed: May 18, 1992
    Date of Patent: January 5, 1993
    Assignee: Diehl GmbH & Co.
    Inventors: Armin Lederer, Jurgen Zimmermann
  • Patent number: 5175672
    Abstract: A case for electronic components of a computer has a base section and a central section hinged together along a pivot axis. The base section provides a base compartment for first electronic components and may rest on a support surface. The central section provides a central compartment for second electronic components and has a front face with a display panel. The hinge structure is positioned so that, in a closed position, the base section is folded against the back of the central section. In an open position, the central section is elevated at an angle to the support surface with the base section extending rearwardly of the pivot axis which is located proximately to the intersection of the top and front walls of the base section. A cover may be secured to cover the display, and this cover can include a keyboard input for the computer. The keyboard/cover may also be releasably securable to the base section.
    Type: Grant
    Filed: August 9, 1990
    Date of Patent: December 29, 1992
    Assignee: Outbound Systems, Inc.
    Inventors: Warren J. Conner, Douglas G. Swartz, James R. Yurchenco
  • Patent number: 5175671
    Abstract: An expanding apparatus includes an apparatus body containing expansion boards for expanding the functions of an electronic apparatus. The container or apparatus body has a supporter on which the rear portion of the electronic apparatus is mounted. The supporter has a fitting groove to which a stand of the electronic apparatus mounted on the supporter is fitted, so that the apparatus is positioned with respect to the container. A slide connector is attached to the container to be movable to a connecting position where the connector is connected to a connector of the positioned electronic apparatus.
    Type: Grant
    Filed: March 20, 1991
    Date of Patent: December 29, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Katumaru Sasaki
  • Patent number: 5173840
    Abstract: An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.
    Type: Grant
    Filed: April 25, 1991
    Date of Patent: December 22, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shojiro Kodai, Katsunori Ochi, Osamu Murakami
  • Patent number: 5166868
    Abstract: A molded sealing pad for a radio housing assembly is provided which has an outer sealing portion for sealing the outer periphery of the radio housing, and an inner sealing portion for sealing inner apertures of the housing assembly. The outer sealing portion includes push button actuation elements which may be actuated by exerting a horizontal actution force, and the inner sealing portion includes key pad buttons which may be actuated by exerting a vertical actuation force.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: November 24, 1992
    Assignee: Motorola, Inc.
    Inventors: Stephen M. Stanton, Danielle Dzung, Eduardo Marabotto
  • Patent number: 5164884
    Abstract: The invention relates to a cooling construction for cooling a power transistor (4) having a plastic encapsulation, wherein the waste heat produced is conducted away mainly via the collector lead (6), the collector lead being connected to the collector strip (3) on the circuit board. When it is desired to conduct the produced waste heat specifically on the component side of the circuit board (1), it is possible to use a construction according to the invention in which there is placed on the circuit board (1) a highly heat conductive insulation plate (8) which covers the collector strip (3) entirely over part of its length next to the transistor (4), and that to the insulation plate (8) there is fixed a cooling plate (9) to which the thermal energy produced in the transistor is conducted. The insulation plate (8) may in part also extend on top of the plastic encapsulation of the transistor.
    Type: Grant
    Filed: February 28, 1991
    Date of Patent: November 17, 1992
    Assignee: Nokia Mobile Phones, Ltd.
    Inventor: Mikko Pesola
  • Patent number: 5161091
    Abstract: A device for holding a thermal cutoff device and a resistor in assembled relationship to each other in a housing and biasing the thermal cutoff device and the resistor into heat tansfer relationship with each other in the housing. Metal clips are attached to each housing half such that when the housing halves are mated, the clips are in opposing relationship to each other. Arcuate ends are formed on the clip such that when the opposing ones of the clips face each other in the housing, the arcuate ends substantially encircle one-half of the thermal cutoff device. Resilient fingers are formed on the other end of each of the clips such that when the opposing clips face each other, the resilient fingers grasp the resistor and pull it into engagement with the thermal cutout device for heat transfer relationship. The resilient fingers deflect sufficiently to allow resistors of different diameter to be used in the housing.
    Type: Grant
    Filed: December 20, 1991
    Date of Patent: November 3, 1992
    Assignee: Therm-O-Disc, Incorporated
    Inventors: David Hohider, Mark A. Cenky
  • Patent number: 5157587
    Abstract: An automotive electronic module (22) including a sealing arrangement having a power transistor (4) attached to a printed circuit board (2); a sealing compound layer (18) encapsulating the transistor; a heat sink (8) contacting the transistor and extending through the sealing compound at a surface of the sealing compound remote from the transistor; and a flange (10) formed of flexible material secured to the heat sink and extending into the sealing compound from beyond the surface. The flange prevents loss of adhesion due to differential thermal expansion between the sealing compound and the heat sink (which could create a path for water ingress) by (i) intercepting the force caused by thermal contraction of the sealing compound, (ii) providing increased surface area for the sealing compound to adhere to, and (iii) re-distributing the thermal contraction force through its flexibility and that of the potting compound and the increased surface area of adhesion.
    Type: Grant
    Filed: December 24, 1990
    Date of Patent: October 20, 1992
    Assignee: Motorola
    Inventor: William E. Edwards
  • Patent number: 5155660
    Abstract: A semiconductor device is provided with a base plate on which a circuit board is disposed. A plurality of semiconductor elements such as diodes or transistors are supported on the circuit board and interconnected by circuit wiring. A container for the device includes side walls extending upwardly from the base plate and a top cover extending between the walls. An external terminal connection is provided by an internal terminal and an external terminal that are connected by a flexible wire within the container. The internal terminal has its lower end soldered to the circuit wiring at a predetermined location and its upper end disposed in a seat in the top cover. An upwardly extending slit within the seat receives the end of the internal terminal and a transverse window opens to the slit to receive a transverse protrusion from the upper terminal end. The external terminal extends through the cover with its lower end extending inwardly of the cover where the flexible wire is connected to it.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: October 13, 1992
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Toshifusa Yamada, Shin Soyano