Patents Examined by Zhengfu J Feng
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Patent number: 12035489Abstract: According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.Type: GrantFiled: July 11, 2022Date of Patent: July 9, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Youngjong Shin, Hangyu Hwang, Changsu Kim, Hyeonwoo Lee, Sungho Cho, Jeonga Kang, Hyunsuk Choi
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Patent number: 12024283Abstract: A circuit board assembly for association with an aircraft includes a circuit board and an electromagnetic interference component connected to the circuit board. The circuit board assembly may further include an enclosure having an electromagnetic signal permissive layer and an electromagnetic signal blocking layer. The electromagnetic signal permissive layer may include a housing that define a volume. The housing may enclose the electromagnetic interference component on the circuit board. The electromagnetic signal blocking layer defines a conductive barrier about the electromagnetic interference component.Type: GrantFiled: December 7, 2020Date of Patent: July 2, 2024Assignee: Zipline International Inc.Inventor: Ethan C. Anderson
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Patent number: 12022640Abstract: A multi-column graphite-over-foam (GOF) assembly includes a plurality of foam columns wherein each foam column of the plurality of foam columns are individually wrapped in a graphite sheet. A graphite layer surrounds the plurality of foam columns and an electrically conductive outer layer surrounding the graphite layer. The graphite layer is configured to thermally couple the electrically conductive outer layer to the plurality of foam columns, and the electrically conductive outer layer is configured to absorb electromagnetic interference (EMI).Type: GrantFiled: June 14, 2022Date of Patent: June 25, 2024Assignee: CISCO TECHNOLOGY, INC.Inventors: Phong Hoang Ho, Stephen Aubrey Scearce
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Patent number: 12022626Abstract: In a ventilation mechanism of an electronic control device, a ventilation path is formed by a through hole and a window formed in a side surface of a projection projecting outward of a case, and entry of water into the ventilation path is prevented by a wall. A water-repellent filter is attached to an inner wall of the case, with a gap between the water-repellent filter and a bottom surface of the projection. The projection and the wall are integrated with the case. This achieves reduction in the number of components of the ventilation mechanism and improvement in machinability while ensuring a waterproof function.Type: GrantFiled: September 21, 2018Date of Patent: June 25, 2024Assignee: Mitsubishi Electric CorporationInventors: Kazuya Fujisawa, Kohei Ushio, Kazuki Takabatake
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Patent number: 12018710Abstract: An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20. The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28. The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20. A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole.Type: GrantFiled: August 27, 2019Date of Patent: June 25, 2024Assignee: Hitachi Astemo, Ltd.Inventors: Kenta Yakuzawa, Toshikazu Shigyo
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Patent number: 12014236Abstract: Mounts for securing a device to a flexible object comprise a flexible substrate configured to be operatively coupled to the flexible object and a housing coupled to the flexible substrate and having an internal void that is sized to receive the device.Type: GrantFiled: May 11, 2023Date of Patent: June 18, 2024Assignee: ELEVATION LAB, INC.Inventors: Casey Hopkins, Jacob Hull
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Patent number: 12016139Abstract: A flexible display device and a manufacturing method thereof are provided. The flexible display device includes a flexible display panel, wherein the flexible display panel is bent at a preset position to form a first plane part, a bending part, and a second plane part, the preset position includes a first bending point and a second bending point, a distance between the first bending point and the second bending point is H, a middle point of a line formed by connecting the first bending point and the second bending point is located on a bending axis of the bending part, and a radius of curvature of at least one point on the bending part is greater than H/2.Type: GrantFiled: April 2, 2021Date of Patent: June 18, 2024Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Inventors: Lijun Qin, Yanqiang Duan
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Patent number: 12016166Abstract: An electronic device is provided. The electronic device includes a circuit board, a connector, a shielding frame and a shielding cover. The connector is disposed on the circuit board. The shielding frame is disposed on the circuit board, wherein the connector is disposed in the shielding frame. The shielding cover is detachably connected to the shielding frame, wherein when the shielding cover is combined with the shielding frame, an inlet is formed between the shielding frame and the shielding cover, and the shielding frame and the shielding cover are adapted to block an interference signal.Type: GrantFiled: September 10, 2021Date of Patent: June 18, 2024Assignee: WISTRON NEWEB CORP.Inventors: Yu-Ting Kuo, Yung-Jinn Chen
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Patent number: 12014794Abstract: According to one embodiment, a memory system includes a first plate, an intermediate member, and a substrate. The intermediate member includes a second plate and a pair of side walls. The second plate includes a first opening, and is arranged to have a gap with respect to the first plate. The second plate includes a first face facing the first plate and a second face located on a side opposite to the first face. The pair of side walls is arranged on the second face. The substrate is placed between the pair of side walls. The substrate includes a third face on which a first non-volatile memory package and a controller package are mounted. The third face faces the second plate. The first non-volatile memory package is thermally connected to the second plate. The controller package is thermally connected to the first plate through the first opening.Type: GrantFiled: January 24, 2022Date of Patent: June 18, 2024Assignee: Kioxia CorporationInventor: Seiichi Tajima
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Patent number: 12016120Abstract: A computing card for an information handling system, the computing card system including a computing card, including: a first side including: a first body surface, the first body surface including a first plurality of conductive pads configured to connect respectively with a first set of pins of a computing card receptacle; a first indented surface configured to connect with a second set of pins of the computing card receptacle; a first connecting surface defined between the first body surface and the first indented surface; a bottom surface; and a plurality of internal layers, wherein one or more of the internal layers are exposed at the first indented surface, and are connected to the bottom surface.Type: GrantFiled: July 6, 2021Date of Patent: June 18, 2024Assignee: Dell Products L.P.Inventors: Charles William Ziegler, Jason Charles Pritchard, Stephen Edward Strickland
