Patents by Inventor Akihiro Endo

Akihiro Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240422944
    Abstract: A cover for a heat generating electronic component including a hollow structure having one or more openings for inserting an electronic circuit component, wherein an inner wall surface of the hollow structure has one or more protrusion portions. Thereby, a cover for a heat generating electronic component that can prevent detachment of the electronic component is provided.
    Type: Application
    Filed: October 26, 2022
    Publication date: December 19, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yuuki SAKURAI, Junichi TSUKADA, Akihiro ENDO, Ryoichi SUMIYOSHI
  • Publication number: 20240392160
    Abstract: A thermally conductive film including: a silicone resin at 100 parts by mass, the silicone resin being one or more selected from: DmT?pDVin, wherein D represents a siloxane unit represented by (CH3)2SiO2/2, T? represents a siloxane unit represented by (C6H5)SiO3/2, DVi represents a siloxane unit represented by (CH3)(CH2?CH)SiO2/2, “m” represents an integer of 35 to 55, “n” represents an integer of 30 to 60, and “p” represents an integer of 40 to 70; or MLDxT?q DViy, wherein M represents (CH3)3SiO1/2, L represents an integer of 10 to 30, “x” represents an integer of 15 to 35, “y” represents an integer of 40 to 60, and “q” represents an integer of 45 to 55, the silicone resin having non-flowability at 25° C.; a wax having a melting point of 20 to 60° C. at 5 to 300 parts by mass; and a thermally conductive filler at 1,000 to 6,000 parts by mass.
    Type: Application
    Filed: August 23, 2022
    Publication date: November 28, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yasuhisa ISHIHARA, Emi AKABANE, Akihiro ENDO
  • Publication number: 20240316910
    Abstract: The present invention provides: a thermally conductive sheet product wherein both surfaces of a fluorine rubber-based thermally conductive sheet are protected from foreign substances and the like, and excellent setting workability is achieved between a heat generation member and a heat dissipation member; and a method for producing this thermally conductive sheet product.
    Type: Application
    Filed: July 4, 2022
    Publication date: September 26, 2024
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hidenori KOSHIKAWA, Akihiro ENDO
  • Publication number: 20240218150
    Abstract: [Problem] One object of the present invention is to provide a thermally conductive silicone composition in which an increase in viscosity is suppressed when a thermally conductive filler is filled with a high amount level, and a thermally conductive silicone cured product having good thermal conductivity and excellent handling properties. [Solution] A thermally conductive silicone composition comprising the following components (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom: 100 parts by mass; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom to the number of the alkenyl group in component (A) is 0.1 to 2; (C) a thermally conductive filler: 4,000 to 7,000 parts by mass; (D) a platinum group metal-based catalyst: a catalyst amount; (E) an addition reaction control agent: 0.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 4, 2024
    Inventors: Takanori Ito, Megumi Miyano, Junichi Tsukada, Yasuhisa Ishihara, Akihiro Endo, Yuya Hironaka
  • Publication number: 20240199934
    Abstract: A thermally conductive composite sheet, includes: a thermally conductive sheet containing an organopolysiloxane elastomer and a thermally conductive filler, and having an Asker C hardness of 30 or less, surface tack force of 30 gf or more, a thickness of 0.3 mm or more, and a thermal conductivity of 0.8 W/mK or more; and an insulative resin film having a thickness of 10 ?m or more and 50 ?m or less and an elastic modulus of 1 GPa or more, wherein the insulative resin film is laminated on one side of the thermally conductive sheet. The thermally conductive composite sheet has high surface slidability so that a heat-generating electronic component can be easily mounted thereon, and also has excellent thermal conductivity.
    Type: Application
    Filed: February 22, 2022
    Publication date: June 20, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yasuhisa ISHIHARA, Akihiro ENDO, Masahiro YODA
  • Publication number: 20240002663
    Abstract: An anti-fouling silicone composite sheet including: a substrate layer containing a fluororesin; and a silicone adhesive layer stacked on one surface of the substrate layer, having a hardness of 5 or less as measured with an Asker C hardness tester, and having an adhesive force with respect to a mortar test piece of 5 N/25 mm or more, wherein the substrate layer has a surface on which the silicone adhesive layer is stacked and the other surface is an anti-fouling surface. By the above configuration, the present invention provides an anti-fouling silicone composite sheet capable of exhibiting anti-fouling performance, washability, easiness of washing, and wear resistance stably for a long period, easily attachable to an adherend, and conformable even to cracking and shifting on the application surface; and a method for performing a prevention of graffiti by using the anti-fouling silicone composite sheet.
    Type: Application
    Filed: November 22, 2021
    Publication date: January 4, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keiji IMAIZUMI, Akihiro ENDO, Masaki MOTEKI
  • Publication number: 20230144516
    Abstract: An anti-fouling silicone composite sheet includes a substrate layer, and a silicone adhesive layer stacked on one surface of the substrate layer, and has a hardness of 5 or less measured with an Asker C hardness tester and an adhesive force of 5 N/25 mm or more with respect to a mortar test piece, in which a surface of the substrate layer which is located on a side opposite to the surface where the silicone adhesive layer is stacked is a surface anti-fouling-treated with a silicone hard coating agent containing a fluorine-containing silicone compound. An anti-fouling silicone composite sheet is capable of exhibiting anti-fouling performance and washability stably for a long period, easily attachable to an adherend, and followable even to cracking and shifting on the application surface; and a method for preventing graffiti by using the anti-fouling silicone composite sheet.
