Patents by Inventor Akihiro IMAKIIRE

Akihiro IMAKIIRE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Induction machine with localized voltage unbalance compensation
    Patent number: 11863100
    Abstract: An induction machine with localized voltage unbalance compensation is disclosed. The use of an induction machine with a voltage unbalance correction compensator (VUC) may be used to maintain proper working conditions of the machine during intervals of voltage unbalance.
    Type: Grant
    Filed: May 10, 2020
    Date of Patent: January 2, 2024
    Assignee: Florida State University Research Foundation, Inc.
    Inventors: Thomas A. Lipo, Akihiro Imakiire
  • INDUCTION MACHINE WITH LOCALIZED VOLTAGE UNBALANCE COMPENSATION
    Publication number: 20230396205
    Abstract: An induction machine with localized voltage unbalance compensation is disclosed. The use of an induction machine with a voltage unbalance correction compensator (VUC) may be used to maintain proper working conditions of the machine during intervals of voltage unbalance.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 7, 2023
    Applicant: Florida State University Research Foundation, Inc.
    Inventors: Thomas A. Lipo, Akihiro Imakiire
  • INDUCTION MACHINE WITH LOCALIZED VOLTAGE UNBALANCE COMPENSATION
    Publication number: 20200373871
    Abstract: An induction machine with localized voltage unbalance compensation is disclosed. The use of an induction machine with a voltage unbalance correction compensator (VUC) may be used to maintain proper working conditions of the machine during intervals of voltage unbalance.
    Type: Application
    Filed: May 10, 2020
    Publication date: November 26, 2020
    Inventors: Thomas A. Lipo, Akihiro Imakiire
  • SEMICONDUCTOR DEVICE
    Publication number: 20190229103
    Abstract: A semiconductor device includes: a first switching element that is provided on a high side; a first diode element that is connected in parallel to the first switching element; a second switching element that is provide on a low side and connected in series to the first switching element; and a second diode element that is connected in parallel to the second switching element, wherein the first switching element and one of the first diode element and the second diode element are stacked adjacently to each other in a vertical direction of respective electrode surfaces thereof via a conductive electrode, the second switching element and the other of the first diode element and the second diode element that is different from the diode element adjacent to the first switching element are stacked adjacently to each other in a vertical direction of respective electrode surfaces thereof via a conductive electrode, and the first switching element and the second switching element are not adjacent in a vertical direction
    Type: Application
    Filed: January 25, 2019
    Publication date: July 25, 2019
    Applicants: WASEDA UNIVERSITY, MITSUI HIGH-TEC., INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kohei TATSUMI, Kazuhito KAMEI, Rikiya Kamimura, Koji SHIMIZU, Kazutoshi UEDA, Nobuaki SATO, Keiji TODA, Masayuki HIKITA, Akihiro IMAKIIRE
  • Semiconductor chip temperature estimation device and overheat protection device
    Patent number: 10156482
    Abstract: A semiconductor chip temperature estimation device that estimates the temperature of a semiconductor chip incorporated together with a thermistor in a semiconductor module includes a first estimation unit which calculates a first estimation value of a chip loss of the chip, a memory which stores in advance a correlation between a temperature rise of the temperature sensor and the chip loss of the chip, a second estimation unit which calculates a second estimation value of the temperature rise of the temperature sensor, and a third estimation unit which calculates a third estimation value of the temperature of the cooling element. The temperature of the semiconductor chip is estimated by using the third estimation value as a base temperature.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: December 18, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Akihiro Imakiire, Akihiro Odaka, Shinichiro Adachi
  • SEMICONDUCTOR CHIP TEMPERATURE ESTIMATION DEVICE AND OVERHEAT PROTECTION DEVICE
    Publication number: 20150211938
    Abstract: A semiconductor chip temperature estimation device that estimates the temperature of a semiconductor chip incorporated together with a thermistor in a semiconductor module includes a first estimation unit which calculates a first estimation value of a chip loss of the chip, a memory which stores in advance a correlation between a temperature rise of the temperature sensor and the chip loss of the chip, a second estimation unit which calculates a second estimation value of the temperature rise of the temperature sensor, and a third estimation unit which calculates a third estimation value of the temperature of the cooling element. The temperature of the semiconductor chip is estimated by using the third estimation value as a base temperature.
    Type: Application
    Filed: April 6, 2015
    Publication date: July 30, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Akihiro IMAKIIRE, Akihiro ODAKA, Shinichiro ADACHI