Patents by Inventor Akihiko Watanabe

Akihiko Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5830258
    Abstract: A method of recovering resources in a resin-molded electrical rotating device (1,2) in which electromagnetic members (1a,1b,2a) are molded with resin molding (1c,2c) with fine voids so as to be integrally made into a solid body, and a resin for molding of the rotating device (1,2). The method has the steps of disintegrating the resin molding (1c,2c) by chemically decomposing and/or eluting so as to remove the resin molding (1c,2c) from the electromagnetic members (1a,1b,2a) and separating and recovering at least metal components in the electromagnetic members (1a,1b,2a) as the resources.
    Type: Grant
    Filed: June 12, 1996
    Date of Patent: November 3, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Fumitoshi Yamashita, Seiji Kurozumi, Junko Kaneko, Akihiko Watanabe, Hiroshi Ohnishi, Takahiko Terada, Yoshikazu Yamagata
  • Patent number: 5824410
    Abstract: A fiber reinforced thermoplastic resin structure comprising a thermoplastic resin and reinforcing fibers, having a ratio (Lw/Ln) of the number average fiber length (Ln) to the weight average fiber length (Lw) of the uniformly dispersed reinforcing fibers of 1.1 to 5, and having a weight average fiber length of 1.0 mm to 200 mm.
    Type: Grant
    Filed: May 16, 1997
    Date of Patent: October 20, 1998
    Assignee: Toray Industries, Inc.
    Inventors: Hidetoshi Sakai, Motoki Hiratsuka, Akihiko Watanabe, Motonobu Yamada
  • Patent number: 5725785
    Abstract: A method of manufacturing an accelerometer sensor having a mass portion is disclosed. A P-type silicon area is formed in an upper area of a P-type silicon substrate by means of impurity doping. An N-type silicon layer is formed on the silicon substrate through vapor phase epitaxy. A recess defining the mass portion is formed in the silicon substrate through an etching process. A current is supplied to the silicon substrate in an electrolytic solution, such as HF aq., while the substrate is connected to an anode of a power supply. The P-type silicon area is then converted to a porous silicon area. The porous silicon area is subjected to a wet etching to be hollowed, thus obtaining a mass portion of a desired shape.
    Type: Grant
    Filed: February 21, 1996
    Date of Patent: March 10, 1998
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Tatsuya Ishida, Akihiko Watanabe
  • Patent number: 5679456
    Abstract: A fiber reinforced thermoplastic resin structure comprising a thermoplastic resin and reinforcing fibers, having a ratio (Lw/Ln) of the number average fiber length (Ln) to the weight average fiber length (Lw) of the uniformly dispersed reinforcing fibers of 1.1 to 5, and having a weight average fiber length of 1.0 mm to 200 mm as well as a process and extruder for the production thereof.
    Type: Grant
    Filed: July 19, 1994
    Date of Patent: October 21, 1997
    Assignee: Toray Industries, Inc.
    Inventors: Hidetoshi Sakai, Motoki Hiratsuka, Akihiko Watanabe, Motonobu Yamada
  • Patent number: 5402024
    Abstract: With a view to reduce vibrations generated by a motor and improve resistance to heat, reliability and vibration isolation properties without increasing the cost or the number of manufacturing steps in a rotor for a permanent-magnet motor, a rotor core is formed of an outer peripheral portion by which the permanent magnet is fixed, and a central portion by which a shaft is fixed, a clearance is provided between the outer peripheral portion and the central portion, and the outer peripheral portion is connected to the central portion by means of a plurality of fastening members. Thus, a rotor having excellent vibration isolation properties can be obtained. Since the rotor core is formed of laminated iron plates on which the outer peripheral portion, the central portion and the fastening members are all formed as one piece, resistance to heat, reliability and the vibration isolation properties can be enhanced without increasing the cost or the number of manufacturing steps.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: March 28, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiko Watanabe, Sotomitsu Maeda, Hiroshi Dohi, Muneo Yamamoto, Yukio Honda, Hiromitsu Nakano, Masahiro Yasohara, Hisataka Kato
  • Patent number: 5282503
    Abstract: An anti-skid device for use on pneumatic tires of an automotive vehicle includes a supporting ring rotatably provided on the outer circumferential periphery of a mounting plate that is detachably mounted on the wheel portion of the automotive vehicle, a plurality of ribs formed from a material having elasticity and toughness that are provided on the supporting ring in a radial fashion and are bent so as to extend from the outer side of a pneumatic tire to a tread thereof, first and second endless bands provided on the leading-end portion of each of the ribs in such a manner as to be located within the width of the tread of said pneumatic tire, rivets secured at portions where the first and second bands intersect the ribs, and a counter-measure provided on either of the first and second bands for preventing an imbalance in the degree of stretch between the first and second bands.
