Patents by Inventor Ajay V Patwardhan
Ajay V Patwardhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10937747Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.Type: GrantFiled: July 19, 2019Date of Patent: March 2, 2021Assignee: GM Global Technology Operations LLCInventors: Marko Jaksic, Ajay V. Patwardhan, Constantin Stancu, John Czubay
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Publication number: 20210020588Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.Type: ApplicationFiled: July 19, 2019Publication date: January 21, 2021Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Marko Jaksic, Ajay V. Patwardhan, Constantin Stancu, John Czubay
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Patent number: 9083128Abstract: In one aspect, a set of male and female bus bars is provided. The male bus bar includes first and second conductors and an insulation layer therebetween. The male bus bar has a male connecting portion with one or more fingers. The female bus bar third and fourth conductors and an insulation layer therebetween. The female bus bar has a female connecting portion with one or more receptacles, each having contact surfaces that are free of insulation and that are positioned to contact contact surfaces on an associated finger which are free of insulation so as to connect the first conductor and the third conductor and to connect the second conductor and the fourth conductor. Each finger has a width. A gap exists between the contact surfaces of an associated receptacle. The width and gap are sized to provide a press fit between the fingers and the receptacles.Type: GrantFiled: October 31, 2013Date of Patent: July 14, 2015Assignee: Magna E-Car Systems of America, Inc.Inventors: Viktor Pfeuffer, Ajay V. Patwardhan, Bert Mohr
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Publication number: 20140342612Abstract: In one aspect, a set of male and female bus bars is provided. The male bus bar includes first and second conductors and an insulation layer therebetween. The male bus bar has a male connecting portion with one or more fingers. The female bus bar third and fourth conductors and an insulation layer therebetween. The female bus bar has a female connecting portion with one or more receptacles, each having contact surfaces that are free of insulation and that are positioned to contact contact surfaces on an associated finger which are free of insulation so as to connect the first conductor and the third conductor and to connect the second conductor and the fourth conductor. Each finger has a width. A gap exists between the contact surfaces of an associated receptacle. The width and gap are sized to provide a press fit between the fingers and the receptacles.Type: ApplicationFiled: October 31, 2013Publication date: November 20, 2014Applicant: Magna E-Car Systems of America, Inc.Inventors: Viktor Pfeuffer, Ajay V. Patwardhan, Bert Mohr
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Publication number: 20100322284Abstract: A method for determining power semiconductor operating temperatures uses a database of measured temperatures. Each temperature is associated with operating conditions and determined by laboratory testing in an environment indicative of operation of the power semiconductors actual operations.Type: ApplicationFiled: April 26, 2010Publication date: December 23, 2010Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS US, INC.Inventors: Charles Lizhi Zhu, Ajay V. Patwardhan, Fred Flett, Matthew R. Obrigkeit
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Patent number: 7505294Abstract: A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.Type: GrantFiled: September 9, 2003Date of Patent: March 17, 2009Assignee: Continental Automotive Systems US, Inc.Inventors: Sayeed Ahmed, Fred Flett, Ajay V. Patwardhan, Douglas K. Maly
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Patent number: 7443692Abstract: A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled adjacent the gate driver board via clips, clamps, and/or fasteners.Type: GrantFiled: September 17, 2003Date of Patent: October 28, 2008Assignee: Continental Automotive Systems US, Inc.Inventors: Ajay V. Patwardhan, Douglas K. Maly, Sayeed Ahmed, Fred Flett
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Patent number: 7301755Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.Type: GrantFiled: December 13, 2004Date of Patent: November 27, 2007Assignee: Siemens VDO Automotive CorporationInventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
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Patent number: 7292451Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.Type: GrantFiled: December 13, 2004Date of Patent: November 6, 2007Assignee: Siemens VDO Automotive CorporationInventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
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Patent number: 7289343Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.Type: GrantFiled: December 13, 2004Date of Patent: October 30, 2007Assignee: Siemens VDO Automotive CorporationInventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
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Patent number: 7180763Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.Type: GrantFiled: September 21, 2004Date of Patent: February 20, 2007Assignee: Ballard Power Systems CorporationInventors: Ajay V. Patwardhan, Douglas K. Maly, Fred Flett, Sayeed Ahmed, Pablo Rodriguez, Kanghua Chen, Gerardo Jimenez
