Abstract: Silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin has the formula (PhSiO(3?x)/2(OR?)x)m(HSiO(3?x)/2(OR?)x)n(MeSiO(3?x)/2(OR?)x)o(RSiO(3?x)/2(OR?)x)p(R2SiO(3?x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R is selected from a sulfur-containing organic functional group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R2 is selected from ester groups, polyether groups; and polyethylene oxide groups; x has a value of 0, 1 or 2; m has a value of 0.01 to 0.97; n has a value of 0.01 to 0.97; o has a value of 0.01 to 0.97; p has a value of 0.01 to 0.97; q has a value of 0 to 0.96; and m+n+o+p+q?1.

Abstract: Silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin has the formula: (PhSiO(3?x)/2(OR?)x)m(HSiO(3?x)/2(OR?)x)n(MeSiO(3?x)/2(OR?)x)o(RSiO(3?x)/2(OR?)x)p(R2SiO(3?x)/2OR?)x)q where Ph is a phenyl group, Me is a methyl group; R is selected from a sulfur-containing organic functional group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R2 is selected from ester groups, polyether groups; and polyethylene oxide groups; x has a value of 0, 1 or 2; m has a value of 0.01 to 0.97; n has a value of 0.01 to 0.97; o has a value of 0.01 to 0.97; p has a value of 0.01 to 0.97; q has a value of 0 to 0.96; and m+n+o+p+q?1.

Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2) nR33-n wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

Abstract: A method of preparing an organosilicon compound containing an acryloxy-functional group or a methacryloxy-functional group represented by general formula CH2═CR1—COO—R2—Si(OR3)nR43−n, where R1, R2, R3, R4 are as described below, comprising reacting (a) an alkali-metal salt of acrylic acid or an alkali-metal salt of methacrylic acid described by general formula CH2═CR1COOM1, where R1 is a methyl group or a hydrogen atom and M1 is an alkali metal and (b) an organosilicon containing a halogen-substituted organic group described by general formula XR2Si(OR3)nR43−n, where X is a halogen atom, R2 is an alkylenoxyalkylene group or an alkylene group comprising 1 to 6 carbon atoms, R3 is an alkyl group comprising 1 to 6 carbon atoms or an alkoxyalkyl group comprising 2 to 4 carbon atoms, R4 is a monovalent hydrocarbon group, and n is an integer of 1 to 3; in the presence of (c) a tertiary amine having a cyclic structure selected from the group consisting of 1,8-diazabicyclo&lsqb

Abstract: A method of preparing an organosilicon compound containing an acryloxy-functional group or a methacryloxy-functional group represented by general formula CH2═CR1—COO —R2—Si(OR3)nR43−n, where R1, R2, R3, R4 are as described below, comprising reacting (a) an alkali-metal salt of acrylic acid or an alkali-metal salt of methacrylic acid described by general formula CH2═CR1COOM1, where R1 is a methyl group or a hydrogen atom and M1 is an alkali metal and (b) an organosilicon containing a halogen-substituted organic group described by general formula XR2Si(OR3)nR43−n, where X is a halogen atom, R2 is an alkylenoxyalkylene group or an alkylene group comprising 1 to 6 carbon atoms, R3 is an alkyl group comprising 1 to 6 carbon atoms or an alkoxyalkyl group comprising 2 to 4 carbon atoms, R4 is a monovalent hydrocarbon group, and n is an integer of 1 to 3; in the presence of (c) a tertiary amine having a cyclic structure selected from the group consisting of 1,8-diazabicyclo &ls

Abstract: A method for preparing a thermoplastic resin composition, said method comprising hot-kneading, in the absence of a radical-generating catalyst,(A) 100 parts by weight of a thermoplastic resin; and(B) 0.1 to 200 parts by weight of an alkenyl-functional polyorganosiloxane filled with amorphous silica micropowder, wherein the weight ratio of said silica micropowder to said alkenyl-functional polyorganosiloxane is 0.01:100 to 50:100, whereby the polyorganosiloxane of component (B) is chemically bonded to resin (A).

Abstract: A siloxane powder composition which can impart improved lubricity character to a thermoplastic resin is disclosed, said composition being prepared by mixing(A) 100 parts by weight of a liquid polydiorganosiloxane and(B) 40 to 200 parts by weight of a silica powder that has a specific surface of at least 50 m.sup.2 /g using sufficient shear to prepare a powder in which the surface of component (B) is coated with component (A), and then mixing this powder with(C) 10 to 50 parts by weight of a polyorganosiloxane resin which is a solid at room temperature, said resin consisting essentially of (R.sub.3 SiO.sub.1/2) siloxane units and (SiO.sub.2) siloxane units in the molar ratio of 1:4 to 1:1,where R is selected from the group consisting of alkyl radicals and phenyl radical.

Abstract: There is disclosed a polyamide molding composition characterized by excellent moldability, release and lubricity, said composition comprising:(A) 100 parts by weight of a polyamide resin;(B) 0.1 to 120 parts by weight of a polydiorganosiloxane that contains neither carboxyl nor amino groups; and(C) a polysiloxane selected from the group consisting of carboxyl-containing polydiorganosiloxane and amino-containing polydiorganosiloxane, the amount of said polysiloxane (C) being 0.01 to 50 parts by weight for each 100 parts by weight of said component (B).

