Abstract: A rooftop mounted display assembly includes a first and second electronic display located at a housing for mounting to a roof of a vehicle. Apertures are vertically spaced apart along either end of thermal plates located behind the electronic displays. Fan(s), when activated, force ambient air through an inlet aperture located at a proximal end of the housing, the apertures at a first end of the thermal plates, channels located between the thermal plates and the electronic displays, the apertures at a second end of the thermal plates, and an exhaust aperture at a distal end of the housing.

Abstract: A cooling assembly includes a panel defining an opening, a cooling unit including an output and coupled to the panel such that the output at least partially covers the opening of the panel, and spring-loaded latch assemblies coupled to the panel and configured to couple the cooling assembly to an enclosure.

Abstract: A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Abstract: The invention relates to a structure (1) for housing electronic apparatuses (10) such as boards (11) and the like, wherein the apparatuses are arranged in a container with a drawer (40) insertable and extractable with respect to a frame (20) of the structure (1). On the back wall of the drawer (40) and on the frame (20) connectors (53, 54) are provided which are coupled directly and automatically when the drawer is inserted.

Abstract: An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).

Abstract: A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Abstract: A coupling for connecting a circuit board to a mount with a fastener. The mount may be connected to a component. The fastener includes a first snap-fit connection formation for establishing a snap-fit connection with a second snap-fit connection formation provided on the mount. When connected, the fastener clamps the circuit board against the mount. The fastener further includes a first engagement formation configured to engage with a second engagement formation on the mount for bracing the snap-fit connection.

Abstract: A fan assembly includes a socket to receive a fan module, a fan flap coupled to a first side wall of the socket, and an anti-reflow device coupled to a second side wall of the socket. The fan flap moves in a curved path between a first position and a second position. The anti-reflow device has an attachment feature, an embossed feature, and a stopping feature. The attachment feature attaches the anti-reflow device to the second side wall. The embossed feature extends through a first aperture in the second side wall. The stopping feature extends through a second aperture in the second side wall and contacts the fan flap. When the fan module is removed, the stopping feature retains the fan flap in the first position to block the socket and prevent air from reflowing through the socket.

Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.

Abstract: A sensor module includes: a flexible printed circuit board; a temperature sensor disposed on the flexible printed circuit board to measure the temperature of a measurement object; a distance sensor disposed on the flexible circuit board adjacent to the temperature sensor to measure the distance to the measurement object; a terminal cover disposed above the temperature sensor and the distance sensor and including a first hole exposing a top surface of the temperature sensor and a second hole exposing a top surface of the distance sensor; and a window disposed in the second hole of the terminal cover.

Abstract: The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.

Abstract: An example electrical connector includes a body to receive a circuit board. The body includes a first end and a second end. The electrical connector also includes a first latch rotatably attaches to the first end. The electrical connector further includes a second latch rotatably attaches to the second end. The electrical connector further includes a link member attached to the body. In response to a rotation of the first latch, the link member is to slide across the body from the first latch towards the second latch to rotate the second latch.

Abstract: A holder for an electronic rack includes a pivot point and a first end of the holder having a first blind-mate connector to be coupled to a second blind-mate connector at a first engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. The holder additionally includes a second end of the holder having a third blind-mate connector to be coupled to a fourth blind-mate connector at a second engagement interface. The third blind-mate connector and the fourth blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack.

Abstract: Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

Abstract: A housing of a conformal wearable battery (CWB) encloses a plurality of battery cells arranged in a grid-like pattern and electrically connected to a printed circuit board (PCB). The PCB includes an electrical connection pad that is electrically coupled to a positive terminal of a battery cell of the plurality of battery cells and a positive conductive region receiving electrical energy from one or more of the plurality of battery cells. A redundant trace fuse circuit is formed on the PCB to facilitate electrical connection of the electrical connection pad and the positive conductive region. The redundant trace fuse circuit includes a first fusible link for electrically connecting the first electrical connection pad to the positive conductive region and a second fusible link that is selectively enabled to electrically connect the first electrical connection pad to the positive conductive region when the first fusible link is inoperative.