    Type: Application
    Filed: February 10, 2021
    Publication date: May 11, 2023
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro ENDO, Keiji IMAIZUMI, Masahiro YODA
  • Patent number: 11608419
    Abstract: A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: March 21, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro Endo, Yasuhisa Ishihara, Hisaharu Yamaguchi, Masahiro Moteki
  • Publication number: 20230047058
    Abstract: One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.
    Type: Application
    Filed: December 8, 2020
    Publication date: February 16, 2023
    Inventors: Takanori Ito, Akihiro Endo, Junichi Tsukada
  • Publication number: 20220403113
    Abstract: Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an organohydrogenpolysiloxane having, per each molecule, at least two hydrogen atoms directly bonded to silicon atoms; (C) a thermally conductive filler containing magnesium oxide (20 to 40% by mass), aluminum oxide (40 to 60% by mass) and aluminum hydroxide (10 to 30% by mass); (D) a dimethylpolysiloxane with one end of the molecular chain thereof being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent.
    Type: Application
    Filed: October 27, 2020
    Publication date: December 22, 2022
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Junichi TSUKADA, Takanori ITO, Akihiro ENDO, Megumi MIYANO
  • Publication number: 20220234335
    Abstract: A thermal conductive composite silicone rubber sheet includes a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer with a thickness of 0.5 to 10 ?m on one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an viscosity at 70° C. of 700 Pa·s or lower, where the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and the thermal conductive composite silicone rubber sheet has a thermal resistance lower than a value obtained by adding 0.3 cm2·K/W per one layer of one side of the thermosoftening silicone resin layer to a thermal resistance of the thermal conductive silicone rubber sheet. A thermal conductive composite silicone rubber sheet provided with an adhesive layer on one side of a thermal conductive silicone rubber sheet, makes it possible to impart adhesion without sacrificing thermal conductivity.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 28, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yasuhisa ISHIHARA, Akihiro ENDO
  • Publication number: 20220220354
    Abstract: The present invention is a cured material of a thermal conductive silicone composition, the composition containing: 6 to 40 volume % of an organopolysiloxane as a component (A), and 60 to 94 volume % of a heat conductive filler as a component (B), the heat conductive filler containing; (B-i) unsintered crushed aluminum nitride having an average particle size of 40 ?m or more and having 1 mass % or less of a fine powder with a particle size of 5 ?m or less, and (B-ii) a heat conductive material other than the unsintered crushed aluminum nitride having an average particle size of 1 ?m or more, where the component (B-ii) content is 30 to 65 volume %. This provides a cured material of a thermal conductive silicone composition excellent in handling properties and having a high thermal conductivity.
    Type: Application
    Filed: October 30, 2019
    Publication date: July 14, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yasuhisa ISHIHARA, Akihiro ENDO, Katsuyuki TANAKA
  • Publication number: 20220220311
    Abstract: The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member.
    Type: Application
    Filed: April 20, 2020
    Publication date: July 14, 2022
    Inventors: Takanori Ito, Akihiro Endo
  • Patent number: 11359111
    Abstract: Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si—H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: June 14, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takanori Ito, Akihiro Endo, Yuki Tanaka
  • Publication number: 20220127500
    Abstract: One of the purposes of the present invention is to provide a composite heat-release sheet which is excellent in thermal conductivity and electrical insulation property and, at the same time, has all of sufficient adhesion to an actual machine, low thermal resistance, reworkability, and reliable adhesive strength. Another purpose is to provide a more convenient production process for the heat-release sheet.
    Type: Application
    Filed: February 4, 2020
    Publication date: April 28, 2022
    Inventors: Takanori Ito, Akihiro Endo
  • Patent number: 11248154
    Abstract: A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 ?m.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: February 15, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yasuhisa Ishihara, Akihiro Endo
  • Patent number: 11214721
    Abstract: Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressure-sensitive adhesive made of a polymer of a monomer mixture in which 5-50 mol % of hydroxyl group-containing monomers are contained in all of the constituent monomers; and 0.05-5 parts by mass of a chelate-based curing agent with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, and the thermally conductive silicone rubber sheet has a thermally conductive silicone rubber layer which, as a cured product of a thermally conductive silicone composition containing a thermally conductive filler, has a durometer A hardness of 60-96.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: January 4, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takanori Ito, Akihiro Endo, Yasuhisa Ishihara
  • Patent number: 11077647
    Abstract: Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: August 3, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro Endo, Yuki Tanaka
  • Publication number: 20210130561
    Abstract: A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.
    Type: Application
    Filed: January 16, 2018
    Publication date: May 6, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro ENDO, Yasuhisa ISHIHARA, Hisaharu YAMAGUCHI, Masahiro MOTEKI
  • Publication number: 20200354526
    Abstract: Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si—H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.
    Type: Application
    Filed: January 8, 2019
    Publication date: November 12, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takanori ITO, Akihiro ENDO, Yuki TANAKA