Abstract: Provided is a resin composition which is excellent in an oxygen-absorbing performance, a resin strength and a resin processability. The oxygen-absorbing resin composition is characterized by containing a polyolefin resin, a transition metal catalyst and a polyamide resin obtained by polycondensation of aromatic diamine and dicarboxylic acid, wherein an end amino group concentration of the above polyamide resin is 30 ?eq/g or less, and a total content of the transition metal catalyst and the polyamide resin is 15 to 60% by weight based on a whole amount of the oxygen-absorbing resin composition.

Abstract: In a resin pipe joint having a configuration where, by a screw advancement of a union nut caused by screwing an internal thread to an external thread in a state where a tube is externally fitted to an inner cylinder to form a flared portion, a flaring changing region is pressed by a seal pressing portion, a torque varying portion in which projecting portions of a joint body and recess portions of the union nut are fitted to or unfitted from each other by a flexural displacements of the projecting portions in the direction of the axis in accordance with fastening rotation of the union nut from the vicinity of a portion in front of an end of the screw advancement, the screw advancement being caused by pressing of the seal pressing portion against the flaring changing region is configured.

Abstract: A resin pipe joint in which, although an economical configuration formed by two components or a joint body and a union nut is employed, both a resistance against pulling and an excellent sealing property can be attained is provided.

Abstract: A resin pipe joint in which, although an economical configuration formed by two components or a joint body and a union nut is employed, both a resistance against pulling and an excellent sealing property can be attained is provided.

Abstract: The structure is improved so that a bearing is disposed in a place other than pump shafts, thereby improving the smoothness of the slide movement of a moving body which is a large structure, and the durability of slide supporting means (bearings or the like) for it.

Abstract: A polarized wave coupling optical isolator comprises a plane-parallel birefringent element for optical path control, which is provided to control an optical path according to a polarizing direction, a plane-parallel birefringent element for coupling and splitting, which is provided with a certain interval from the birefringent element for optical path control to couple lights of different optical paths having polarizing directions set orthogonal to each other, and to split lights of the same optical path, a nonreciprocal portion provided between the birefringent element for optical path control and the birefringent element for coupling and splitting, and constructed by including a combination of 45° Faraday rotator and a linear phasor for rotating a plane of polarization by 45°, two input ports installed on the birefringent element side for optical path control, and an output port installed on the birefringent element side for coupling and splitting.

Abstract: The present invention provides a tin-containing plating bath comprising: (a) a soluble stannous salt, or a mixture of a soluble stannous salt and at least one soluble salt selected from the group consisting of copper salts, bismuth salts, silver salts, indium salts, zinc salts, nickel salts, cobalt salts and antimony salts; and (b) at least one aliphatic sulfonic acid selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids, the aliphatic sulfonic acid being a purified aliphatic sulfonic acid in which the total amount of sulfur-containing compounds as impurities consisting of compound(s) containing one or more sulfur atoms with an oxidation number of +4 or less in the molecule and compound(s) containing one or more sulfur atoms and one or more chlorine atoms in the molecule is a minute amount or less. A tin or tin alloy plating film with excellent reflowability, film appearance, etc. can be formed by the use of this plating bath.

Abstract: A polarized wave coupling optical isolator comprises a plane-parallel birefringent element for optical path control, which is provided to control an optical path according to a polarizing direction, a plane-parallel birefringent element for coupling and splitting, which is provided with a certain interval from the birefringent element for optical path control to couple lights of different optical paths having polarizing directions set orthogonal to each other, and to split lights of the same optical path, a nonreciprocal portion provided between the birefringent element for optical path control and the birefringent element for coupling and splitting, and constructed by including a combination of 45° Faraday rotator and a linear phasor for rotating a plane of polarization by 45°, two input ports installed on the birefringent element side for optical path control, and an output port installed on the birefringent element side for coupling and splitting.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.