Abstract: A pipe joint includes a joint main body comprising a nipple disposed in such a manner that a distal end is directed to one side in an axial direction and a hose clamp holding portion provided at a proximal end of the nipple and configured to be brought into abutment with an inner circumferential surface of a hose clamp which is biased in a diametrically narrowing direction so as to hold the hose clamp in a diametrically expanded state.

Abstract: In order to support input of commands efficiently, a program-creation supporting device stores a first command and a second command that follows the first command in association with each other in a command database unit, stores a last command input from a user in a previous-command storage unit, searches for the first command in the command database unit by using a command stored in the command storage unit as a search key, in a waiting state for waiting for an input of a new command from the user to extract a second command corresponding to the command stored in the command storage unit, and displays the extracted second commands in a list format on a display screen.

Abstract: An improved structure of an optical information code reader which is compact in size and may be manufactured at low costs. The code reader includes an optical mechanism disposed to define an optical path along which a return of light from an information code travels from a window formed in a reader body to an optical sensor. The optical mechanism including a plurality of reflecting mirrors arranged to reverse orientation of the optical path between the window and the optical sensor, thereby resulting in a decrease in length of the optical mechanism which allows the overall size of the code reader to be decreased. The reader body is so designed as to enable different types of optical units and different types of head covers to be mounted selectively, thereby allowing different types of code readers to be manufactured at low costs.

Abstract: A method of encapsulating a semiconductor comprising encapsulating a semiconductor in a curable epoxy resin composition comprising a liquid epoxy resin, an inorganic filler, an onium salt compound and an internal releasing agent, and substantially not containing a hardener, and then molding the above composition.

Abstract: A method of forming small through-holes in a thin metal layer including the steps of forming resist films having openings formed in accordance with a predetermined pattern; etching one or both sides of the thin metal plate and stopping etching before through-holes are formed; removing the overhang of the resist film by spraying high pressure fluid onto the etched side of the thin metal plate; covering the surface by an etch-resisting layer; forming through-holes by etching the side not covered; and stripping the etch-resisting layer and the resist film.