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Patent number: 7046535Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.Type: GrantFiled: December 3, 2004Date of Patent: May 16, 2006Assignee: Ballard Power Systems CorporationInventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
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Patent number: 6987670Abstract: A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.Type: GrantFiled: August 14, 2003Date of Patent: January 17, 2006Assignee: Ballard Power Systems CorporationInventors: Sayeed Ahmed, Fred Flett, Ajay V. Patwardhan, Douglas K. Maly
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Patent number: 6906404Abstract: A power module employs at least one capacitor electrically coupled across the input terminals to reduce voltage overshoot. The capacitor may be surface mounted to a high side collector plating area and a low side emitter plating area. The power module may employ a lead frame and terminals accessible from an exterior of a module housing, for making electrical couplings to externally located power sources and/or loads.Type: GrantFiled: August 14, 2003Date of Patent: June 14, 2005Assignee: Ballard Power Systems CorporationInventors: Douglas K. Maly, Sayeed Ahmed, Ajay V. Patwardhan, Fred Flett
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Patent number: 6890218Abstract: A three-phase connector carries all three phases in one connector and keeps the phases properly isolated from each other and the motor case. The three-phase connector has metal connector components that are spaced from one another and supported in a nylon over molding covering each of the connector components, except for upper and lower exposed ends of the connector components, which are each drilled and tapped to receive bolts. First and second connector components extend above and below a flange of the three-phase connector with their respective exposed upper and lower ends offset in different planes than the exposed upper and lower ends of the third connector component.Type: GrantFiled: May 21, 2003Date of Patent: May 10, 2005Assignee: Ballard Power Systems CorporationInventors: Ajay V Patwardhan, John Franklin
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Publication number: 20040228094Abstract: A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.Type: ApplicationFiled: August 14, 2003Publication date: November 18, 2004Applicant: Ballard Power Systems CorporationInventors: Sayeed Ahmed, Fred Flett, Ajay V. Patwardhan, Douglas K. Maly
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Publication number: 20040227231Abstract: A power module employs at least one capacitor electrically coupled across the input terminals to reduce voltage overshoot. The capacitor may be surface mounted to a high side collector plating area and a low side emitter plating area.Type: ApplicationFiled: August 14, 2003Publication date: November 18, 2004Applicant: Ballard Power Systems CorporationInventors: Douglas K. Maly, Sayeed Ahmed, Ajay V. Patwardhan, Fred Flett
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Publication number: 20040230847Abstract: A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled adjacent the gate driver board via clips, clamps, and/or fasteners.Type: ApplicationFiled: September 17, 2003Publication date: November 18, 2004Applicant: Ballard Power Systems CorporationInventors: Ajay V. Patwardhan, Douglas K. Maly, Sayeed Ahmed, Fred Flett
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Publication number: 20040033729Abstract: A three-phase connector carries all three phases in one connector and keeps the phases properly isolated from each other and the motor case. The three-phase connector has metal connector components that are spaced from one another and supported in a nylon over molding covering each of the connector components, except for upper and lower exposed ends of the connector components, which are each drilled and tapped to receive bolts. First and second connector components extend above and below a flange of the three-phase connector with their respective exposed upper and lower ends offset in different planes than the exposed upper and lower ends of the third connector component.Type: ApplicationFiled: May 21, 2003Publication date: February 19, 2004Applicant: Ballard Power Systems CorporationInventors: Ajay V. Patwardhan, John Franklin
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Patent number: 6572416Abstract: A three-phase connector carries all three phases in one connector and keeps the phases properly isolated from each other and the motor case. The three-phase connector has metal connector components that are spaced from one another and supported in a nylon over molding covering each of the connector components, except for upper and lower exposed ends of the connector components, which are each drilled and tapped to receive bolts. First and second connector components extend above and below a flange of the three-phase connector with their respective exposed upper and lower ends offset in different planes than the exposed upper and lower ends of the third connector component.Type: GrantFiled: November 5, 2001Date of Patent: June 3, 2003Assignee: Ballard Power Systems CorporationInventors: Ajay V Patwardhan, John Franklin