Abstract: A siloxane powder composition which can impart improved lubricity character to a thermoplastic resin is disclosed, said composition being prepared by mixing(A) 100 parts by weight of a liquid polydiorganosiloxane and(B) 40 to 200 parts by weight of a silica powder that has a specific surface of at least 50 m.sub.2 /g using sufficient shear to prepare a powder in which the surface of component (B) is coated with component (A), and then mixing this powder with(C) 10 to 50 parts by weight of a polyorganosiloxane resin which is a solid at room temperature, said resin consisting essentially of (R.sub.3 SiO.sub.1/2) siloxane units and (SiO.sub.2) siloxane units in the molar ratio of 1:4 to 1:1,where R is selected from the group consisting of alkyl radicals and phenyl radical.

Abstract: A method for the preparation of triorganochlorosilane with the general formulaR.sup.1 R.sup.2 R.sup.3 SiCl,where R.sup.1, R.sup.2, and R.sup.3 are independently selected from a group consisting of substituted and unsubstituted monovalent hydrocarbon groups, wherein said method is characterized by the reaction of hydrogen chloride with triorganohydrosilane with the general formulaR.sup.1 R.sup.2 R.sup.3 SiH,where R.sup.1, R.sup.2 and R.sup.3 are as previously described, in the presence of a Group 8 transition metal or complex thereof.

Abstract: A method for the preparation of a random diorganosiloxane-diorganosilazane copolymer is disclosed, which method comprises polymerizing(A) a mixture or polymerization reaction product of(a) a hexaorganodisiloxane and(b) a cyclic diorganosiloxane with(B) a cyclic diorganosilazane of the formula ##STR1## wherein R.sup.1 is a monovalent hydrocarbon group, R.sup.2 is hydrogen or a monovalent hydrocarbon group and n is 3 or 4, the polymerization being carried out in the presence of cesium hydroxide.

Abstract: The present invention is a silylating method employing of formula(CH.sub.3)(R)(R.sup.1)SiX ;where R is an isopropyl group, R.sup.1 is a monovalent hydrocarbon group having 2 to 6 carbon atoms, and X is a chlorine atom or bromine atom. The silylating agent of the present invention provide silylation product which is much more stable than the silylation product obtained with trimethylchlorosilane, and its protective group is as stable as the silylation product obtained from t-butyldimethylchlorosilane. Moreover, the present described silylating agents are characterized by an easier desilylation than the t-butyldimethylsilyl group.

Abstract: The present invention is a silylating agent of formula(CH.sub.3)(R)(R.sup.1)SiX;where R is an isopropyl group, R.sup.1 is a monovalent hydrocarbon group having 2 to 6 carbon atoms, and X is a chlorine atom or bromine atom. The silylating agent of the present invention provide silylation product which is much more stable than the silylation product obtained with trimethylchlorosilane, and its protective group is as stable as the silylation product obtained from t-butyldimethylchlorosilane. Moreover, the present described silylating agents are characterized by an easier desilylation than the t-butyldimethylsilyl group.

Abstract: The subsequent tack and adhesion of a silicone pressure-sensitive adhesive can be improved by incorporating into the adhesive a small amount of an organopolysiloxane resin having a majority of R.sub.3 SiO.sub.1/2 siloxane units and the balance (R.sup.2 O).sub.a SiO.sub.(4-a)/2, preferably SiO.sub.4/2, siloxane units. The resulting composition, when brought into contact with a release liner, such a peelable protective sheet or the backside of the next turn in a roll of tape, have better tack and/or adhesion when separated from that liner than an analogous composition which does not contain the resin.

Abstract: The present invention relates to a method for the preparation of tertiary-hydrocarbylsilyl compounds through a Grignard reaction. A Grignard reagent of formula RMgX, in which R is a tertiary-hydrocarbyl group and X is a halogen atom, is reacted with a silicon compound of formula R.sup.1.sub.a SiX.sub.4-a ; where R.sup.1 is a substituted or unsubstituted monovalent hydrocarbon group and a is an integer with a value of zero to three. The process is ran in the presence of a catalytic quantity of a cyano compound or a thiocyanate compound.

Abstract: Alkali-soluble organopolysiloxanes useful in the alkali-developing resist materials for use in microprocesses in LSI device fabrication have the following general formula ##STR1## where A is a hydroxyphenyl group; R is an alkylene group having 1 to 4 carbon atoms; n is zero or one; R.sup.1 is an alkyl group having 1 to 4 carbon atoms; x and z are positive numbers; y is zero or a positive number; x, y, and z have values such that their ratios are 0.3.ltoreq.(x+y)/z.ltoreq.4; and zero.ltoreq.y/x.ltoreq.5.

Abstract: Beta-substituted allylsilanes are synthesized in a one-step process from readily available starting materials by the reaction of a specific carboxylic acid ester or acid anhydride with a specific alkoxy group-containing Grignard reagent in an organic solvent. The resulting allylsilanes are useful as allyl transfer reagents for electrophilic reagents such as ketones, carboxylic acid chlorides, etc.

Abstract: An epoxy group-containing disilazane having the formula, ##STR1## wherein A is ##STR2## is described. Also described is a process for producing the epoxy group-containing disilazane. The process comprises reacting a disilazane having the formula, ##STR3## with an epoxy compound selected from a group consisting of allyl glycidyl ether and vinylcyclohexene oxide in the presence of a platinum-type catalyst.

Abstract: A method for the production of tertiary-alkyldimethylhalosilane with the following general structural formula ##STR1## which comprises reacting a silicon compound having the general structural formula(CH.sub.3).sub.3 SiCR.sub.2 X.sup.1,with a Lewis acid metal halide.