Abstract: An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers.

Abstract: A method of producing a semiconductor device is described. The semiconductor device has a semiconductor chip with wiring terminals, conductor tracks for the electrical connection of the semiconductor chip, and a component of a housing configuration that contains organic, silicon-containing material. For this purpose, the semiconductor chip is applied to the component of the housing configuration and permanently connected to it. The conductor tracks and/or the wiring terminals are subsequently subjected to a cleaning process, in which silicon-containing material adhering to a surface is eliminated. The conductor tracks are subsequently connected in an electrically conducting manner to the wiring terminals. The contact quality of these electrical connections is noticeably improved by the cleaning process provided.

Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.

Abstract: The integrated component has a plurality of contact elements disposed at an edge region of a main surface of the integrated component which contains the functional element. The contact elements project into the edge region of the main surface and have at least one contact surface that is inclined relative to the main surface. The component is configured to be fastened to conductor tracks of a fastening device, such that the conductor tracks are disposed to face the component body and extend parallel to the main surface of the component body.

Abstract: A semiconductor component has one or more semiconductor chips with contact pads, a number of substrate layers, component contacts and conductor tracks which establish the electrical connection between the contact pads of the semiconductor chip and the component contacts. The substrate layers are respectively provided with conductor tracks and at least one opening and the chip or chips are placed in the opening. A plurality of substrate layers are interconnected lying above one another. The conductor tracks of respective substrate layers end in an area in the vicinity of the at least one semiconductor chip and in an edge area of the respective substrate layer.

Abstract: The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire assembly except for protruding electrode terminals. Bond wires connect the electrode terminals with the pressure sensor and/or the electronic circuit of the semiconductor chip. The device encapsulation consists entirely of a homogeneous pressure-transmitting medium comprising an enveloping compound, which transmits the pressure to be measured as free from delay and attenuation as possible but is mechanically resistant and dimensionally stable. The pressure to be measured is transmitted directly by the enveloping compound onto the pressure-detecting surface of the semiconductor chip, and the pressure sensor and/or the pressure sensor component is covered tightly on all sides against mechanical and/or chemical influences.

Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which there are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound composed of a first and a second layer. A method for manufacturing a semiconductor component includes applying the wiring foil to the first main side of the chip, producing the wire connection between the contact pads and the adjacent conductor track ends, applying the sealing compound to locations on the recess such that the wire connection is completely covered with the sealing compound, and only curing the surface of the sealing compound.

Abstract: The integrated component has a plurality of contact elements disposed at an edge region of a main surface of the integrated component which contains the functional element. The contact elements project into the edge region of the main surface and have at least one contact surface that is inclined relative to the main surface. The component is configured to be fastened to conductor tracks of a fastening device, such that the conductor tracks are disposed to face the component body and extend parallel to the main surface of the component body.

Abstract: A method of producing a semiconductor device is described. The semiconductor device has a semiconductor chip with wiring terminals, conductor tracks for the electrical connection of the semiconductor chip, and a component of a housing configuration that contains organic, silicon-containing material. For this purpose, the semiconductor chip is applied to the component of the housing configuration and permanently connected to it. The conductor tracks and/or the wiring terminals are subsequently subjected to a cleaning process, in which silicon-containing material adhering to a surface is eliminated. The conductor tracks are subsequently connected in an electrically conducting manner to the wiring terminals. The contact quality of these electrical connections is noticeably improved by the cleaning process provided.

Abstract: The invention relates to a method of producing a pressure sensor component with a chip carrier which has a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface.

Abstract: The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be measured. The component is encapsulated with electrically insulating material that encloses the semiconductor chip and/or the chip carrier at least in regions. A chimney-shaped connection piece that projects up relative to the pressure-detecting area of the pressure sensor penetrates through the encapsulation and is connected to the pressure sensor. The connection piece, which is a separate structural element is incorporated in the component encapsulation and it encloses at least the pressure-detecting surface area in a pressure-tight manner with its end bearing on the semiconductor chip. The connection piece is open toward the outside at its opposite end so as to expose the pressure sensor to the pressure to be measured.

Abstract: A semiconductor component has a semiconductor chip, connection elements, and a housing made of a molding compound. The semiconductor chip has contact pads on a top side. The contact pads are electrically connected to the connection elements via bonding wires. The connection elements overlap the semiconductor chip and they are affixed to the semiconductor chip with an adhesive tape. The adhesive tape has a carrier sheet of aluminum oxide and an adhesive layer applied on both sides of the carrier sheet.