Abstract: Techniques are disclosed relating to thermal control implemented by a power management unit. In some embodiments, the power management unit itself is configured to monitor thermal conditions, implement control for one or more thermal loops, and send reduction alerts, via an inter-chip interconnect, to the processor circuitry it powers. In some embodiments, the power management unit implements both thermal and electromigration control loops. Disclosed techniques may advantageously reduce or avoid thermal issues, potentially with reduced impact on processor performance relative to traditional techniques.

Abstract: Techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. A system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. A particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. The primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. A given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state.

Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Specifically, a power manager circuit in an integrated circuit (e.g., a system on a chip) may modify power budgets for various components in the integrated circuit to reduce the amount of power control caused by external signaling that indicates a voltage regulator overload (e.g., a voltage droop).

Abstract: Techniques are disclosed relating to thermal control implemented by a power management unit. In some embodiments, the power management unit itself is configured to monitor thermal conditions, implement control for one or more thermal loops, and send reduction alerts, via an inter-chip interconnect, to the processor circuitry it powers. In some embodiments, the power management unit implements both thermal and electromigration control loops. Disclosed techniques may advantageously reduce or avoid thermal issues, potentially with reduced impact on processor performance relative to traditional techniques.

Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Specifically, a power manager circuit in an integrated circuit (e.g., a system on a chip) may modify power budgets for various components in the integrated circuit to reduce the amount of power control caused by external signaling that indicates a voltage regulator overload (e.g., a voltage droop).

Abstract: Techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. A system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. A particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. The primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. A given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state.

Abstract: Systems and methods are disclosed for allocating and distributing power management budgets for subsystems (e.g., power usage clients) of a computer system. A power budget allocation subsystem may include a plurality of feedback branches having different associated time constants. Power usage clients with slower power response times may be provided power budgets based on a feedback branch having an associated longer time constant, while power usage clients with faster power response times may be provided with power budgets based on a feedback branch having an associated shorter time constant. The power budgets may be determined in the feedback branches based on power budgeting policies weighting the power budget of each subsystem relative to total power mitigation.

Abstract: Techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. A system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. A particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. The primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. A given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state.

Abstract: An apparatus includes a processing circuit, a power processing module, and a power management circuit. The power management circuit is configured to estimate, over time, energy consumption of the processing circuit, and to sample the estimated energy consumption using a plurality of different sampling frequencies. Each of the different sampling frequencies is used to generate a respective set of power values. The power management circuit is further configured to track a particular characteristic for each set of power values, and then to provide, for each set of power values, a particular power value that corresponds to the particular characteristic to the power processing module. Based on at least one of the particular power values, the power processing module is configured to adjust an operating parameter of the processing circuit.

Abstract: Systems, methods and mechanisms for efficiently reporting sensor data of multiple processing units. In various embodiments, a computing system includes processing units and a power management unit. The processing units include multiple sensors for measuring a variety of types of sensor data. If the sensor values exceed corresponding thresholds, then a processing unit sends the sensor values to the power management unit. Logic in the power management unit stores received sensor values. When the logic determines behavior of a processing unit changes, the logic updates one or more sensor thresholds for the processing unit for changing a frequency of reporting one or more sensor values of the processing unit. The logic sends the updated one or more sensor thresholds to the processing unit. The logic updates more operating modes and operating states for the processing units based on the received sensor values.

Abstract: Systems, methods and mechanisms for efficiently reporting sensor data of multiple processing units. In various embodiments, a computing system includes processing units and a power management unit. The processing units include multiple sensors for measuring a variety of types of sensor data. If the sensor values exceed corresponding thresholds, then a processing unit sends the sensor values to the power management unit. Logic in the power management unit stores received sensor values. When the logic determines behavior of a processing unit changes, the logic updates one or more sensor thresholds for the processing unit for changing a frequency of reporting one or more sensor values of the processing unit. The logic sends the updated one or more sensor thresholds to the processing unit. The logic updates more operating modes and operating states for the processing units based on the received sensor values.

Abstract: In an embodiment, an electronic device includes a package power zone controller. The device monitors the overall power consumption of multiple components of a “package.” The package power zone controller may detect workloads in which the package components (e.g. different types of processors, peripheral hardware, etc.) are each consuming relatively low levels of power, but the overall power consumption is greater than a desired target. The package power zone controller may implement various mechanisms to reduce power consumption in such cases.

Abstract: Systems and methods are disclosed for allocating and distributing power management budgets for subsystems (e.g., power usage clients) of a computer system. A power budget allocation subsystem may include a plurality of feedback branches having different associated time constants. Power usage clients with slower power response times may be provided power budgets based on a feedback branch having an associated longer time constant, while power usage clients with faster power response times may be provided with power budgets based on a feedback branch having an associated shorter time constant. The power budgets may be determined in the feedback branches based on power budgeting policies weighting the power budget of each subsystem relative to total power mitigation.

Abstract: An apparatus includes a processing circuit, a power processing module, and a power management circuit. The power management circuit is configured to estimate, over time, energy consumption of the processing circuit, and to sample the estimated energy consumption using a plurality of different sampling frequencies. Each of the different sampling frequencies is used to generate a respective set of power values. The power management circuit is further configured to track a particular characteristic for each set of power values, and then to provide, for each set of power values, a particular power value that corresponds to the particular characteristic to the power processing module. Based on at least one of the particular power values, the power processing module is configured to adjust an operating parameter of the processing circuit.

Abstract: In an embodiment, an electronic device includes a package power zone controller. The device monitors the overall power consumption of multiple components of a “package.” The package power zone controller may detect workloads in which the package components (e.g. different types of processors, peripheral hardware, etc.) are each consuming relatively low levels of power, but the overall power consumption is greater than a desired target. The package power zone controller may implement various mechanisms to reduce power consumption in such cases.

Abstract: An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modern PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.

Abstract: Methods and apparatus for integrating ARM-based IPs in computer system employing PCI-based fabrics. An PCI-based fabric is operatively coupled to an ARM-based ecosystem employing an ARM-based fabric such as OCP, AHB, or BVCI via a corresponding fabric-to-fabric bridge. Transactions between IP operatively coupled to the PCI-based fabric and IP in the ARM-based ecosystem are facilitated by applying applicable ordering and conversions operations via the fabric-to-fabric bridge and/or fabrics. For example, posted writes originating from IP coupled to the PCI-based fabric are converted to non-posted writes and serialized via the fabric-to-fabric bridge and forwarded to the ARM-based ecosystem.

Abstract: An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modern PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.

Abstract: An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modem PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.

Abstract: Methods and apparatus for integrating ARM-based IPs in computer system employing PCI-based fabrics. An PCI-based fabric is operatively coupled to an ARM-based ecosystem employing an ARM-based fabric such as OCP, AHB, or BVCI via a corresponding fabric-to-fabric bridge. Transactions between IP operatively coupled to the PCI-based fabric and IP in the ARM-based ecosystem are facilitated by applying applicable ordering and conversions operations via the fabric-to-fabric bridge and/or fabrics. For example, posted writes originating from IP coupled to the PCI-based fabric are converted to non-posted writes and serialized via the fabric-to-fabric bridge and forwarded to the ARM-based ecosystem.