Abstract: Methods and systems are provided for detecting patient motion during a diagnostic scan. In one example, a method for a medical imaging system includes obtaining output from one or more patient monitoring devices configured to monitor a patient before and during a diagnostic scan executed with the medical imaging system, receiving a request to initiate the diagnostic scan, tracking patient motion based on the output from the one or more patient monitoring devices, and initiating the diagnostic scan responsive to patient motion being below a threshold level.

Abstract: A system for encouraging patient stillness during an imaging scan is provided. The system includes an electronic device configured to generate a graphical representation for a patient undergoing the imaging scan. The system also includes a motion detection system configured to detect motion of the patient undergoing the imaging scan. The system further includes a computer system in communication with the electronic device and the motion detection system, wherein the computer system includes processing circuitry configured to receive a first signal from the motion detection system indicating motion of the patient undergoing the imaging scan and to send a second signal to the electronic device, in response to the first signal, to cause the electronic device to adversely modify the display of the graphical representation.

Abstract: Methods and systems are provided for detecting patient motion during a diagnostic scan. In one example, a method for a medical imaging system includes obtaining output from one or more patient monitoring devices configured to monitor a patient before and during a diagnostic scan executed with the medical imaging system, receiving a request to initiate the diagnostic scan, tracking patient motion based on the output from the one or more patient monitoring devices, and initiating the diagnostic scan responsive to patient motion being below a threshold level.

Abstract: A pediatric patient support system is provided. The system includes a support extension configured to be removably coupled to a cradle of a table, wherein the support extension includes radial supports extending in a radial direction relative to a longitudinal axis of the cradle. The system includes a pair of rods, wherein each rod is coupled to a respective radial support and extends substantially parallel to the longitudinal axis. The system includes a patient support disposed between and coupled to the rods, the patient support being configured to support a pediatric patient, wherein the patient support is configured to move axially relative to the longitudinal axis along the rods to move the pediatric patient in and out of a central bore of a medical imaging system.

Abstract: A system for encouraging patient stillness during an imaging scan is provided. The system includes an electronic device configured to generate a graphical representation for a patient undergoing the imaging scan. The system also includes a motion detection system configured to detect motion of the patient undergoing the imaging scan. The system further includes a computer system in communication with the electronic device and the motion detection system, wherein the computer system includes processing circuitry configured to receive a first signal from the motion detection system indicating motion of the patient undergoing the imaging scan and to send a second signal to the electronic device, in response to the first signal, to cause the electronic device to adversely modify the display of the graphical representation.

Abstract: A system includes an interventional device, a tracking device, an optical tracking system, at least one processor, and a display unit. The interventional device includes an insertion portion and an exterior portion. The insertion portion is configured for use inside of a patient to perform an interventional procedure. The tracking device is disposed proximate to the exterior portion of the interventional device. The optical tracking system is configured to cooperate with the tracking device to provide tracking imaging corresponding to a location and orientation of the tracking device. At least one processor is configured to correlate the tracking imaging information with an anatomical image of the patient to provide a combined image during a medical task for which at least a portion of the insertion portion of the interventional device is disposed inside of the patient. The display unit is configured to display the combined image.

Abstract: A pediatric patient support system is provided. The system includes a support extension configured to be removably coupled to a cradle of a table, wherein the support extension includes radial supports extending in a radial direction relative to a longitudinal axis of the cradle. The system includes a pair of rods, wherein each rod is coupled to a respective radial support and extends substantially parallel to the longitudinal axis. The system includes a patient support disposed between and coupled to the rods, the patient support being configured to support a pediatric patient, wherein the patient support is configured to move axially relative to the longitudinal axis along the rods to move the pediatric patient in and out of a central bore of a medical imaging system.

Abstract: A monitoring device for obtaining data from a patient during a respiratory and/or cardiac cycle of the patient. The monitoring device includes a compliant variable capacitor securely attached to the patient. The capacitance of the compliant variable capacitor changes during movement of the patient caused by the respiratory cycle and/or a cardiac cycle. The changing capacitance is used to generate a monitoring signal that includes the frequency, timing and amplitude of either the respiratory or cardiac cycle. The signal from the monitoring device is provided to a medical imaging system such that the medical imaging system can compensate for the motion of the patient during the reparatory/cardiac cycle.

Abstract: A monitoring device for obtaining data from a patient during a respiratory and/or cardiac cycle of the patient. The monitoring device includes a compliant variable capacitor securely attached to the patient The capacitance of the compliant variable capacitor changes during movement of the patient caused by the respiratory cycle and/or a cardiac cycle. The changing capacitance is used to generate a monitoring signal that includes the frequency, timing and amplitude of either the respiratory or cardiac cycle. The signal from the monitoring device is provided to a medical imaging system such that the medical imaging system can compensate for the motion of the patient during the reparatory/cardiac cycle.

Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.

Abstract: A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines inlet manifolds configured to receive a coolant and outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a circular or spiral arrangement. Millichannels are formed in the body or in the lids, are disposed in a radial arrangement, and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. Heat sinks with a single lid are also provided.

Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.

Abstract: A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Abstract: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

Abstract: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.