Patents by Inventor Akihiko Okano
Akihiko Okano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10364142Abstract: A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.Type: GrantFiled: July 27, 2017Date of Patent: July 30, 2019Assignee: Canon Kabushiki KaishaInventors: Masafumi Morisue, Tamaki Sato, Akihiko Okano, Tetsushi Ishikawa
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Patent number: 10005283Abstract: There is provided a method for laminating a smooth thin resin layer on a substrate in manufacturing a liquid ejection head by a casting method. To achieve this, a resin layer having a sufficient thickness to fill a concave portion already existing on the substrate is applied and smoothed. Thereafter, a plurality of opening patterns (concave portions) are formed and then smoothed again to obtain a thin resin layer having a desired thickness.Type: GrantFiled: July 1, 2016Date of Patent: June 26, 2018Assignee: CANON KABUSHIKI KAISHAInventors: Akihiko Okano, Takumi Suzuki, Tamaki Sato
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Publication number: 20180037455Abstract: A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.Type: ApplicationFiled: July 27, 2017Publication date: February 8, 2018Inventors: Masafumi Morisue, Tamaki Sato, Akihiko Okano, Tetsushi Ishikawa
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Patent number: 9862189Abstract: There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer.Type: GrantFiled: July 1, 2016Date of Patent: January 9, 2018Assignee: CANON KABUSHIKI KAISHAInventors: Akihiko Okano, Takumi Suzuki, Tamaki Sato
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Publication number: 20170008289Abstract: There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer.Type: ApplicationFiled: July 1, 2016Publication date: January 12, 2017Inventors: Akihiko Okano, Takumi Suzuki, Tamaki Sato
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Publication number: 20170008290Abstract: There is provided a method for laminating a smooth thin resin layer on a substrate in manufacturing a liquid ejection head by a casting method. To achieve this, a resin layer having a sufficient thickness to fill a concave portion already existing on the substrate is applied and smoothed. Thereafter, a plurality of opening patterns (concave portions) are formed and then smoothed again to obtain a thin resin layer having a desired thickness.Type: ApplicationFiled: July 1, 2016Publication date: January 12, 2017Inventors: Akihiko Okano, Takumi Suzuki, Tamaki Sato
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Patent number: 9102145Abstract: A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.Type: GrantFiled: April 5, 2013Date of Patent: August 11, 2015Assignee: Canon Kabushiki KaishaInventors: Masahiko Kubota, Ryoji Kanri, Akihiko Okano, Atsushi Hiramoto, Masataka Sakurai, Yoshiyuki Fukumoto
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Patent number: 9096063Abstract: A method of manufacturing a liquid ejection head includes the steps of (1) forming a recess in a second surface of a substrate to form a common supply port, (2) forming an etching mask, which specifies opening positions of independent supply ports, on a bottom surface of the common supply port, and (3) performing ion etching using plasma with the etching mask employed as a mask, thereby forming the independent supply ports. The etching mask has an opening pattern formed therein such that respective distances from an ejection energy generation element to openings of two independent supply ports adjacent to the ejection energy generation element on the first surface side of the substrate are equal to each other.Type: GrantFiled: January 22, 2013Date of Patent: August 4, 2015Assignee: Canon Kabushiki KaishaInventors: Masahiko Kubota, Ken Tsuchii, Masataka Sakurai, Yoshiyuki Nakagawa, Akiko Saito, Shinji Kishikawa, Ryoji Kanri, Atsunori Terasaki, Akihiko Okano, Atsushi Hiramoto
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Patent number: 9023669Abstract: A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma.Type: GrantFiled: July 20, 2011Date of Patent: May 5, 2015Assignee: Canon Kabushiki KaishaInventors: Atsushi Hiramoto, Masahiko Kubota, Ryoji Kanri, Akihiko Okano, Yoshiyuki Fukumoto, Atsunori Terasaki
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Patent number: 8829391Abstract: A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.Type: GrantFiled: October 19, 2010Date of Patent: September 9, 2014Assignee: Canon Kabushiki KaishaInventors: Kosuke Kurachi, Masahiko Kubota, Akihiko Okano, Atsushi Hiramoto
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Patent number: 8778200Abstract: A method for manufacturing a liquid discharge head including a substrate on which supply ports for supplying a liquid are provided, includes forming a first supply port among the supply ports by performing crystal anisotropic etching on the substrate from one surface of the substrate, and forming a plurality of second supply ports among the supply ports by performing dry etching on the substrate using a crystal anisotropic etching method from a surface exposed toward the one surface of the substrate to a rear surface so that the independent second supply ports are respectively opened on the rear surface.Type: GrantFiled: October 14, 2008Date of Patent: July 15, 2014Assignee: Canon Kabushiki KaishaInventors: Masahiko Kubota, Akihiko Okano
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Patent number: 8613141Abstract: A manufacturing method of a liquid ejection head provided with a flow passage communicating with an ejection outlet for ejecting liquid includes steps of preparing a substrate on which a flow passage wall forming member for forming a part of a wall of the flow passage and a solid layer having a shape of a part of the flow passage contact each other, wherein the flow passage wall forming member has a height, from a surface of the substrate, substantially equal to that of the solid layer; providing on the solid layer a pattern having a shape of another part of the flow passage; providing a coating layer, for forming another part of the wall of the flow passage, so as to coat the pattern; providing the ejection outlet to the coating layer; and forming the flow passage by removing the solid layer and the pattern.Type: GrantFiled: November 11, 2008Date of Patent: December 24, 2013Assignee: Canon Kabushiki KaishaInventors: Akihiko Okano, Maki Kato, Masaki Ohsumi, Yoshinori Tagawa, Kazuhiro Asai, Masahiko Kubota, Tamaki Sato
