Abstract: A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent the thermal element for regulating the flow of heat therefrom. A plurality of electrically conductive leads extend from the device to the exterior of the packaging arrangement. Portions of the electrically conductive leads extend between the thermal elements and are in thermal contact with at least one of these elements. The leads are electrically isolated from the thermal elements and a seal is maintained between the leads and the elements. An outer casing surrounds the thermal elements, and the plurality of leads extend through the outer casing to provide for connecting the device to the environment. A seal is also maintained between the outer casing and the leads. The outer casing is formed from premolded thermoplastic base and cap sections.

Abstract: A unitized packaging arrangement for an energy dissipating device comprises a thermoplastic housing, base, and cap which are joined together to form the package for the device. The thermoplastic housing is formed to mountably receive the energy dissipating device and is provided with a metallized conductor pattern on portions of its outer surface. The conductor pattern is connected to a plurality of bonding pads on the device. In a preferred embodiment, the conductor pattern includes the metallized surface of at least one opening formed in the thermoplastic housing. In an especially preferred embodiment, a conductive element (such as a conductive pin) is located in the opening and is joined to the metallized surface by soldering. The thermoplastic base is formed to mountably receive the thermoplastic housing following mounting of the device, and provides access to the conductor pattern from outside the packaging arrangement.

Abstract: A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent one of the thermal elements for regulating the flow of heat therefrom. A plurality of electrically conductive leads extend from the device to the exterior of the packaging arrangement. Portions of the electrically conductive leads extend between the thermal elements and are in thermal contact with at least one of the these elements. The leads are electrically isolated from the thermal elements and a seal is maintained between the leads and the elements. An outer casing surrounds the thermal elements, and the plurality of leads extend through the outer casing to provide for connecting the device to the environment. A seal is also maintained between the outer casing and the leads. The outer casing is preferably formed from premolded thermoplastic base and cap sections.