Abstract: A method and apparatus for assisting operation by a vehicle operator for braking of a vehicle includes a detection system on the vehicle, which detects obstacles located in or near the direction of motion of the vehicle. Vehicle condition sensors on the vehicle provide characteristic parameters of the condition of the vehicle. Operator demand sensors, which are operatively associated with a brake pedal and an accelerator pedal, provide operator demands on the vehicle. A control unit determines whether or not braking action by the vehicle operator is needed from data concerning the obstacles, the characteristic parameters of vehicle condition and the operator demands on the vehicle and determines a target stand-by brake pressure. The control unit is operable to generate a command for adjustment of brake pressure to the determined stand-by brake pressure. A braking system on the vehicle is operable by the vehicle operator.

Abstract: A method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. A semiconductor device is also disclosed as having an interconnect structure including at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method described above.

Abstract: A method of fabricating a silicon single crystal ingot and a method of fabricating a silicon wafer using the ingot, characterized in that: the method is structured in such a manner that the silicon single crystal ingot is pulled up from the silicon fused liquid 7 in which nitrogen N and carbon C are doped in polycrystalline silicon, by using the Czochralski method, and its nitrogen density is 1×1013-5×1015 atoms/cm3, and the carbon density is 5×1015-3×1016 atoms/cm3.

Abstract: An electrically insulating thin-film-forming resin composition comprising (A) a hydrogen silsesquioxane resin, (B) a solvent-soluble polymer, and (C) a solvent; and a method for forming an electrically insulting thin film therefrom.

Abstract: An electrically insulating crosslinked thin-film-forming organic resin composition comprising (A) an electrically insulating organic resin having silicon atom-bonded hydrogen atoms or silicon atom-bonded alkenyl groups and (B) a solvent, and a method for forming a crosslinked thin film therefrom.

Abstract: An electrically insulating thin-film-forming resin composition comprising (A) an inorganic or organic electrically insulating resin having silicon atom-bonded hydrogen atoms, (B) a compound having groups able to react with the silicon atom-bonded hydrogen atoms in component (A) and having a boiling point under atmospheric pressure of at least 250° C., and (C) a solvent; and a method for forming an electrically insulating thin film therefrom.

Abstract: This invention pertains to a method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. This invention also pertains to a semiconductor device having an interconnect structure comprising at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method of this invention.

Abstract: This invention pertains to a method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. This invention also pertains to a semiconductor device having an interconnect structure comprising at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method of this invention.

Abstract: An ink jet apparatus has installed therein a retractable recovery device. The ink jet apparatus has a housing with a space accommodating a carriage for scanning a recording area, an ink jet head removably mounted on the carriage for ejecting ink onto a recording medium as the carriage scans the recording area, and a removable cover member forming a part of the housing covering said space. The recovery device includes a pressing member mounted in the space at a location outside the scanning area for movement between an accommodating position and an operating position. The pressing member extends from the space when moved to the operating position after removal of the cover member, whereby a recovery operation using the pressing member can be performed on the ink jet head by removing the ink jet head from the carriage. The pressing member, when in the accommodating position, is disposed within the space for concealment by the cover member.

Abstract: The instant invention pertains to a composition that can form silica thin films, wherein said composition performs well as a substrate planarizing coating when applied to a substrate and can be converted by exposure to high-energy radiation into silica thin film with an excellent electrical insulating performance. The composition for the formation of silica thin films comprises (A) a hydrogen silsesquioxane resin that contains at least 45 weight % hydrogen silsesquioxane resin with a molecular weight no greater than 1,500; and (B) solvent. A silica thin film is produced by evaporating the solvent (B), and then converting at least a portion of the hydrogen silsesquioxane resin (A) to silica by exposing the surface of the said substrate to high-energy radiation. The preferred substrate is a semiconductor substrate having at least one electrically conductive layer.

Abstract: To provide a composition and process for forming insulating films that can produce insulating films having low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0.degree. C. to 800.degree. C. The insulating films are prepared by coating the surface of a substrate the composition; evaporating the solvent; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).

Abstract: To provide a composition for the formation of insulating films that can form an insulating film having a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.

Abstract: A card having a paper as a base material laminated with decomposable plastic layers having such properties as durability, banding resistance, water resistance, chemical resistance, waterproofness, surface smoothness, glossiness end workability. Any visible information/design portion and/or a magnetic recording portion may be formed as required. The present invention improves the durability of a card using paper as a base material and provides the card which spontaneously decomposes even when left after being discarded.

