Patents Examined by Zachary M. Pape
  • Patent number: 9763362
    Abstract: A server adapted to server cabinet having a fan assembly and a power supply. The server includes a chassis, a main board module, a data storage, a signal-transferring module and a docking module. The chassis has a bottom plate, a first side plate and a second side plate disposed on the bottom plate. The main board module is placed along the first side plate. The data storage module is placed along the second side plate. The signal-transferring module is placed along the first side plate. The signal-transferring module is located at the back of the main board module. The signal-transferring module is connected between the main board module and the data storage module. The docking module is disposed on the bottom plate. The docking module is connected to the data storage module and the signal-transferring module. The docking module is connectable to the power supply and the fan assembly.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: September 12, 2017
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Jian-Jun Deng
  • Patent number: 9762036
    Abstract: An electric power distributor comprises a distributor housing, conversion parts which convert electric current from outside of the distributor housing to low-voltage alternating current, a transformer which transforms the low-voltage alternating current from the conversion parts to high-voltage alternating current and a power transmission part which transmits the high-voltage alternating current from the transformer to the outward distributor housing. The distributor housing comprises two conversion parts—and the power transmission part—inside. The transformer is attached to the distributor housing from outside. The transformer and the power transmission part are placed along a predetermined direction in this order, the two conversion parts are placed along a direction approximately orthogonal to the predetermined direction at an opposite side to the transformer with regards to the power transmission part.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: September 12, 2017
    Assignee: WAVE ENERGY INC.
    Inventors: Masao Honke, Mitsutake Ishimoto
  • Patent number: 9762037
    Abstract: A low profile (1U) power distribution system includes a power shelf assembly having a first side and an opposing second side. First and second bus bars extend across the assembly and substantially in parallel with the first and second sides, the second bar positioned behind the first bar. One row of power supply pins extends from the bars to engage power supply units within the assembly. A first set of pins extends from the first bus, while a second set extends from the second bar and protruding through respective apertures in the first bar. An insulating material may be provided to electrically insulate power supply pins of the second bar from the first bar. The reduced height profile of the bars allows for cooling air to pass through the remaining >50% of the assembly, which may now desirably include additional electrical circuits within the cooling channel.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: September 12, 2017
    Assignee: Bel Power Solutions Inc.
    Inventor: Marek Lach
  • Patent number: 9763360
    Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: September 12, 2017
    Assignee: SunPower Corporation
    Inventors: James Dorenkamp, Henry F. Pruett, Ravindranath Naiknaware
  • Patent number: 9762040
    Abstract: There is provided a wiring harness in which a plurality of cables are bound by a plurality of protectors provided at intervals in a longitudinal direction, the wiring harness arranged along an arranging path of a fixed portion. The cables are collectively held by the protectors. The lengths of the plurality of cables between the protectors are made different such that the cables are bent between the protectors.
    Type: Grant
    Filed: May 30, 2011
    Date of Patent: September 12, 2017
    Assignees: YAZAKI CORPORATION, SUZUKI MOTOR CORPORATION
    Inventors: Tatsuo Ogawa, Masayuki Ikeno, Keisuke Kato
  • Patent number: 9746885
    Abstract: A first housing with a polar magnet on a first side. The first housing can include an opening on the first side. A second housing can include a sliding latch. An opposite polar magnet attached to the sliding latch. The polar magnet attracts the opposite polar magnet on the sliding latch to move the sliding latch to a latched position.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: August 29, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Delpier, Stacy L Wolff, Kevin L Massaro, Daniel Koelker, Steven Jacobs, Dimitre Mehandjiysky
  • Patent number: 9750144
    Abstract: A connecting system of a multi-section housing of an electronic device comprising: shafts between first and second housing sections and between third and fourth housing sections of superposed first to fourth housing sections to enable one section to be rotated 180 degrees with respect to another section after sliding superposed housing sections apart; first hinges which connect end faces of the second and third housing sections to be able to be rotated; and second hinges which connect opposite side end faces of the first and fourth housing sections, wherein the shafts enable the second and third housing sections to be slid with respect to the first and fourth housing sections and, in the finished slid state, the first and second hinges enable the second and third housing sections and first and fourth housing sections to be rotated about the shafts while being opened to thereby form a single flat surface.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: August 29, 2017