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Patent number: 12016167Abstract: A carrier assembly for mounting equipment into a carrier slot includes an electro-magnetic interference (EMI) shield and an EMI finger. The EMI shield protects the mounted equipment from EMI. The EMI shield is formed in a first plane of the carrier assembly. The EMI finger protrudes from the EMI shield and is coupled to the EMI shield. The EMI finger is formed in a second plane perpendicular to the first plane. The EMI finger operates, when the carrier assembly is installed into the carrier slot, to couple the EMI shield to the carrier slot. The EMI finger, when viewed from a first direction that is perpendicular to both the first plane and the second plane, is formed in a tear-drop shape.Type: GrantFiled: April 11, 2022Date of Patent: June 18, 2024Assignee: Dell Products L.P.Inventors: Yu-Lin Chen, Yueh-Chun Tsai, Chun-Cheng Lin, Chi-Feng Lee
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Patent number: 12011908Abstract: A stretchable display panel and a display device are disclosed. The stretchable display device includes a display area and a wiring area. Each of bridge structures in a transition display area gradually increases in width in a direction from a middle display area to the wiring area. A plurality of first openings are defined on a side of the transition display area adjacent to the wiring area. Each of the first openings has opposite ends located within a boundary area defined by a connecting line connecting centers of adjacent island structures corresponding to the opposite ends of the first opening. In this manner, a hollow ratio of the transition display area close to the wiring area can be reduced, and risk of breakage of lines in the transition display area can be lowered.Type: GrantFiled: March 19, 2021Date of Patent: June 18, 2024Assignee: WUHAN CHINA STAR OPTOELECTORNICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.Inventor: Wenqiang Wang
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Patent number: 12015217Abstract: An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.Type: GrantFiled: December 23, 2020Date of Patent: June 18, 2024Assignee: International Business Machines CorporationInventors: Tyler Jandt, Mark Plucinski, Sandra J. Shirk/Heath, Phillip V. Mann
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Patent number: 12016146Abstract: Embodiments of the disclosure provide a cable connection structure, including: a bearing member, the bearing member being provided with at least one cable connector, and each cable connector having a first port connected to a cable and a second port electrically connected to the first port; and a sliding structure connected to the bearing member, the bearing member being configured to be connected to a single board through the sliding structure, the bearing member enabling the single board connected to the bearing member to slide in a first direction which is a direction close to or away from the second port. Embodiments of the disclosure also provide a single-board assembly and a single-board assembly connection structure.Type: GrantFiled: August 19, 2021Date of Patent: June 18, 2024Assignee: XI'AN ZHONGXING NEW SOFTWARE CO., LTD.Inventor: Yu Bi
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Patent number: 12016155Abstract: A heat sink including a first face in contact with electronic components generating heat to be removed and a second face in contact with the medium into which to dissipate the heat generated by the electronic components, including: at least one device for enhancing the thermal conductivity including a dome-shaped surface, a pin and a lateral section of revolution about the pin, the dome-shaped surface being connected to one end of a pin and to the lateral section of revolution, the dome-shaped surface being arranged on the second-face side, the free end of the pin being arranged on the first-face side.Type: GrantFiled: July 11, 2019Date of Patent: June 18, 2024Assignees: Continental Automotive France, Continental Automotive GmbHInventor: Philippe Lopez
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Patent number: 12004314Abstract: This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.Type: GrantFiled: May 31, 2022Date of Patent: June 4, 2024Assignee: Micron Technology, Inc.Inventor: Anthony D. Veches
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Patent number: 11997785Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.Type: GrantFiled: January 17, 2022Date of Patent: May 28, 2024Assignee: Unimicron Technology Corp.Inventors: Chun-Lin Liao, Pei-Chang Huang
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Patent number: 11997841Abstract: Presented herein is an air vent including a plate, and a non-uniform array of openings extending through a thickness of the plate. The non-uniform array of openings arranged to admit a flow of cooling air through the plate. The plate and the non-uniform array of openings are arranged to attenuate electromagnetic interference (EMI) emitted through the plate.Type: GrantFiled: October 27, 2021Date of Patent: May 28, 2024Assignee: CISCO TECHNOLOGY, INC.Inventors: Jianquan Lou, Alpesh Umakant Bhobe, Jerrold Mark Pianin
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Patent number: 11997812Abstract: A cover is disclosed, including: a first gasket that is placed along a portion of the cover that is to join with a heat sink; a second gasket that is placed around a cutout region of the cover, wherein the cover is configured to couple to a circuit board associated with the power module and expose a component on the circuit board through the cutout region; and a fastener that is configured to engage with the heat sink.Type: GrantFiled: October 12, 2022Date of Patent: May 28, 2024Assignee: Lunar Energy, Inc.Inventors: Kevin Richard Fine, Peter H. J How, Charles Ingalz, Steven Nicholas Grolle, Stephen Robert Bannick
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Patent number: 11997816Abstract: A substrate magazine for a substrate insertion system, having a frame in which several drawers for receiving in each case at least one flat substrate are arranged one above the other. Each drawer is formed by two guide rails, arranged in parallel and at a distance from one another at the same height as that of the frame, each with a sliding surface on which a substrate lying on the edge can be displaced. At least one elastically displaceable latching element is assigned to each drawer. In a first, unloaded state, the at least one latching element extends at least partially over the sliding surface of one of the guide rails of the drawer and, in a second, elastically deformed state, releases the sliding surface.Type: GrantFiled: July 31, 2020Date of Patent: May 28, 2024Assignee: ASYS AUTOMATISIERUNGSSYSTEME GMBHInventors: Klaus Mang, Jurgen Lehner