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Publication number: 20130265368Abstract: A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.Type: ApplicationFiled: April 5, 2013Publication date: October 10, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Masahiko Kubota, Ryoji Kanri, Akihiko Okano, Atsushi Hiramoto, Masataka Sakurai, Yoshiyuki Fukumoto
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Patent number: 8434229Abstract: A liquid ejection head manufacturing method includes, in the following order, preparing a substrate having a flow path mold; arranging a first layer serving as a flow path wall member so as to cover the flow path mold; curing a portion of the first layer serving as a flow path sidewall; arranging a second layer so as to cover the cured portion of the first layer and the flow path mold; planarizing the second layer by pressing the second layer toward the substrate; arranging the ejection port in the first layer and the second layer; and forming the flow path by removing the flow path mold.Type: GrantFiled: October 21, 2011Date of Patent: May 7, 2013Assignee: Canon Kabushiki KaishaInventors: Akihiko Okano, Yasuaki Tominaga
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Patent number: 8419168Abstract: Provided is a liquid ejection head including a substrate including a liquid supply port and an energy generating element, in which the liquid supply port has at least one groove shape formed in a wall surface thereof, the at least one groove shape extending from a rear surface, which is a surface opposite to a front surface on which the energy generating element is formed, toward the front surface.Type: GrantFiled: August 26, 2011Date of Patent: April 16, 2013Assignee: Canon Kabushiki KaishaInventors: Akihiko Okano, Masahiko Kubota, Ryoji Kanri, Yoshiyuki Fukumoto, Masafumi Morisue
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Patent number: 8398212Abstract: An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other.Type: GrantFiled: December 11, 2009Date of Patent: March 19, 2013Assignee: Canon Kabushiki KaishaInventors: Akihiko Okano, Masahiko Kubota, Ryoji Kanri, Atsushi Hiramoto
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Patent number: 8366951Abstract: A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from a first surface to a rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a <100> direction of the Si substrate; and forming a plurality of the liquid supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.Type: GrantFiled: December 2, 2009Date of Patent: February 5, 2013Assignee: Canon Kabushiki KaishaInventors: Masafumi Morisue, Takumi Suzuki, Masahiko Kubota, Ryoji Kanri, Akihiko Okano, Atsushi Hiramoto
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Patent number: 8227043Abstract: A method for manufacturing a liquid discharge head includes the steps of: forming a solid layer for forming a flow path on a substrate on which an energy generating element is arranged to generate energy that is used to discharge liquid; forming, on the substrate where the solid layer is mounted, a coating layer for coating the solid layer; forming a discharge port used to discharge a liquid, through a photolithographic process, in the coating layer deposited on the solid layer; and removing the solid layer to form a flow path that communicates with the energy element and the discharge port. A material used for the coating layer contains a cationically polymerizable chemical compound, a cationic photopolymerization initiator and an inhibitor of cationic photopolymerization, and a material of the solid layer that forms a boundary with a portion where the discharge port of the coating layer is formed contains a copolymer of methacrylic acid and methacrylate ester.Type: GrantFiled: June 27, 2005Date of Patent: July 24, 2012Assignee: Canon Kabushiki KaishaInventors: Masahiko Kubota, Takumi Suzuki, Tamaki Sato, Ryoji Kanri, Maki Hatta, Kazuhiro Asai, Shoji Shiba, Etsuko Hino, Hiroe Ishikura, Akihiko Okano
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Patent number: 8191260Abstract: A manufacturing method of a liquid ejection head includes forming on a substrate a first flow passage wall forming member contacting a solid layer of equal height, exposing a first layer of a negative photosensitive resin material to form an ejection outlet forming member; exposing a second layer, on the first layer, of a negative photosensitive resin material to form a second flow passage wall forming member for forming another part of the wall of the flow passage; placing the exposed first and second layers on the solid layer and the first flow passage wall forming member so that a non-exposed portion of the second layer contacts the solid layer; forming parts of the flow passage and the ejection outlet by removing non-exposed portions of the first and second layers above the substrate; and forming the flow passage by removing the solid layer.Type: GrantFiled: March 9, 2009Date of Patent: June 5, 2012Assignee: Canon Kabushiki Kaisha KaishaInventors: Maki Kato, Masaki Ohsumi, Yoshinori Tagawa, Kazuhiro Asai, Masahiko Kubota, Tamaki Sato, Akihiko Okano
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Publication number: 20120124835Abstract: There is provided a liquid ejection head manufacturing method including step A of preparing a substrate having the flow path mold; step B of arranging a first layer serving as the flow path wall member so as to cover the flow path mold; step C of curing a portion serving as a flow path sidewall of the first layer; step D of arranging a second layer so as to cover the cured portion of the first layer and the flow path mold; step E of planarizing the second layer by pressing the second layer toward the substrate side; step F of arranging the ejection port in the first layer and the second layer; and step G of forming the flow path by removing the flow path mold in this order.Type: ApplicationFiled: October 21, 2011Publication date: May 24, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Akihiko Okano, Yasuaki Tominaga