Patents by Inventor Ahmad A. Naiini

Ahmad A. Naiini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10793676
    Abstract: A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of an unsubstituted alkenyl group and an unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: October 6, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20200262978
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), [insert formula here] (la) or [insert formula here] (lb), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Application
    Filed: October 18, 2017
    Publication date: August 20, 2020
    Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini, Raj Sakamuri
  • Publication number: 20200218152
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
    Type: Application
    Filed: March 18, 2020
    Publication date: July 9, 2020
    Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
  • Patent number: 10696932
    Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: June 30, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
  • Patent number: 10604628
    Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: March 31, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
  • Publication number: 20190263969
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.
    Type: Application
    Filed: October 26, 2017
    Publication date: August 29, 2019
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20190171105
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Application
    Filed: July 11, 2018
    Publication date: June 6, 2019
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20190129303
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Application
    Filed: October 25, 2017
    Publication date: May 2, 2019
    Inventors: William A. Reinerth, Binod B. De, Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20190018321
    Abstract: This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.
    Type: Application
    Filed: December 20, 2016
    Publication date: January 17, 2019
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20190016999
    Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.
    Type: Application
    Filed: July 28, 2016
    Publication date: January 17, 2019
    Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
  • Patent number: 10036952
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: July 31, 2018
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20170260330
    Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.
    Type: Application
    Filed: May 30, 2017
    Publication date: September 14, 2017
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
  • Patent number: 9695284
    Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: July 4, 2017
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
  • Patent number: 9519216
    Abstract: The present disclosure relates to compositions that include at least one polybenzoxazole precursor polymer, at least one photoacid generator, and at least one basic compound. Articles, films, and methods related to these compositions are also disclosed.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: December 13, 2016
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Ahmad A. Naiini, Il'ya Rushkin, William D. Weber, Donald W. Racicot
  • Publication number: 20160313642
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Application
    Filed: April 19, 2016
    Publication date: October 27, 2016
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20160313641
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
    Type: Application
    Filed: April 19, 2016
    Publication date: October 27, 2016
    Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20140343199
    Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 20, 2014
    Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
  • Patent number: 7803510
    Abstract: A heat resistant positive-working photosensitive PBO precursor composition comprising: (a) at least one polybenzoxazole precursor polymer; (a) at least one plasticizer compound; (b) at least one solvent; wherein the amount of the plasticizer present in the composition is an amount effective to reduce the sidewall angle of imaged and cured features in the coated film on the substrate to prevent stress failures in subsequent metallization of the substrate due to steep angles of the imaged features, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety on the polymer, then (c) at least one photoactive compound is also present in the composition.
    Type: Grant
    Filed: August 7, 2006
    Date of Patent: September 28, 2010
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Ahmad A. Naiini, David B. Powell, Donald W. Racicot, Il'ya Rushkin, William D. Weber
  • Publication number: 20090197067
    Abstract: The present disclosure relates to compositions that include at least one polybenzoxazole precursor polymer, at least one photoacid generator, and at least one basic compound. Articles, films, and methods related to these compositions are also disclosed.
    Type: Application
    Filed: January 30, 2009
    Publication date: August 6, 2009
    Applicant: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Ahmad A. Naiini, Ilya Rushkin, William Weber, Donald W. Racicot
  • Publication number: 20090111050
    Abstract: This disclosure relates to compositions that include (a) at least one polybenzoxazole precursor polymer; and (b) at least one silicon-containing polymer comprising a moiety of Structure (V): in which R5, R7, Ar5, m1, and m2 are defined in the specification.
    Type: Application
    Filed: October 15, 2008
    Publication date: April 30, 2009
    Inventors: Ahmad A. Naiini, William Weber