Patents by Inventor Akihiko Hanya

Akihiko Hanya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11355684
    Abstract: An aspect of the invention provides a multilayer circuit substrate that has a simple configuration and is thin. The multilayer circuit substrate has a stacked multiple of substrates and a wiring pattern disposed so to be sandwiched between the stacked multiple of substrates. At least one portion of the wiring pattern is configured of a conductive material wherein conductive particles are sintered. An upper face of the wiring pattern is directly joined to the substrate positioned above the wiring pattern, a lower face of the wiring pattern is directly joined to the substrate positioned below the wiring pattern, and the stacked multiple of substrates are fixed to each other by the wiring pattern.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: June 7, 2022
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko Hanya
  • Patent number: 10955700
    Abstract: The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: March 23, 2021
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Hiroto Fukushima, Akihiko Hanya, Kosaburo Ito, Tsukasa Imura, Reiki Tada
  • Patent number: 10932373
    Abstract: Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: February 23, 2021
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko Hanya
  • Patent number: 10912201
    Abstract: Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: February 2, 2021
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Akihiko Hanya, Tsukasa Imura
  • Patent number: 10823362
    Abstract: A vehicular lamp fitting comprising a film light source that includes a transparent film having flexibility, and a plurality of semiconductor light-emitting elements which are fixed in a state of being two-dimensionally disposed on at least a front surface of the transparent film; and a reflection surface that is disposed in a state of facing a rear surface of the transparent film of the film light source, and that reflects light which is emitted from a part or all of the plurality of semiconductor light-emitting elements and transmitted through the transparent film.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: November 3, 2020
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Hiroyuki Chikama, Norifumi Imazeki, Haruna Minami, Marino Mine, Akihiko Hanya, Kosaburo Ito, Takuya Yamamoto
  • Patent number: 10808907
    Abstract: Provided is a vehicular lamp which has a novel lighting appearance and satisfies a light distribution standard required by certain laws as well as being capable of realizing lighting patterns of various luminances and various light-emitting shapes, e.g., various lighting graphics. The vehicular lamp is provided with a film light source including a film having flexibility and a plurality of semiconductor light-emitting elements fixed in a state of being two-dimensionally disposed on at least a surface of the film.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: October 20, 2020
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Takuya Yamamoto, Marino Mine, Haruna Minami, Akihiko Hanya, Kosaburo Ito, Norifumi Imazeki, Hiroyuki Chikama
  • Patent number: 10774231
    Abstract: An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: September 15, 2020
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Hiroto Fukushima, Akihiko Hanya
  • Patent number: 10730433
    Abstract: Provided is a sheet for drawing user's eyes and guiding the line of sight. A visual line guidance sheet is arranged to cover at least a part of a window for a user to look out therethrough, and configured to guide the user's line of sight, by illuminating a partial region on the visual line guidance sheet. The visual line guidance sheet includes an optically transparent substrate layer, a plurality of LED dies, and a wiring pattern. The controller receives from an imager, an image obtained by imaging a region visible by the user through the window, detects an object targeted for visual line guidance, included in the image, and illuminates the LED dies on the visual line guidance sheet, corresponding to a position of the object.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: August 4, 2020
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Akihiko Hanya, Toshihiko Minoda
  • Publication number: 20200166802
    Abstract: The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.