    Type: Grant
    Filed: March 3, 1992
    Date of Patent: February 1, 1994
    Assignees: Sumitomo Wiring System, Ltd., Masaki Koshi
    Inventors: Masaki Koshi, Shouji Yamada, Akihiko Watanabe, Kouji Nemoto
  • Patent number: 5149477
    Abstract: A process for producing resin bonded magnet structures is disclosed which includes the steps of: (a) adding a solid epoxy resin of at least one epoxy oligomer and a microcapsule which contains at least one liquid epoxy resin to a melt spun powder of a rare earth element-iron alloy to form a granulated intermediate material, wherein the epoxy oligomer has alcoholic hydroxyl groups in the molecular chain thereof and the solid epoxy resin has a softening temperature (Durran's melting point) of 65.degree. C. to 85.degree. C.; (b) mixing the granulated intermediate material with a powdered curing agent and a lubricant to form a compound; (c) forming a green body of a resin bonded magnet by compressing the compound, and then integrating the green body directly with a supporting member; and (d) curing the solid and liquid epoxy resins in the green body by application of heat to form a rigid structure of the resin bonded magnet integrated with the supporting member.
    Type: Grant
    Filed: February 21, 1992
    Date of Patent: September 22, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Fumitoshi Yamashita, Akihiko Watanabe, Masami Wada
  • Patent number: 5147479
    Abstract: An anti-skid device for use on pneumatic tires of an automotive vehicle includes a supporting ring rotatably provided on the outer circumferential periphery of a mounting plate that is detachably mounted on the wheel portion of the automotive vehicle, a plurality of ribs formed from a material having elasticity and toughness that are provided on the supporting ring in a radial fashion and are bent so as to extend from the outer side of a pneumatic tire to a tread thereof, first and second endless bands provided on the leading-end portion of each of the ribs in such a manner as to be located within the width of the tread of said pneumatic tire, rivets secured at portions where the first and second bands intersect the ribs, and a counter-measure provided on either of the first and second bands for preventing an imbalance in the degree of stretch between the first and second bands.
    Type: Grant
    Filed: December 27, 1990
    Date of Patent: September 15, 1992
    Assignees: Sumitomo Wiring System, Ltd., Masaki Koshi
    Inventors: Masaki Koshi, Shouji Yamada, Akihiko Watanabe, Kouji Nemoto
  • Patent number: 5117388
    Abstract: A semiconductor memory comprises a memory cell array which includes a plurality of memory cells respectively connected to one of a plurality of word lines and to one of a plurality of bit lines, a serial data register which includes a number of bit cells corresponding to one word of the memory cell array, a decoder for decoding an address signal and for successively making an access to each bit cell of the serial data register based on a decoded result, a register group comprising m+1 shift registers in correspondence with each digit of the address signal, where each of the shift registers comprise n registers which are connected to form a loop and m and n are integers satisfying m.gtoreq.
    Type: Grant
    Filed: September 18, 1991
    Date of Patent: May 26, 1992
    Assignees: Fujitsu Limited, Fujitsu VLSI Limited
    Inventors: Masao Nakano, Satoru Kawamoto, Akihiko Watanabe
  • Patent number: 5104707
    Abstract: A transfer sheet for making a printed-wiring board by injection molding which is free from circuit damage during injection molding and has excellent releasability comprises a carrier film, a copper foil circuit, and a releasing layer provided between the carrier film and the copper foil circuit. Preferably, said releasing layer has a T-type peeling strength between the carrier film and the copper foil circuit of 0.025-0.25 kg/25 mm. A method for producing such transfer sheet comprises coating a releasing layer on a carrier film, then contact-bonding a copper foil thereto with heat, pattern-printing an etching resist on the resulting laminate film, and subjecting it to etching to form a copper foil circuit.