Abstract: The present invention relates to a curable silicone composition comprising (A) an alkenyl-functional organopolysiloxane, (B) a siloxane-modified acrylic polymer, (C) an organohydrogenpolysiloxane, and (D) a hydrosilylation reaction catalyst. The curable silicone compositions of this invention cure into a highly oil-resistant and highly wear-resistant coating and are useful as base compositions for inks for silicone moldings, and are also useful for imparting release against pressure sensitive adhesives while maintaining a degree of printability.

Abstract: The introduction of a novel curable resin composition that is characterized by the ability to cure at temperatures at or above its melting-initiation temperature through the rapid, hydrosilylation-based formation of a crosslinked structure. Said curable resin composition comprising(A) an acrylic resin that has at least 2 silicon-bonded alkenyl groups in each molecule and a melting-initiation temperature of at least 40.degree. C.;(B) an acrylic resin that has at least 2 hydrosilyl groups in each molecule and a melting-initiation temperature of at least 40.degree. C., in a quantity that yields a value from 1:0.3 to 1:30 for the molar ratio of silicon-bonded alkenyl groups in component (A) to silicon-bonded hydrogen atoms in component (B); and(C) a hydrosilylation reaction catalyst in sufficient quantity to cure the composition.

Abstract: An air intake tube is provided for attempting to prevent, as much as possible, the entry of mud or water splashed by the front wheels of a vehicle having a structure with an engine, an air cleaner arranged adjacent to and at the back of the engine and a fuel tank positioned above the engine. The engine and other elements are mounted at an intermediate portion of a body frame having its front portion suspending the front wheels and its rear portion suspending the rear wheels. An air intake tube extends from the air cleaner toward the fuel tank. In the rear wall of the fuel tank, there is formed inwardly an accommodation recess extending backward, and the air intake tube has its open top end projecting into the accommodation recess.

Abstract: A monochromatic-light reproduction type hologram having a hologram recorded area provided with interference fringes that form a hologram image, the hologram image being reproducible by irradiating the hologram recorded area with monochromatic light at a given angle. A plurality of hologram images different from each other in the directionality of interference fringes are multiple-recorded in the hologram recorded area. Alternatively, the hologram recorded area is divided into a plurality of regions so that a plurality of hologram images different from each other in the directionality of interference fringes are separately recorded in the divided regions. The recorded area is successively or simultaneously irradiated with monochromatic light rays at given angles corresponding to the directionality of interference fringes of the respective hologram images, to reproduce the hologram images as a plurality of information patterns or a single information pattern.

Abstract: The present invention relates to an electroviscous fluid comprising the dispersion in an electrical insulating fluid of an organopolysiloxane having at least one metal sulfonate group in its molecule. The electroviscous fluid of the present invention can further comprise a polyether. The electroviscous fluid of the present invention does not wear or abrade surrounding equipment, is thermally stable, and that has a large electroviscous effect (yield value) and an excellent dispersion stability.

Abstract: An intermediate transfer medium comprises a heat-resistant base sheet and provided thereon a release layer and an image-receiving adhesive layer on which an image pattern is formed by a sublimation transfer means in accordance with image data, said image-receiving adhesive layer, on which said image pattern has been formed, being transferred to a transfer substrate together with said release layer to produce an image-recorded article, wherein said image-receiving adhesive layer is comprised of a thermoplastic resin having a glass transition point of 50.degree. C. or above and a filler added to the thermoplastic resin and selected from the group consisting of an inorganic filler having a melting point of 200.degree. C. or above and an organic filler having a softening point or decomposition point of 200.degree. C. or above.

Abstract: An identification mark comprises a set of a plurality of mark elements. One mark element is divided into a large number of first and second fine square regions alternately arranged. One or two basic gratings selected from a plurality of types of basic gratings is/are drawn in both fine square regions, so that patterns are formed. Since the basic gratings are different in direction of the grating or spatial frequency, the types of the basic gratings are different from each other. One selected type of basic gratings is drawn in all first fine square regions. Similarly, the one or another type of basic gratings is drawn in all second fine square regions. At least one first fine region and at least one second fine region exist in the diameter of the light beam when light is radiated on the mark element for optical read. Thereby, types of patterns, which one mark element can obtain, are increased.