    Assignee: FUJITSU LIMITED
    Inventor: Yutaka Nakamura
  • Patent number: 9750166
    Abstract: An electric power converter has a semiconductor stacked unit, auxiliary electronic components, a pressing member, and a case for accommodating these components. The case has a front wall in a stacking direction, a rear wall, a pair of side walls, and inner walls. The inner walls include a partition wall that is disposed opposing the front wall, and a support wall that is formed so as to extend toward the rear wall from a rear end surface of the partition wall. A unit accommodation space for accommodating the semiconductor stacked unit and the pressing member is formed between the partition wall and the front wall. Auxiliary accommodation spaces for accommodating the auxiliary electronic components are formed between the partition wall and the rear wall.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: August 29, 2017
    Assignee: DENSO CORPORATION
    Inventors: Hideaki Tachibana, Makoto Saizen
  • Patent number: 9730365
    Abstract: A heat sink has a base plate that has a first central portion, a second central portion, and a periphery, a first plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the first central portion, and a second plurality of the heat pipes embedded in the base plate that are arranged to convey heat away from the second central portion, each of the heat pipes of the first and second pluralities having a hot end for receiving heat flow and a cool end for releasing heat flow. A switch package comprises an inner casing half mounted to a module facing surface of the heat sink base plate, a semiconductor module mounted to the module facing surface of the heat sink within the inner casing half, and an outer casing half that encloses the heat sink.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: August 8, 2017
    Assignee: General Electric Company
    Inventors: Alvaro Jorge Mari Curbelo, Simon Schoewel, Tiziana Bertoncelli
  • Patent number: 9730350
    Abstract: The invention discloses electrical equipment, an integrated circuit's loop thereof and a circuit connecting method. The integrated circuit's loop includes: a passive component part, including a power device and/or an execution device; and one or more electrical components, each of the electrical components including a body and multiple pins, wherein at least one pin extends to an electrical connecting end of the passive component part, and is electrically connected with the electrical connecting end. In the integrated circuit's loop of the invention, the pins of the electrical components extend to electrical connecting ends of the passive component part, and are electrically connected with the electrical connecting ends, so that the electrical components are not required to be arranged on a Printed Circuit Board (PCB), a physical structure of the circuit configuration is simplified, a size of the circuit is reduced, and the technician is not required to design the PCB.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: August 8, 2017
    Assignee: SHENZHEN SIGMA MICROELECTRONICS CO., LTD.
    Inventors: Lun Lv, Lifa Wu
  • Patent number: 9729686
    Abstract: An electronic device is provided. The electronic device includes a case member that includes an opening, an electric component provided on the case member, and a circuit board connected to the electric component via the opening, wherein a portion of the circuit board contacts the case member to seal the opening.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: August 8, 2017
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Seung-Soo Chung, Jong-Min Kang
  • Patent number: 9723750
    Abstract: Systems and apparatuses for ensuring proper heat sink installation in an information handling system are disclosed. The information handling system may include a first receiving mechanism configured to receive a first component and to be coupled with a first heat sink for cooling the first component. The information handling system may further include a second receiving mechanism configured to receive a second component and to be interchangeably coupled with one of the first heat sink and a second heat sink for cooling the second component. The information handling system may further include a bracket associated with the first receiving mechanism, the bracket having a key configured to allow the first receiving mechanism to be coupled with the first heat sink and to prevent the first receiving mechanism from being coupled with the second heat sink.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: August 1, 2017
    Assignee: Dell Products L.P.
    Inventors: Kuang Hsi Lin, Hsu-Chu Wang, Chih Min Su
  • Patent number: 9720465
    Abstract: A heat dissipation apparatus and a portable device are provided. The heat dissipation apparatus includes at least two heat sinks, which are connected to each other by a heat conductive tube; and a fan fixed onto one of the at least two heat sinks; the fan has an inlet vent and at least two outlet vents, the respective outlet vents have different discharging directions, a detachable shield plate is disposed at each of the outlet vents, a respective one of the outlet vents discharges an airflow outside when a respective one of the shield plates is drawn out.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: August 1, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE CHATANI ELECTRONICS CO., LTD.