    Type: Grant
    Filed: June 7, 1990
    Date of Patent: April 14, 1992
    Assignee: Nitto Boseki Co., Ltd.
    Inventors: Akihiko Watanabe, Yuuki Numazaki, Naoto Kanno, Hirokazu Inoguchi
  • Patent number: 5041462
    Abstract: Novel substituted acetamide compounds of the formula ##STR1## wherein R.sup.1 is hydrogen atom, a lower alkyl group, a lower acyl group, or an aryl group; R.sup.2 is cyano group or aminocarbonyl group; R.sup.3 is a halogen atom, nitro group, a lower alkoxy group, a group of the formula: --NR.sup.4 R.sup.5 (wherein R.sup.4 is hydrogen atom, a lower alkyl group or a group of the formula: --COCH.sub.2 OR.sup.1 ; R.sup.5 is hydrogen atom or a lower alkyl group), or a cyclic amino group of the formula: ##STR2## (wherein R.sup.6 and R.sup.7 are each an alkylene group having 1 to 3 carbon atoms, and X is oxygen atom or methylene), or a pharmaceutically acceptable acid addition salt thereof, which have excellent anti-allergic activity and are useful for the prophylaxis and treatment of various allergic diseases, and a pharmaceutical composition containing the amide compound as set forth above as an active ingredient.
    Type: Grant
    Filed: February 7, 1990
    Date of Patent: August 20, 1991
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Hiroaki Taguchi, Takeo Katsushima, Masakazu Ban, Mitsuru Takahashi, Kiyotaka Shinoda, Akihiko Watanabe
  • Patent number: 5036086
    Abstract: Novel benzothiazole derivatives of the formula (I): ##STR1## wherein R.sup.1 is hydrogen atom, a lower alkyl group or a lower acyl group; X and Y are the same or different and are each hydrogen atom, a halogen atom, a lower alkyl group, a lower alkoxy group, nitro group, amino group, cyano group, trifluoromethyl group, a group of the formula: --COOR.sup.2 (wherein R.sup.2 is hydrogen atom, a lower alkyl group, an alkali metal, an alkaline earth metal, or a cation of amine), or a group of the formula: --CONR.sup.3 R.sup.4 (wherein R.sup.3 and R.sup.4 are the same or different and are each hydrogen atom or a lower alkyl group) or a pharmaceutically acceptable acid addition salt thereof, which have excellent anti-allergic activity and are useful for the prophylaxis and treatment of various allergic diseases, and a pharmaceutical composition containing the compound as set forth above as an active ingredient.
    Type: Grant
    Filed: March 30, 1990
    Date of Patent: July 30, 1991
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Hiroaki Taguchi, Takeo Katsushima, Masakazu Ban, Mitsuru Takahashi, Kiyotaka Shinoda, Akihiko Watanabe
  • Patent number: 5022922
    Abstract: A novel silane coupling agent is proposed for the pretreatment of a glass fiber-based or mica flake-based inorganic reinforcing material prior to compounding with an epoxy resin or a polyimide resin as the matrix to give a composite material such as laminates having excellent heat resistance against molten solder alloy and resistance against heat shock. The principal ingredient of the treatment solution is a trialkoxysilylalkyl-substituted polymethylene diamine compound of the general formula (R.sup.1 O).sub.3 SiR.sup.2 NH(CH.sub.2).sub.n NHCH.sub.2 C.sub.6 H.sub.5, in which R.sup.1 is a methyl or ethyl group, R.sup.2 is a diavalent hydrocarbon group having 1 to 6 carbon atoms, e.g., methylene and propylene, and n is an integer of 4 to 8, or a hydrochloride thereof. This diamine compound is soluble in water, in particular, acidified with acetic acid and the aqueous solution is advantageously stable in storage as compared with conventional silane coupling agents.
    Type: Grant
    Filed: May 29, 1990
    Date of Patent: June 11, 1991
    Assignees: Shin-Etsu Chemical Co., Ltd., Nitto Boseki Co., Ltd.
