Patents by Inventor Akihiro Kimura

Akihiro Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
    Patent number: 10163760
    Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: December 25, 2018
    Assignee: Rohm Co., Ltd.
    Inventor: Akihiro Kimura
  • Fuel supply device
    Patent number: 10094344
    Abstract: A fuel supply device has a module installed in a fuel tank. The module has a cap and a support pillar arranged between the cap and a bottom of the fuel tank. The support pillar supports a suction filter and a level sensor to use the bottom of the fuel tank as a base point for defining proper positions. The cap supports a valve relevant to ventilation of the fuel tank. The valve is supported by a base portion. The valve is positioned in the support pillar. The valve and the support pillar are arranged to overlap each other along the height direction. Various components are arranged in the small cap.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: October 9, 2018
    Assignee: Kyosan Denki Co., Ltd.
    Inventors: Akihiro Ishitoya, Akihiro Kimura
  • MEMORY SYSTEM
    Publication number: 20180267596
    Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.
    Type: Application
    Filed: May 18, 2018
    Publication date: September 20, 2018
    Inventors: Akihiro KIMURA, Hiroki MATSUSHITA
  • Fuel supply device
    Patent number: 10060398
    Abstract: A fuel supply device has a module installed in a fuel tank. The module has a cap and a support pillar arranged between the cap and a bottom of the fuel tank. The support pillar supports a suction filter and a level sensor to use the bottom of the fuel tank as a base point for defining proper positions. The cap supports a valve relevant to ventilation of the fuel tank. The valve is supported by a base portion. The valve is positioned in the support pillar. The valve and the support pillar are arranged to overlap each other along the height direction. Various components are arranged in the small cap.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: August 28, 2018
    Assignee: Kyosan Denki Co., Ltd.
    Inventors: Akihiro Ishitoya, Akihiro Kimura
  • NONWOVEN FABRIC AND ABSORBENT ARTICLE USING SAME
    Publication number: 20180177645
    Abstract: A nonwoven fabric has: a base section that is spread in a flat manner and that comprises a first surface and a second surface opposite each other; and a plurality of protrusions that protrude from the first surface of the base section in the thickness direction. Each of the protrusions is provided with a peripheral surface section that rises from the first surface of the base section in the thickness direction and a peak surface section comprising a peak surface formed on the vertex of the protrusion. The fiber density of the peripheral surface section is higher than the fiber density of the peak surface section. At least part of a peak surface peripheral edge part of the peak surface section is configured as a thickest section having the thickest thickness of the nonwoven fabric.
    Type: Application
    Filed: June 7, 2016
    Publication date: June 28, 2018
    Inventors: Akihiro KIMURA, Ko DETANI, Noritomo KURITA
  • Memory system and management table
    Patent number: 9996139
    Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: June 12, 2018
    Assignee: Toshiba Memory Corporation
    Inventors: Akihiro Kimura, Hiroki Matsushita
  • SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
    Publication number: 20180130724
    Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 10, 2018
    Inventor: Akihiro KIMURA
  • ELECTRIC POWER CHARGE AND DISCHARGE SYSTEM
    Publication number: 20180090976
    Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.
    Type: Application
    Filed: November 27, 2017
    Publication date: March 29, 2018
    Inventors: Shuhei NAGATSUKA, Akihiro KIMURA
  • Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
    Patent number: 9892996
    Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: February 13, 2018
    Assignee: Rohm Co., Ltd.
    Inventor: Akihiro Kimura
  • SLIDE RAIL DEVICE FOR VEHICLE
    Publication number: 20180009336
    Abstract: In a slide rail device for use in a vehicle , a lock spring support portion of an upper rail includes an upward-downward movement restriction support portion. The upward-downward movement restriction support portion includes an open holding portion which is open at a top thereof and holds a supported portion of a lock spring and an uplift prevention projection which is formed projecting into the open holding portion so as to overlap the supported portion of the lock spring, which is held by the open holding portion, in the upward and downward directions.
    Type: Application
    Filed: July 3, 2017
    Publication date: January 11, 2018
    Applicant: SHIROKI CORPORATION
    Inventor: Akihiro KIMURA
  • SLIDE RAIL DEVICE FOR VEHICLE
    Publication number: 20180009337
    Abstract: In a slide rail device for use in a vehicle, a lock control member comprises a pair of facing walls which face a pair of side walls of an upper rail and extend in upward and downward direction, and a pair of anti-rattle projections which project from the pair of facing walls toward the pair of side walls of the upper rail.