    Type: Application
    Filed: May 22, 2018
    Publication date: May 28, 2020
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Hiroto FUKUSHIMA, Akihiko HANYA, Kosaburo ITO, Tsukasa IMURA, Reiki TADA
  • Patent number: 10665576
    Abstract: Provided is an optically transparent plate having a structure where an LED die is directly mounted on an optically transparent substrate, and light extraction efficiency is improved. The optically transparent plate comprises, an optically transparent substrate, a wiring pattern placed on either of a surface on the upper side and a surface on the underside of the optically transparent substrate, or on both of the surfaces, and the LED die bonded to the wiring pattern. A reflective layer is placed on the other side, of the surface of the optically transparent substrate on which the LED die is mounted. At least a part of the wiring pattern and at least a part of the reflective layer comprise a conductive material obtained by sintering conductive particles.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: May 26, 2020
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Reiki Tada, Akihiko Hanya
  • Publication number: 20200080703
    Abstract: A vehicular lamp fitting comprising a film light source that includes a transparent film having flexibility, and a plurality of semiconductor light-emitting elements which are fixed in a state of being two-dimensionally disposed on at least a front surface of the transparent film; and a reflection surface that is disposed in a state of facing a rear surface of the transparent film of the film light source, and that reflects light which is emitted from a part or all of the plurality of semiconductor light-emitting elements and transmitted through the transparent film.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 12, 2020
    Inventors: Hiroyuki Chikama, Norifumi Imazeki, Haruna Minami, Marino Mine, Akihiko Hanya, Kosaburo Ito, Takuya Yamamoto
  • Publication number: 20200063941
    Abstract: Provided is a vehicular lamp which has a novel lighting appearance and satisfies a light distribution standard required by certain laws as well as being capable of realizing lighting patterns of various luminances and various light-emitting shapes, e.g., various lighting graphics. The vehicular lamp is provided with a film light source including a film having flexibility and a plurality of semiconductor light-emitting elements fixed in a state of being two-dimensionally disposed on at least a surface of the film.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 27, 2020
    Inventors: Takuya Yamamoto, Marino Mine, Haruna Minami, Akihiko Hanya, Kosaburo Ito, Norifumi Imazeki, Hiroyuki Chikama
  • Publication number: 20200010705
    Abstract: An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 9, 2020
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Hiroto FUKUSHIMA, Akihiko HANYA
  • Publication number: 20190355889
    Abstract: An aspect of the invention provides a multilayer circuit substrate that has a simple configuration and is thin. The multilayer circuit substrate has a stacked multiple of substrates and a wiring pattern disposed so to be sandwiched between the stacked multiple of substrates. At least one portion of the wiring pattern is configured of a conductive material wherein conductive particles are sintered. An upper face of the wiring pattern is directly joined to the substrate positioned above the wiring pattern, a lower face of the wiring pattern is directly joined to the substrate positioned below the wiring pattern, and the stacked multiple of substrates are fixed to each other by the wiring pattern.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 21, 2019
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko HANYA
  • Patent number: 10431358
    Abstract: A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 ?m and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: October 1, 2019
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko Hanya
  • Publication number: 20190291640
    Abstract: Provided is a sheet for drawing user's eyes and guiding the line of sight. A visual line guidance sheet is arranged to cover at least a part of a window for a user to look out therethrough, and configured to guide the user's line of sight, by illuminating a partial region on the visual line guidance sheet. The visual line guidance sheet includes an optically transparent substrate layer, a plurality of LED dies, and a wiring pattern. The controller receives from an imager, an image obtained by imaging a region visible by the user through the window, detects an object targeted for visual line guidance, included in the image, and illuminates the LED dies on the visual line guidance sheet, corresponding to a position of the object.
    Type: Application
    Filed: March 21, 2019
    Publication date: September 26, 2019
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Akihiko HANYA, Toshihiko MINODA
  • Publication number: 20190281705
    Abstract: Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole.
    Type: Application
    Filed: March 8, 2019
    Publication date: September 12, 2019
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko HANYA
  • Patent number: 10383214
    Abstract: An electronic device capable of supplying a large current to a circuit pattern containing conductive nanoparticles includes a substrate, a region provided on the substrate, configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region. At least a part of the first circuit pattern includes a layer obtained by sintering conductive nanosized particles with a diameter of less than 1 ?m. The second circuit pattern is thicker than the first circuit pattern.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: August 13, 2019
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko Hanya
  • Publication number: 20190223292
    Abstract: Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.
    Type: Application
    Filed: January 14, 2019
    Publication date: July 18, 2019
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Akihiko HANYA, Tsukasa IMURA
  • Patent number: 10312223
    Abstract: A light-emitting device having a plurality of light-emitting elements closely adjacently disposed in spite of using only one substrate is provided. One or more light-emitting elements are flip-chip mounted on each of upper surface and lower surface of a substrate. The light-emitting elements are disposed so that the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are closely adjacent to each other when they are seen from above the substrate. The light-emitting elements mounted on the upper surface of the substrate have light-emitting surfaces as the upper surfaces, and the light-emitting elements mounted on the lower surfaces of the substrate have light-emitting surfaces on the substrate side. The substrate transmits at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: June 4, 2019
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko Hanya