    Inventors: Akinari Itagaki, Masaaki Yamaya, Hiroshi Yoshioka, Akihiko Watanabe, Keita Miyazato
  • Patent number: 5018110
    Abstract: A semiconductor memory includes a random access memory (RAM) and a serial access memory (SAM). The RAM includes a memory cell array including memory cells.
    Type: Grant
    Filed: September 14, 1989
    Date of Patent: May 21, 1991
    Assignees: Fujitsu Limited, Fujitsu VLSI Limited
    Inventors: Tsutomu Sugiyama, Akihiko Watanabe
  • Patent number: 4943452
    Abstract: A novel silane coupling agent is proposed for the pretreatment of a glass fiber-based or mica flake-based inorganic reinforcing material prior to compounding with an epoxy resin or a polyimide resin as the matrix to give a composite material such as laminates having excellent heat resistance against molten solder alloy and resistance against heat shock. The principal ingredient of the treatment solution is a trialkoxysilylalkyl-substituted polymethylene diamine compound of the general formula (R.sup.1 O).sub.3 SiR.sup.2 NH(CH.sub.2).sub.n NHCH.sub.2 C.sub.6 H.sub.5, in which R.sup.1 is a methyl or ethyl group, R.sup.2 is a diavalent hydrocarbon group having 1 to 6 carbon atoms, e.g., methylene and propylene, and n is a integer of 4 to 8, or a hydrochloride thereof. This diamine compound is soluble in water, in particular, acidified with acetic acid and the aqueous solution is advantageouly stable in storage as compared with conventional silane coupling agents.
    Type: Grant
    Filed: August 15, 1988
    Date of Patent: July 24, 1990
    Assignees: Shin-Etsu Chemical Co., Ltd., Nitto Roseki Co., Ltd.
    Inventors: Akinari Itagaki, Masaaki Yamaya, Hiroshi Yoshioka, Akihiko Watanabe, Keita Miyazato
  • Patent number: 4912135
    Abstract: Novel amide compounds of the formula: ##STR1## wherein R.sup.1 is hydrogen, lower alkyl, acetyl, or propionyl; R.sup.2 is hydrogen or chlorine; R.sup.3 is hydrogen or a group of the formula: --CO.sub.2 R.sup.6 (wherein R.sup.6 is hydrogen, lower alkyl or alkali metal); R.sup.4 is hydrogen, trifluoromethyl, cyano, aminocarbonyl, or a group of the formula: --CO.sub.2 R.sup.7 (wherein R.sup.7 is hydrogen, lower alkyl, or alkali metal); R.sup.5 is hydrogen, or a group of the formula: --CO.sub.2 R.sup.8 (wherein R.sup.8 is hydrogen, lower alkyl, or alkali metal), which have excellent anti-allergic activity and are useful for the prophylaxis and treatment of various allergic diseases, and a pharmaceutical composition containing the amide compound as set forth above as an active ingredient.
    Type: Grant
    Filed: October 27, 1988
    Date of Patent: March 27, 1990
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Hiroaki Taguchi, Takeo Katsushima, Masakazu Ban, Akihiko Watanabe
  • Patent number: 4729995
    Abstract: Novel pyrimidine compounds of the formula: ##STR1## wherein R.sub.1 and R.sub.1 ' are each hydrogen atom, a lower alkyl, benzyl, an alkali metal, or ammonium; R.sub.2 is hydrogen atom, a halogen atom, a lower alkyl, a lower alkoxy, an aryl, a group of the formula: ##STR2## (wherein R.sub.3 and R.sub.4 are each hydrogen atom, a lower alkyl, or an aryl), or a group of the formula: ##STR3## [wherein R.sub.5 and R.sub.6 are each an alkylene having 1 to 3 carbon atoms, and X is oxygen atom, methylene, or a group of the formula: >N-Y (wherein Y is hydrogen atom, a lower alkyl, benzyl, or an aryl)], which have excellent antiallergic activities and are useful for the prophylaxis and treatment of various allergic diseases, and a pharmaceutical composition containing said pyrimidine compound as an active ingredient.
    Type: Grant
    Filed: April 3, 1987
    Date of Patent: March 8, 1988
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Hiroaki Taguchi, Takeo Katsushima, Masakazu Ban, Shoichi Aoki, Akihiko Watanabe