Patents by Inventor Ajay V Patwardhan

Ajay V Patwardhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10937747
    Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: March 2, 2021
    Assignee: GM Global Technology Operations LLC
    Inventors: Marko Jaksic, Ajay V. Patwardhan, Constantin Stancu, John Czubay
  • Publication number: 20210020588
    Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.
    Type: Application
    Filed: July 19, 2019
    Publication date: January 21, 2021
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Marko Jaksic, Ajay V. Patwardhan, Constantin Stancu, John Czubay
  • Patent number: 9083128
    Abstract: In one aspect, a set of male and female bus bars is provided. The male bus bar includes first and second conductors and an insulation layer therebetween. The male bus bar has a male connecting portion with one or more fingers. The female bus bar third and fourth conductors and an insulation layer therebetween. The female bus bar has a female connecting portion with one or more receptacles, each having contact surfaces that are free of insulation and that are positioned to contact contact surfaces on an associated finger which are free of insulation so as to connect the first conductor and the third conductor and to connect the second conductor and the fourth conductor. Each finger has a width. A gap exists between the contact surfaces of an associated receptacle. The width and gap are sized to provide a press fit between the fingers and the receptacles.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: July 14, 2015
    Assignee: Magna E-Car Systems of America, Inc.
    Inventors: Viktor Pfeuffer, Ajay V. Patwardhan, Bert Mohr
  • Publication number: 20140342612
    Abstract: In one aspect, a set of male and female bus bars is provided. The male bus bar includes first and second conductors and an insulation layer therebetween. The male bus bar has a male connecting portion with one or more fingers. The female bus bar third and fourth conductors and an insulation layer therebetween. The female bus bar has a female connecting portion with one or more receptacles, each having contact surfaces that are free of insulation and that are positioned to contact contact surfaces on an associated finger which are free of insulation so as to connect the first conductor and the third conductor and to connect the second conductor and the fourth conductor. Each finger has a width. A gap exists between the contact surfaces of an associated receptacle. The width and gap are sized to provide a press fit between the fingers and the receptacles.
    Type: Application
    Filed: October 31, 2013
    Publication date: November 20, 2014
    Applicant: Magna E-Car Systems of America, Inc.
    Inventors: Viktor Pfeuffer, Ajay V. Patwardhan, Bert Mohr
  • Publication number: 20100322284
    Abstract: A method for determining power semiconductor operating temperatures uses a database of measured temperatures. Each temperature is associated with operating conditions and determined by laboratory testing in an environment indicative of operation of the power semiconductors actual operations.
    Type: Application
    Filed: April 26, 2010
    Publication date: December 23, 2010
    Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS US, INC.
    Inventors: Charles Lizhi Zhu, Ajay V. Patwardhan, Fred Flett, Matthew R. Obrigkeit
  • Patent number: 7505294
    Abstract: A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.
    Type: Grant
    Filed: September 9, 2003
    Date of Patent: March 17, 2009
    Assignee: Continental Automotive Systems US, Inc.
    Inventors: Sayeed Ahmed, Fred Flett, Ajay V. Patwardhan, Douglas K. Maly
  • Patent number: 7443692
    Abstract: A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled adjacent the gate driver board via clips, clamps, and/or fasteners.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: October 28, 2008
    Assignee: Continental Automotive Systems US, Inc.