    Type: Application
    Filed: July 3, 2017
    Publication date: January 11, 2018
    Applicant: SHIROKI CORPORATION
    Inventors: Akihiro KIMURA, Naoki HAYASHI
  • SEMICONDUCTOR DEVICE
    Publication number: 20180005981
    Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.
    Type: Application
    Filed: September 18, 2017
    Publication date: January 4, 2018
    Applicant: ROHM CO., LTD.
    Inventors: Motoharu HAGA, Shingo YOSHIDA, Yasumasa KASUYA, Toichi NAGAHARA, Akihiro KIMURA, Kenji FUJII
  • Semiconductor device and method for manufacturing the same
    Patent number: 9859194
    Abstract: A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: January 2, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Tsunemori Yamaguchi
  • Electric power charge and discharge system
    Patent number: 9831707
    Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 28, 2017
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shuhei Nagatsuka, Akihiro Kimura
  • Dynamic pressure bearing apparatus and fan
    Patent number: 9822787
    Abstract: A dynamic pressure bearing apparatus includes a bearing portion, a shaft, a radial dynamic pressure bearing portion, and a seal gap. An annular member arranged in an annular shape, fixed to the shaft axially between the seal portion and the attachment surface, and arranged to extend radially outward beyond an opening of the seal gap. A minute horizontal gap extending radially is defined between an upper surface of the bearing portion and a lower surface of the annular member. The seal gap is arranged to be in communication with an exterior space through the horizontal gap.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: November 21, 2017
    Assignee: NIDEC CORPORATION
    Inventors: Tomotsugu Sugiyama, Teiichi Hirono, Shinichiro Noda, Akihiro Kimura, Yoshiharu Ikegami, Tomohiro Hasegawa, Masafumi Fujimoto, Tomohiro Yoneda
  • Fuel supply device
    Patent number: 9803594
    Abstract: The fuel supply device has a module installed in a fuel tank. The module has a cap and a support pillar arranged between the cap and a bottom of the fuel tank. The cap is supporting a valve relevant to ventilation of the fuel tank. The valve is supported by a base portion. The base portion and a large diameter part are connected by snap-fit mechanisms. The valve and the base portion are connected by snap-fit mechanisms. A hook part is arranged in an engaging window. It is possible to inspect the valve through the engaging window.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: October 31, 2017
    Assignee: Kyosan Denki Co., Ltd.
    Inventors: Akihiro Ishitoya, Akihiro Kimura, Akinari Sugiyama
  • Semiconductor device
    Patent number: 9780069
    Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: October 3, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Motoharu Haga, Shingo Yoshida, Yasumasa Kasuya, Toichi Nagahara, Akihiro Kimura, Kenji Fujii
  • Rotor and dynamo-electric machine having the same
    Patent number: 9735636
    Abstract: Each permanent magnet provided in a rotor includes a projection that projects toward a corresponding predetermined portion of the rotor core. An inner peripheral surface of each permanent magnet, which is radially opposed to the corresponding predetermined portion of the rotor core, includes a primary contacting portion and two primary non-contacting portions. The primary contacting portion contacts the corresponding predetermined portion of the rotor core at a circumferential location, which corresponds to the projection. The primary non-contacting portions do not contact the rotor core and are located on two circumferentially opposite sides, respectively, of the primary contacting portion.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: August 15, 2017
    Assignee: DENSO CORPORATION
    Inventors: Asuka Tanaka, Akihiro Kimura, Jirou Hayashi, Makoto Taniguchi
  • NON-WOVEN FABRIC
    Publication number: 20170226672
    Abstract: The present disclosure relates to a non-woven fabric that is formed from a base part that spreads out in a planar shape and from a plurality of projecting parts that protrude in a thickness direction (Th) from the base part. Each of the projecting parts has a projecting surface part. Each of the projecting surface parts is configured such that the fiber density of the projecting surface part increases toward one side in a prescribed direction that is a surface direction of the non-woven fabric.
    Type: Application
    Filed: June 25, 2015
    Publication date: August 10, 2017
    Inventors: Akihiro KIMURA, Ko DETANI
  • MEMORY SYSTEM
    Publication number: 20170220095
    Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.
    Type: Application
    Filed: April 17, 2017
    Publication date: August 3, 2017
    Inventors: Akihiro KIMURA, Hiroki MATSUSHITA