    Inventor: Yingli Meng
  • Patent number: 9721618
    Abstract: A storage cartridge dock system and method are provided. The storage cartridge dock system in one example includes a case including a front panel, an upper cartridge slot formed in the front panel of the case and configured to receive an upper storage cartridge, with the upper cartridge slot including an upper interface connector, at least a lower cartridge slot formed in the front panel and configured to receive a lower storage cartridge, with the at least lower cartridge slot including a lower interface connector, and a first external connector and a second external connector coupled to the upper interface connector of the upper cartridge slot and coupled to the lower interface connector of the at least lower cartridge slot.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: August 1, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Dilbag Singh Pannu, Gregory Crosby, John Lynn Harting, William Michael Williams, Timothy George Harrington, II, Thomas F. Meehan
  • Patent number: 9723740
    Abstract: The present disclosure relates to an electronic control apparatus for a vehicle, and the electronic control apparatus of the present disclosure includes: an electronic control element which includes an electronic control board which electrically controls each part of a vehicle, and a heating element which is positioned on a surface of the electronic control board; a cover and a base which accommodate the electronic control element; and a connector which is coupled to the electronic control element, in which an edge part where the cover and the base come into contact with each other is configured in a multi-step bent shape.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: August 1, 2017
    Inventors: Sun Jae Yang, Hyung Joon Moon, Chang Geun Shin, Dong Gi Lee, Jun Ho Lee
  • Patent number: 9717167
    Abstract: Cooling performance of a control circuit substrate used in a power converter is improved.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: July 25, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Fusanori Nishikimi
  • Patent number: 9717164
    Abstract: A current converter apparatus includes a multi-phase current converter having current-converter modules for each phase that are electrically connected to one another and arranged in a current-converter cabinet. Each current-converter module has at least one semiconductor component arranged on a heat sink and includes just two semiconductor components connected to each other and connected to be controlled by a control component. The current-converter modules in the current-converter cabinet are arranged so that the current-converter modules of each current-converter phase form a horizontal row of modules arranged one beside the other and the rows are arranged vertically one above the other.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: July 25, 2017
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Brigitte Hetzel, Marc Hiller, Anton Pfauser, Gudrun Popp, Elfriede Schickert
  • Patent number: 9717161
    Abstract: A board assembly including a cooling system includes: a wiring board; a first heat generating component mounted on a surface of the wiring board; a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough; a second heat generating component mounted on another surface of the wiring board; a second heat receiving portion mounted on the second heat generating component and configured to allow the coolant to pass therethrough; and a support post disposed through the wiring board so as to extend between the first heat receiving portion and the second heat receiving portion, the support post having a space through which the coolant flows from the first heat receiving portion to the second heat receiving portion or from the second heat receiving portion to the first heat receiving portion.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: July 25, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Kenji Katsumata, Jie Wei, Masumi Suzuki
  • Patent number: 9713292
    Abstract: In a DC-DC converter, the cooling of switching elements has been performed only by means of a cooling plate; therefore, there is a problem in that, to effectively radiate heats generated by power MOSFETs that have large heating values and that are arranged parallel, it becomes necessary to reduce thermal resistances and complicate the cooling route of a water-cooling device. Plural switching elements for controlling currents flowing through inductor elements, which are used for voltage conversion of a DC-DC converter, are fixed to a metal case via a heat conductive insulating material and via a metal radiator having a better heat conduction characteristic than the metal case. Because there occur no large mixing phenomena of heat currents among neighboring switching elements, and there are only little heat interferences between the neighboring switching elements, the thermal diffusion characteristic is improved, and the cooling efficiency for the switching elements can be increased.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: July 18, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hidenori Shinohara, Mitsuru Yasunami, Tadahiko Chida
  • Patent number: 9713277
    Abstract: The invention relates to an electronic arrangement having a directly contactable circuit board (2), said electronic arrangement comprising: a circuit board (2) that includes at least one electric contact for electric contacting, a housing (3) inside which the circuit board (2) is arranged, and a plug shroud (33) that is arranged on the housing (3). The circuit board (2) includes a first circuit board half (24) that has a support (4) for supporting the circuit board (4), and a second circuit board half (25). The circuit board (2) is supported on the support (4) in such a way that the support (4) defines a swivel region, in particular a swivel axis of the circuit board (2), about which the circuit board (2) can swivel.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: July 18, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Markus Kroeckel, Richard Gueckel