    Inventors: Ajay V. Patwardhan, Douglas K. Maly, Sayeed Ahmed, Fred Flett
  • Patent number: 7301755
    Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: November 27, 2007
    Assignee: Siemens VDO Automotive Corporation
    Inventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
  • Patent number: 7292451
    Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: November 6, 2007
    Assignee: Siemens VDO Automotive Corporation
    Inventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
  • Patent number: 7289343
    Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: October 30, 2007
    Assignee: Siemens VDO Automotive Corporation
    Inventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
  • Patent number: 7180763
    Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: February 20, 2007
    Assignee: Ballard Power Systems Corporation
    Inventors: Ajay V. Patwardhan, Douglas K. Maly, Fred Flett, Sayeed Ahmed, Pablo Rodriguez, Kanghua Chen, Gerardo Jimenez
  • Patent number: 7046535
    Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: May 16, 2006
    Assignee: Ballard Power Systems Corporation
    Inventors: Pablo Rodriguez, Douglas K. Maly, Ajay V. Patwardhan, Kanghua Chen, Sayeed Ahmed, Gerardo Jimenez, Fred Flett
  • Patent number: 6987670
    Abstract: A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: January 17, 2006
    Assignee: Ballard Power Systems Corporation
    Inventors: Sayeed Ahmed, Fred Flett, Ajay V. Patwardhan, Douglas K. Maly
  • Patent number: 6906404
    Abstract: A power module employs at least one capacitor electrically coupled across the input terminals to reduce voltage overshoot. The capacitor may be surface mounted to a high side collector plating area and a low side emitter plating area. The power module may employ a lead frame and terminals accessible from an exterior of a module housing, for making electrical couplings to externally located power sources and/or loads.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: June 14, 2005
    Assignee: Ballard Power Systems Corporation
    Inventors: Douglas K. Maly, Sayeed Ahmed, Ajay V. Patwardhan, Fred Flett
  • Patent number: 6890218
    Abstract: A three-phase connector carries all three phases in one connector and keeps the phases properly isolated from each other and the motor case. The three-phase connector has metal connector components that are spaced from one another and supported in a nylon over molding covering each of the connector components, except for upper and lower exposed ends of the connector components, which are each drilled and tapped to receive bolts. First and second connector components extend above and below a flange of the three-phase connector with their respective exposed upper and lower ends offset in different planes than the exposed upper and lower ends of the third connector component.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: May 10, 2005
    Assignee: Ballard Power Systems Corporation
    Inventors: Ajay V Patwardhan, John Franklin
  • Publication number: 20040228094
    Abstract: A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.
    Type: Application
    Filed: August 14, 2003
    Publication date: November 18, 2004
    Applicant: Ballard Power Systems Corporation
    Inventors: Sayeed Ahmed, Fred Flett, Ajay V. Patwardhan, Douglas K. Maly
  • Publication number: 20040227231
    Abstract: A power module employs at least one capacitor electrically coupled across the input terminals to reduce voltage overshoot. The capacitor may be surface mounted to a high side collector plating area and a low side emitter plating area.
    Type: Application
    Filed: August 14, 2003
    Publication date: November 18, 2004
    Applicant: Ballard Power Systems Corporation
    Inventors: Douglas K. Maly, Sayeed Ahmed, Ajay V. Patwardhan, Fred Flett
  • Publication number: 20040230847
    Abstract: A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled adjacent the gate driver board via clips, clamps, and/or fasteners.
    Type: Application
    Filed: September 17, 2003
    Publication date: November 18, 2004
    Applicant: Ballard Power Systems Corporation
    Inventors: Ajay V. Patwardhan, Douglas K. Maly, Sayeed Ahmed, Fred Flett
  • Publication number: 20040033729
    Abstract: A three-phase connector carries all three phases in one connector and keeps the phases properly isolated from each other and the motor case. The three-phase connector has metal connector components that are spaced from one another and supported in a nylon over molding covering each of the connector components, except for upper and lower exposed ends of the connector components, which are each drilled and tapped to receive bolts. First and second connector components extend above and below a flange of the three-phase connector with their respective exposed upper and lower ends offset in different planes than the exposed upper and lower ends of the third connector component.
    Type: Application
    Filed: May 21, 2003
    Publication date: February 19, 2004
    Applicant: Ballard Power Systems Corporation
    Inventors: Ajay V. Patwardhan, John Franklin
  • Patent number: 6572416
    Abstract: A three-phase connector carries all three phases in one connector and keeps the phases properly isolated from each other and the motor case. The three-phase connector has metal connector components that are spaced from one another and supported in a nylon over molding covering each of the connector components, except for upper and lower exposed ends of the connector components, which are each drilled and tapped to receive bolts. First and second connector components extend above and below a flange of the three-phase connector with their respective exposed upper and lower ends offset in different planes than the exposed upper and lower ends of the third connector component.
    Type: Grant
    Filed: November 5, 2001
    Date of Patent: June 3, 2003
    Assignee: Ballard Power Systems Corporation
    Inventors: Ajay V Patwardhan, John Franklin